An apparatus is provided, including a substrate storage container. A substrate detecting system is disposed in the substrate storage container. The substrate detecting system includes at least an emitter and a receiver. The substrate detecting system is configured to detect a substrate condition of a substrate in the substrate storage container.

A compressing apparatus has a compressing jig and a pressing device. The compressing jig has a lower compressing assembly and an upper compressing assembly. The lower compressing assembly has a lower mount with at least one pitching plate and at least one limiting set. Each one of the at least one limiting set has multiple poles disposed around a corresponding pitching plate. Each one of the multiple poles has a top end higher than the corresponding pitching plate and a limiting indention disposed at the top end with a supporting portion disposed at a same height with the corresponding pitching plate. The upper compressing assembly has at least one clamping plate respectively aligned with the at least one pitching plate and being movable up and down. The pressing device has a base with a receiving space to receive the upper compressing assembly.

A module tray for a semiconductor device includes a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls, first to fourth fastening guides with first to fourth fastening grooves, respectively, on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes, and an upper end portion of each of the first to fourth fastening grooves gradually widening toward a top thereof.

An electronic component transport apparatus includes: an openable and closable first opening and closing portion; a first rotation support portion which supports the first opening and closing portion to be rotatable; a second opening and closing portion provided to be openable and closable in the first opening and closing portion; and a second rotation support portion which supports the second opening and closing portion to be rotatable. An area of the first opening and closing portion is greater than an area of the second opening and closing portion.

A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

A modular pressing device capable of generating stage downward forces is provided. The modular pressing device comprises a non-exchangeable pressing module and an exchangeable pressing module. The non-exchangeable pressing module includes a first downward force generating unit. The exchangeable pressing module includes a second downward force generating unit. The first downward force generating unit applies a first downward force to at least one of a testing seat and an electronic device through the exchangeable pressing module. The second downward force generating unit applies a second downward force to the electronic device. Thereby, the modular pressing device is capable to generate two different downward forces to reduce the downward surge force. In addition, as the exchangeable pressing module is worn, the exchangeable pressing module can be replaced quickly such that the maintenance cost can be effectively reduced and the stability of the apparatus can be enhanced.

A method of performing a substrate detection process is provided. The method includes emitting a signal to a surface of a substrate from an emitter disposed in a substrate storage container. The method also includes collecting the signal reflected from the surface of the substrate by a receiver disposed in the substrate storage container. The method further includes transmitting data corresponding to the collected signal to a signal processor. In addition, the method includes analyzing the data, and determining whether an action is to be performed on the substrate based on the analyzing.

A system includes a factory interface, a load port connected to the factory interface, a container connected to the load port, and a controller connected to a robot arm of the factory interface. The controller determines that the container is configured to store replacement parts for a process chamber of the system and causes the robot arm to move according to a first mapping pattern to identify, using a detection system at a distal end of an end effector of the robot arm, positions in the container. Regions of the container that do not contain replacement parts are determined and the robot arm is moved according to a second mapping pattern to identify a position in the container of a wafer and/or an empty carrier for a replacement part. A mapping of positions of replacement parts and positions of the wafer and/or empty carrier is recorded in a storage medium.

A method and apparatus for soldering a chip (1a) to a substrate (3). A chip carrier (8) is provided between a flash lamp (5) and the substrate (3). The chip (1a) is attached to the chip carrier (8) on a side of the chip carrier (8) facing the substrate (3). A solder material (2) is disposed between the chip (1a) and the substrate (3). The flash lamp (5) generates a light pulse (6) for heating the chip (1a). The heating of the chip (1a) causes the chip (1a) to be released from the chip carrier (8) towards the substrate (3). The solder material (2) is at least partially melted by contact with the heated chip (1a) for attaching the chip (1a) to the substrate (3).

An article transport device includes an article support member for supporting an article having a plate-shaped flange portion in an upper portion thereof, with the article placed on its receiving member. The article support member further includes a restricting member which is positioned such that at least a portion of the restricting member is located across from at least a portion of a front side surface of the flange portion when the article is in the supported state, and which is configured to restrict the article in the supported state from moving at least in the front direction by distances greater than a movement distance specified in advance. The restricting member includes a pair of front restricting portions that are so located to be spaced apart from each other to form a gap, wherein the restricting member and the receiving member are fixedly connected to each other.