A wafer container includes a container body and a door. The container body has a pair of upright side walls, a top wall, a bottom wall and a rear wall cooperatively defining a container space with a front access opening. The door is removably engaged with the container body to close and seal the front access opening, and includes a front door panel, a rear door panel, and sealing means which is disposed at a periphery of the front door panel and configured to seal the gap between the door and the container body when the door is engaged with the container body to close the front access opening.

A front opening wafer container has a container portion and a door sized to close an open front of the container portion. The container portion has shelves for holding wafers defining a seating position and has forward and rearward wafer supports to suspend wafers therebetween in a transport position above the seating position. Shock condition cushion portions are arranged adjacent the transport position for protecting the wafers during a shock condition. The wafers may be bonded wafers having a thinned wafer side and a carrier substrate side. Wafer engagement pads and finger members extend in opposing directions from a central strip on the door providing a balance wafer engagement. When closing the door, a primary wafer support portion engages the wafers first and a secondary elastomeric wafer support engages the wafer secondly. A V-groove for receiving the wafers in the wafer supports has a greater angle defined between the V-groove and the thinned wafer side than the angle defined between the V-groove and carrier substrate side providing enhanced protection for the bonded wafers.

A sealing member of this substrate housing container has: a base part-side deformation part that couples the base part and the container contact tip part and is elastically deformable to allow the container contact tip part to oscillate relative to the base part; and a protruding part that is present in the portion of the container contact tip part connected to the base part-side deformation part and that protrudes from the outer surface of the container contact tip part. The thickness of the container contact tip part in the oscillating direction of the container contact tip part is configured to be greater than the thickness of the base part-side deformation part.

Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

A reticle pod for accommodating a reticle is provided. The reticle pod comprises a base; a cover; and at least one supporting member. When the reticle is accommodated on the reticle pod, the supporting member abuts against the reticle through a protrusion part; wherein the maximum static friction is constantly greater than a horizontal force applied to the support module from the reticle.

Substrate containers and/or portions thereof for use in the semiconductor manufacturing industry can be formed by injection molding metal slurries. More particularly, such substrate containers and/or portions thereof can be formed by injection molding metal slurries containing magnesium or magnesium alloys. Substrate containers, wherein at least a portion of the substrate container is injection molded from a metal slurry containing magnesium or magnesium alloy can exhibit improved permeation control of moisture and oxygen over, and as compared to, comparable substrate carriers formed of polymer based materials. Exemplary substrate containers can include wafer containers, reticle pods, disk shippers and/or work-in-process boxes.

A substrate transfer apparatus includes: a chamber including a lower surface, an upper surface opposing the lower surface, and a side surface extending between the lower surface and the upper surface; and a fan filter unit disposed on the upper surface of the chamber and configured to introduce air into the chamber. The chamber includes an inclined surface extending from the upper surface to the side surface and positioned to a side of the fan filter unit.

A reticle pod is provided for receiving a reticle, the reticle pod comprises: a plurality of positioning modules, which are disposed on at least one vertex portions of a substrate of the reticle pod. The positioning module includes an elastic member, and an abutting member which disposed above the positioning module, wherein when the reticle is received in the reticle pod and the cover of the reticle pod is engaged to the substrate, the cover contacts and provides a downward pressure to the abutting member, and forcing the abutting member to compress the elastic member. The compressed elastic member deforms extensively along a transverse direction and contacts with the reticle.

The invention discloses a substrate carrier latching structure, which mainly comprises a top portion, a cover and a detachable module. The top portion is disposed on the enclosure of a substrate carrier, and the cover is connected to the top portion via a detachable module. As such, the excessive stress on the substrate carrier is avoided to maintain the integrity of substrates stored in the inner portion of the substrate carrier.

A semiconductor fabrication building is provided. The semiconductor fabrication building includes an ambient control surrounding and a makeup air handling unit configured to supply clean air to the ambient control surrounding. The makeup air handling unit includes a housing having an air inlet and an air outlet. The makeup air handling unit also includes a first filtration module positioned in the housing. The first filtration module includes a number of hollow fibers configured to guide air to flow from the air inlet to the air outlet. A porous layer is formed at an inner wall of each of the hollow fibers to filter airborne molecular contamination (AMC) having a selected size.