In a substrate processing apparatus for supplying a processing liquid onto a lower surface of a substrate being rotated, to thereby process the substrate, provided are an upper support body which is separably placed on a lower support body, a plurality of upper holding members protruding downward from the upper support body, for holding the substrate, and an upper hold-driving part for moving the upper holding members separably from and contactably with an outer edge portion of the substrate. Preferably, the upper hold-driving part moves the upper holding members by using a magnetic action between holding-side magnetic members and an annular driving-side magnetic member.

A reticle enclosure includes a base including a first surface, a cover including a second surface and coupled to the base with the first surface facing the second surface. The base and the cover form an internal space that includes a reticle. The reticle enclosure includes restraining mechanisms arranged in the internal space and for securing the reticle, and structures disposed adjacent the reticle in the internal space. The structures enclose the reticle at least partially, and limit passage of contaminants between the internal space and an external environment of the reticle enclosure. The structures include barriers disposed on the first and second surfaces. In other examples, a padding is installed in gaps between the barriers and the first and second surfaces. In other examples, the structures include wall structures disposed on the first and second surfaces and between the restraining mechanisms.

The instant disclosure discloses a reticle retaining system comprising an inner pod and an outer pod. The inner pod is configured to receive a reticle that includes a first identification feature. The inner pod comprises an inner base having a reticle accommodating region generally at a geometric center thereof and surrounded by a periphery region, and an inner cover configured to establish sealing engagement with the inner base. The inner base has a first observable zone defined in the reticle accommodating region correspondingly arranged to allow observation of the first identification feature. The outer pod is configured to receive the inner base. The outer pod comprises an outer base having a second observable zone defined thereon observably aligned to the first observable zone of the inner pod upon receiving the inner pod, and an outer cover configured to engage the outer base and cover the inner pod.

A reticle carrier described herein is configured to quickly discharge the residual charge on a reticle so as to reduce, minimize, and/or prevent particles in the reticle carrier from being attracted to and/or transferred to the reticle. In particular, the reticle carrier may be configured to provide reduced capacitance between an inner baseplate of the reticle carrier and the reticle. The reduction in capacitance may reduce the resistance-capacitance (RC) time constant for discharging the residual charge on the reticle, which may increase the discharge speed for discharging the residual charge through support pins of the reticle carrier. The increase in discharge speed may reduce the likelihood that an electrostatic force in the reticle carrier may attract particles in the reticle carrier to the reticle. This may reduce pattern defects transferred to substrates that are patterned using the reticle, may increase semiconductor device manufacturing quality and yield, and may reduce scrap and rework of semiconductor devices and/or wafers.

A reticle enclosure includes a base including a first surface, a cover including a second surface and disposed on the base, wherein the base and the cover form an internal space therebetween that includes a reticle, and a layer of electrostatic discharge material disposed on the first surface, wherein the electrostatic discharge material reduces electrostatic charges on the reticle.

A carrier includes a jig and a case. The jig is configured to hold at least one consumable to be loaded into or unloaded from a container. The case is configured to store the jig and the consumable held by the jig.

A wafer holder includes a holding base having a circular holding surface, including, on a side of the holding surface, an annular first groove and an annular second groove that is surrounded by the first groove, and internally including a plurality of first suction holes opening in a region located between the first groove and the second groove on the holding surface, a plurality of second suction holes opening in a region surrounded by the second groove on the holding surface, and a suction channel communicating to the first suction holes and the second suction holes and opening in a back surface on a side opposite to the holding surface. The first suction holes and the second section holes are configured in such a manner that the first suction holes each have a pressure loss greater than that at each of the second suction holes.

Provided is a quick-release valve including: a quick-release member having a collar detachably coupled to a bottom opening of a base; and a sleeve having a flow passage for allowing a gas to enter or exit a substrate container. The collar has a pair of ear portions extending outward therefrom along a diameter direction and a handle extending outward therefrom along a radius direction. The ear portions are at a height substantially different from the handle.

An apparatus for controlling the temperature of a substrate is equipped with a plate-type main body having a substrate placement area, a first temperature-control device for controlling the temperature of the main body using a first temperature-control fluid, having a first plurality of separate annular channels inside the main body, a second temperature-control device for controlling the temperature of the main body using a second temperature-control fluid, having a second plurality of separate annular channels inside the main body, wherein the first temperature-control fluid is supplied to the first plurality of annular channels through a first tube and removed therefrom through a second tube, wherein the second temperature-control fluid is supplied to the second plurality of annular channels through a third tube and removed therefrom through a fourth tube, wherein the main body has a first to fourth hole that communicate with the first plurality of separate annular channels and the second plurality of separate annular channels, wherein the first to fourth tubes are placed in the first to fourth holes of the main body.

A substrate container including substrate supports, such as concentric rings, adapted to receive substrates in a substrate stack. The container includes a base and a top cover to enclose the substrate stack. A latching mechanism is adapted to latch the top cover to the base and secure the substrate stack within the container. The latching mechanism includes resilient corner flanges on an outside portion of the container, the flanges acting as springs to exert a biasing force on the cover and on the substrate stack. The flanges hold the stack within the container while accommodating stack-up uncertainty caused by the accumulation of uncertainties due to component machining tolerances. In some embodiments, a gap is created between a side wall of the top cover and the base of the container to assure compression of the substrate stack. Deflection limiters may be implemented to prevent over-deflection of the flanges.