A liquid crystal panel packing box and a liquid crystal panel packing method are provided. The packing box is equipped with an elastic retractable member assembled in an accommodating groove thereof. The elastic retractable member is memory metal and can generate stretching and retracting effects with the change of temperature to thereby fix liquid crystal panels disposed in the packing box. Accordingly, in the processes of packing and transporting the liquid crystal panels, the seamless assembling between the liquid crystal panels and the packing box is realized, the damage caused by collision between edges of the liquid crystal panels and a box body of the packing box is avoided, the secondary impact generated resulting from the shift of the liquid crystal panels is eliminated and the safety is improved consequently.

A lead frame includes an outer frame. The outer frame includes: an upper surface; a lower surface that is opposite to the upper surface; a side surface between the upper surface and the lower surface; a first recess that is formed to extend from the upper surface to the side surface; a second recess that is formed to extend from the lower surface to the side surface; and a curved surface that is positioned between the side surface and a side wall of the first recess or between the side surface and a side wall of the second recess.

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Provided is a glass substrate package (1), including a plurality of disc-shaped glass substrates (2) packaged in a box (3), in which the plurality of disc-shaped glass substrates (2) are stacked and packaged in a horizontal posture under a stats in which slip sheets (4) are interposed between the plurality of disc-shaped glass substrates (2).

The present invention discloses an apparatus for packaging liquid crystal glass substrates, comprising multiple housings, a cover and a unit forming member, wherein the multiple housings are overlapped together in vertical direction, the cover covers the topmost housing of the multiple housings, each housing comprises a cavity for receiving a liquid crystal glass substrate, the unit forming member is configured to clamp at least two housings of the multiple housings together as a housing unit, the unit forming member comprises at least one clamp. According to the present invention, even when there are many layers of housings, the center of gravity of housings can be align with each other, and the risk of overturning can be avoided.

A module tray for a semiconductor device includes a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls, first to fourth fastening guides with first to fourth fastening grooves, respectively, on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes, and an upper end portion of each of the first to fourth fastening grooves gradually widening toward a top thereof.

The present invention discloses an apparatus for packaging liquid crystal glass substrates, comprising multiple housings, a cover and a unit forming member, wherein the multiple housings are overlapped together in vertical direction, the cover covers the topmost housing of the multiple housings, each housing comprises a cavity for receiving a liquid crystal glass substrate, the unit forming member is configured to clamp at least two housings of the multiple housings together as a housing unit, the unit forming member comprises at least one clamp. According to the present invention, even when there are many layers of housings, the centre of gravity of housings can be align with each other, and the risk of overturning can be avoided.

A module tray for a semiconductor device includes a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls, first to fourth fastening guides with first to fourth fastening grooves, respectively, on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes, and an upper end portion of each of the first to fourth fastening grooves gradually widening toward a top thereof.

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.