H01L21/6733

Electrostatic chuck heater and manufacturing method therefor
12040209 · 2024-07-16 · ·

The present invention relates to an electrostatic chuck heater and a manufacturing method therefor and, more particularly, to an electrostatic chuck heater comprising: a ground electrode; and an electrostatic chuck electrode spaced a predetermined distance apart from the outside of the ground electrode, wherein the heater can reduce the phenomenon of rising of a wafer edge and thus can significantly reduce the temperature deviation according to positions on a heating surface of an object, such as a wafer, so as to increase the temperature uniformity of the heating surface.

Wet bench structure

The present disclosure describes an apparatus for processing one or more objects. The apparatus includes a carrier configured to hold the one or more objects, a tank filled with a processing agent and configured to receive the carrier, and a spinning portion configured to contact the one or more objects and to spin the one or more objects to disturb a flow field of the processing agent.

Apparatus for transporting semiconductor wafers
12308267 · 2025-05-20 · ·

A transport container transports semiconductor wafers. The transport container includes: a mandated 3D printed shape, including a device in a base that is suitable for removing liquid media; and at a surface of the transport container, a coating material configured for protection from chemicals capable of etching the wafers. The coating material is applied by of a low-temperature coating process. The coating material consists of polytetrafluoroethylene, perfluoroalkoxy polymer, or polyvinylidene fluoride. The mandated form of the transport container also includes an integrated workpiece holder for the wafers or carriers for the wafers, configured such that that the wafers to be transported are loadable in standing form. The transport container is configured for a designated transport direction of the transport container in an automatic transport system that runs parallel to a front or rear side of the semiconductor wafers.

SOLAR CELL PREPARATION METHOD, AND COATING CARRIER PLATE FOR SOLAR CELL AND APPLICATION THEREOF
20250386616 · 2025-12-18 ·

The present disclosure discloses a solar cell preparation method, including the following steps: providing a coating carrier plate; and placing, on the coating carrier plate, a wafter to be prepared into the solar cell, and depositing a transparent conductive film on a surface of the wafter, wherein a method for preparing the coating carrier plate include: depositing a metal layer on a carrier plate substrate, and then oxidizing the metal layer to form a metal oxide layer on the metal layer.