A method of manufacturing an electronic apparatus includes the steps of: providing an electronic panel defining a through hole; providing an electronic module having at least a portion thereof received in the through hole; providing a protective member having a first surface adjacent to the electronic panel, a hole area overlapping the through hole, a peripheral area surrounding the hole area, and a second surface facing the first surface and spaced apart from the electronic module, the providing of the protective member including: providing an unfinished protective member; attaching a film to the peripheral area; and forming a generally concave-convex pattern by contacting an acid solution with the hole area.

A SiC film structure for obtaining a three-dimensional SiC film by forming the SiC film in an outer circumference of a substrate using a vapor deposition type film formation method and removing the substrate, the SiC film structure including: a main body having a three-dimensional shape formed of a SiC film and having an opening for removing the substrate; a lid configured to cover the opening; and a SiC coat layer configured to cover at least a contact portion between the main body and an outer edge portion of the lid and join the main body and the lid.

There is provided a substrate storage container 1 capable of suppressing deformation of a functional member insert-molded and a method of manufacturing the container 1, and an device positioning member 4 as the functional member including: an attachment part 41 having a thick section 413 formed in thickness equal to a wall member of a container body 10 or a lid 20 and a thin section 410 decreasing in thickness as it approaches toward an outer edge from the thick section 413; and a body part 42 coupled to the attachment part 41, the device positioning member 4 being disposed on the container body 10 or the lid 20 so that a first surface 420 of the thick section 413 is flush with an inner surface of the wall member.

A wafer container includes a container body and a door. The container body has a pair of upright side walls, a top wall, a bottom wall and a rear wall cooperatively defining a container space with a front access opening. The door is removably engaged with the container body to close and seal the front access opening, and includes a front door panel, a rear door panel, and sealing means which is disposed at a periphery of the front door panel and configured to seal the gap between the door and the container body when the door is engaged with the container body to close the front access opening.

A method of manufacturing a semiconductor device includes: forming a protective material composed of a polymer having a urea bond by supplying a raw material for polymerization to a surface of a substrate for manufacturing the semiconductor device, the protective material configured to protect a protection target layer provided in the substrate against a treatment to be performed on the substrate; subsequently performing the process on the substrate on which the protective material is formed; and subsequently removing the protective material by heating the substrate under a low oxygen atmosphere to depolymerize the polymer.

A SiC film structure capable of providing a sealing structure. A SiC film structure for obtaining a three-dimensional SiC film by forming the SiC film in an outer circumference of a substrate using a vapor deposition type film formation method and removing the substrate, the SiC film structure including: a main body having a three-dimensional shape formed of a SiC film and having an opening for removing the substrate; and a lid configured to cover the opening.

A SiC film structure capable of providing a sealing structure. A SiC film structure for obtaining a three-dimensional SiC film by forming the SiC film in an outer circumference of a substrate using a vapor deposition type film formation method and removing the substrate, the SiC film structure including: a main body having a three-dimensional shape formed of a SiC film and having an opening for removing the substrate; and a lid configured to cover the opening.

A ring spacer interposed between plate-shaped objects above and below in a container for storing and transporting the plate-shaped objects when a plurality of plate-shaped objects is stored in an up-and-down direction includes a ring-shaped abutment portion and a control portion. An upper face and a lower face in the abutment portion have an approximately flat shape and the upper face in the abutment portion abuts against a lower face of a peripheral edge portion of the plate-shaped object. The lower face in the abutment portion abuts against an upper face of the peripheral edge portion of the plate-shaped object. The control portion includes a control portion upper face positioned to protrude further upward than the support face of the abutment portion and a control portion lower face positioned at an appropriate location in a thickness direction of the abutment portion.

The present disclosure describes a device and a method for substrate storage. The device can include a first and a second groups of panels configured to form an enclosed volume, and fin structures disposed at inner surfaces of the second group of panels. Each of the fin structures can be configured to hold a substrate. Each fin structure can include a protrusion extending inwardly into the enclosed volume and a binding device disposed over the protrusion. The binding device can be configured to bind the substrate over the protrusion.

There is provided a pellicle container for storing a pellicle used in lithography, having a tray and a cover between which the pellicle is stored, and the tray has a pellicle mount section on which the pellicle is used to be mounted, but the tray of this container further has a plane plate, preferably a quartz plane plate, having a flatness of 10 micrometers or smaller provided on top of the pellicle mount so as to stabilize the flatness of the pellicle, especially its agglutinant layer.