A substrate boat for use in heat treatment of semiconductor wafers includes support rods and fingers for supporting a substrate in a horizontal orientation in process tools, e.g., furnaces. The substrate is supported in the substrate boat by groups of fingers lying in a common horizontal plane. The fingers contact the substrate at support locations on the back side of the substrate. The fingers have a plurality of different shapes and a substrate surface no contact region.

Provided is a substrate transfer module that constitutes a semiconductor manufacturing apparatus for processing a substrate and transfers the substrate in a transfer space having a vacuum atmosphere, the substrate transfer module comprising: a chamber that defines the transfer space and includes a floor on which a tile is provided, the tile including an electromagnet for forming a magnetic field that acts on a magnet provided on a transfer body for transferring the substrate in the transfer space and moves the transfer body in a levitated state, wherein a coating film is formed on at least a surface of the tile contacting the transfer space to suppress release of contaminants from components that constitute the tile.