The present application relates to a base frame of a substrate carrier, including a first vertical rod and a second vertical rod; a plurality of cross rods, being arranged along the lengthwise direction of the first vertical rod and the second vertical rod, and being connected between the first vertical rod and the second vertical rod; a first vertical rod extension, being connected to an end of the first vertical rod from which a substrate enters; and a second vertical rod extension, being connected to an end of the second vertical rod from which the substrate enters; and the first vertical rod extension and the second vertical rod extension are configured to accommodate at least one set of rollers for conveying the substrate therebetween.

Disclosed are a substrate treating apparatus and a substrate transporting method for the substrate treating apparatus. Two treating blocks are arranged so as not to be stacked, and a first treating block, an ID block, and a second treating block are linearly connected horizontally. Accordingly, the number of treatment layers is increasable while a height of the substrate treating apparatus is suppressed. The first and second treating blocks are each connected to the ID block directly. This enables suppression in step of passing a substrate through a treating block without performing any treatment on the substrate, leading to prevention of decrease in throughput. In addition, a substrate buffer is placed in the middle of the two treating blocks. The two treating blocks enable transportation of substrates W with the substrate buffer. Thus, reduction in footprint of the substrate treating apparatus is obtainable.

Methods and apparatus for a PVD chamber are provided herein. In some embodiments, a selective PVD chamber includes a first housing surrounding a movable substrate support; a second housing adjacent the first housing; an opening disposed between the first housing and the second housing that partially exposes a top surface of the movable substrate support, wherein the opening includes a first curved side; and an elongate target disposed in the second housing to provide a stream of material flux from the elongate target into the first housing via the opening.

A substrate processing apparatus that accommodates a substrate holder in which a substrate is placed in a processing container and forms a film onto the substrate, includes: a film thickness meter that measures a thickness of the film formed on the substrate; a state analysis unit that analyzes variation of the film thickness from a measurement result output from the film thickness meter at a plurality of measurement points where the film thickness on the substrate is measured; a singular point detection unit that, based on the analysis result, detects a measurement point where a difference from an adjacent measurement point deviates from a predetermined condition, as a singular point; and a singular point correction unit that corrects a measurement result of the singular point so that the difference of the film thickness between the singular point and the adjacent measurement point is within a predetermined condition.

Semiconductor substrate adaptor configured to adapt a substrate of a first dimension to a second dimension, such that the substrate can be properly supported by a supporting mechanism (e.g., a wafer cassette) customized for substrates of the second dimension. The substrate adaptor may be made of quartz. The combination of the substrate adaptor and a substrate fitting therein causes no perturbation in various aspects of a semiconductor process. Therefore, the substrate adaptor conveniently enables a substrate of the first dimension to be processed in the same processing equipment and conditions as a substrate of the second dimension. A vertical substrate adaptor may have a semicircular body with a semicircular cutout for accommodating a wafer and can support a wafer vertically. A horizontal substrate adaptor may have a circular body with a circular cutout for accommodating an entire wafer and supporting the wafer horizontally.

An apparatus and a method for performing liquid treatment for a substrate are provided. The apparatus for treating the substrate includes a treating container having a treatment space inside the treating container, a substrate support unit to support a substrate in the treatment space, and a liquid supply unit to supply treatment liquid to the substrate supported by the substrate support unit. The liquid supply unit includes a nozzle, a supply line to supply the treatment liquid to the nozzle and having a first valve mounted in the supply line, and a discharge line branching from a branch point which is a point downstream of the first valve in the supply line to discharge the treatment liquid from the supply line, and having a second valve mounted in the discharge line. A valve is absent in an area between the branch point and the nozzle, in the supply line.

A transportation system for semiconductor module base plates includes a plurality of spacer elements. Each spacer element includes a distance holding element, a first pin on a first side of the distance holding element, and a second pin on a second side of the distance holding element. Each spacer element is configured to be arranged between two of a plurality of semiconductor module base plates. Each of the first pin and the second pin is configured to engage with a corresponding counterpart of one of the semiconductor module base plates when the corresponding spacer element is arranged between two of the semiconductor module base plates.

A vertical wafer boat has an upper boat segment and a lower boat segment, with the upper boat segment configured to removably mount on the lower boat segment, and to receive one or more semiconductor substrates. The lower boat segment includes a top plate, a first set of adiabatic plates, and a second set of adiabatic plates. One or more posts connect the top plate, the first set of adiabatic plates, and the second set of adiabatic plates. The first set of adiabatic plates include a first set of gaps separating a first plurality of sections; the second set of adiabatic plates include a second set of gaps separating a second plurality of sections; and the first set of adiabatic plates and the second set of adiabatic plates are interleaved.

A wafer conveying apparatus conveying a wafer onto a supporting table in manufacturing a semiconductor. A first arm retains the wafer to move to an upper region of the supporting table, and is retracted from the upper region of the supporting table after the wafer is elevated. A second arm contacts the wafer by an opening provided in the supporting table to elevate the wafer, and lowers the wafer to place the wafer on the supporting table.

There is provided a technique that includes forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including: (a) supplying a precursor gas to the substrate in a process container of a substrate processing apparatus via a first pipe made of metal; (b) supplying an oxygen-containing gas to the substrate in the process container via a second pipe made of metal, wherein a fluorine-containing layer is continuously formed on an inner surface of the second pipe; and (c) supplying a nitrogen-and-hydrogen-containing gas to the substrate in the process container via the second pipe.