Introduced here are carrier assemblies designed to address the limitations of conventional carrier trays. A carrier assembly can comprise a primary injection-molded component having a deck area for receiving semiconductor components and a secondary injection-molded component that is secured to the deck area of the primary injection-molded component. For example, the secondary injection-molded component may be overmolded on the deck area of the primary injection-molded component. The secondary injection-molded component may have a tacky upper surface that facilitates securement of the semiconductor components to the primary injection-molded component.

A tray for carrying a device based on contact limited to edge portions of the device is disclosed. The tray comprises an open frame comprising an outer frame portion, an inner frame portion, and a plurality of fingers, having a central opening, and made of a plastic, and a tacky layer made of a thermoplastic elastomer. The central opening has a central axis. The tacky layer comprises a plurality of tacky layer portions, each covering a finger. Each finger and the tacky layer portion covering each finger extend from the inner frame portion inwardly toward the central axis. The tacky layer portion covering each finger slopes downwardly at an angle of 0.5 to 20 degrees with respect to the upper surface of the inner frame portion. The tray is configured to carry a device on upper surfaces of the tacky layer portions covering two or more of the fingers.

Introduced here are carrier assemblies designed to address the limitations of conventional carrier trays. A carrier assembly can comprise a primary injection-molded component having a deck area for receiving semiconductor components and a secondary injection-molded component that is secured to the deck area of the primary injection-molded component. For example, the secondary injection-molded component may be overmolded on the deck area of the primary injection-molded component. The secondary injection-molded component may have a tacky upper surface that facilitates securement of the semiconductor components to the primary injection-molded component.