A reticle storage device includes a top lid having a ceiling and a cover surrounding the ceiling, and a bottom lid having a carrier and a peripheral structure surrounding the carrier. When the top lid engages with the bottom lid, a passage is defined therebetween and therefore the reticle storage device is not sealed.

An apparatus for controlling the temperature of a substrate is equipped with a plate-type main body having a substrate placement area, a first temperature-control device for controlling the temperature of the main body using a first temperature-control fluid, having a first plurality of separate annular channels inside the main body a second temperature-control device for controlling the temperature of the main body using a second temperature-control fluid, having a second plurality of separate annular channels inside the main body, wherein the first temperature-control fluid is supplied to the first plurality of annular channels through a first tube and removed therefrom through a second tube, wherein the second temperature-control fluid is supplied to the second plurality of annular channels through a third tube and removed therefrom through a fourth tube, wherein the main body has a first to fourth hole that communicate with the first plurality of separate annular channels and the second plurality of separate annular channels, wherein the first to fourth tubes are placed in the first to fourth holes of the main body.

Disclosed are reticle management methods and semiconductor device fabrication methods. The reticle management method includes inspecting a reticle using a first inspection method, inspecting a reticle pod storing the reticle using a second inspection method different from the first inspection method, and cleaning the reticle pod when a particle is present on the reticle pod.

Self-contained metrology wafer carrier systems and methods of measuring one or more characteristics of semiconductor wafers. The wafer carrier system may include a housing configured for transport within the automated material handling system. A support is configured to support a semiconductor wafer within a housing. A metrology system is disposed within the housing. The metrology system is operable to measure at least one characteristic of the wafer. The metrology system may include a sensing unit and a computing unit operably connected to the sensing unit.

This invention discloses a reticle pod and gripping unit thereof. The aforementioned gripping unit comprises a gripping arm and at least two gripping modules. The gripping arm is hold and configured on the reticle pod, and each gripping module is deposed on the end of the gripping arm, passing through the reticle pod. A single gripping module comprises a case, a stopper and a spring unit. The case is configured on and in the reticle pod. The stopper is configured in the case and passes through the reticle pod. The spring unit is connected with the stopper.

A reticle pod with a spoiler structure includes a body and a cover. A reticle allocation area is centrally disposed at the body. The cover covers the body. A peripheral area of the cover and a peripheral area of the body are fitted together by a protruding portion and a dented portion. The dented portion and the protruding portion jointly form a spoiler structure surrounding the reticle allocation area. The spoiler structure includes a spoiler passage between the dented portion and the protruding portion. The body has at least one retreated sidewall corresponding in position to the spoiler passage to form a particle-collecting space. Particles carried by external air current which enters the spoiler passage end up in the particle-collecting space and thus are denied entry into the reticle allocation area.

A substrate carrier may include a carrier body and a first sensor unit. The carrier body may include an internal space, an inlet port and an outlet port. The internal space may be configured to receive a substrate. A purge gas may be introduced into the internal space through the inlet port. A gas in the internal space may be exhausted through the outlet port. The first sensor unit may be at the outlet port and configured to detect environmental properties of the internal space in real time. Thus, a generation or cause of a contaminant in the carrier body may be accurately identified.

A transportation container is provided with a container body constructed of a top wall, a bottom wall, a rear wall, and two sidewalls forming a front opening for loading or unloading a reticle pod into or out of the container body; a lid for opening and closing the front opening; and a lift plate above the container body configured to connect to a carrier of an overhead hoist transfer (OHT) system.

An article storage facility is disclosed which has a relatively high article storage efficiency and which can reduce the possibility of degradation, etc., of articles that may occur within a storage structure. The article storage facility includes: a storage structure; a first support station provided inside the storage structure and configured to support a storage container; a second support station configured to support a transporting container; and an article transfer device. A transporting container is a container that is used to transport articles outside the storage structure whereas a storage container is a container that is used to transport and store articles inside the storage structure, and is configured to hold a plurality of articles with greater holding efficiency than a transporting container. The article transfer device is configured to transfer articles, one or more articles at a time, between a storage container placed on the first support station and a transporting container placed on the second support station.

An EUV reticle pod is provided. The pod includes an inner and an outer box assembly. The inner box assembly contained in the outer box assembly includes a base and a cover. The base has an upper surface and a surrounding wall. The upper surface includes a carry surface, at least one trench, and a first contacting surface. The EUV reticle is carried above the carry surface. The trench has a circular loop structure and its bottom is lower than the carry surface. The carry surface, the trench, and the first contacting surface are sequentially distributed from the center of the upper surface towards the surrounding wall. The cover has a concave for accommodating the EUV reticle and a second contacting surface for cooperating with the first contacting surface to form an air-tight seal. The trench captures and traps particles to reduce the particle contamination on the reticle.