A packaging container for transporting ceramic substrates according to the present embodiment includes a bottom portion in a rectangular shape, and four side portions connected to four edges of the bottom portion respectively. Side protrusions having a height of 2 mm or more and protruding inward are provided on at least two opposite side portions among the four side portions. The bottom portion is provided with a bottom protrusion having a height of 2 mm or more and protruding inward.

A wafer transport box according to an embodiment of the present disclosure includes a lower housing including a bottom plate and at least one lower rib which is formed vertically on an upper surface of the bottom plate and which forms a wall formed in an arc shape so that wafers are stacked in an inner space, an upper housing including an upper plate and an upper rib which is formed vertically on a lower surface of the upper plate and which forms a wall formed in an arc shape, and a sidewall member coupled inside the lower rib. Further, when the upper housing and the lower housing are coupled to each other, the sidewall member fixes the wafers stacked in the inner space.

The present disclosure is directed to a wafer container including: a housing configured for transporting a plurality of wafers, wherein the plurality of wafers are stacked on a base of the housing in a first direction; a plurality of wafer separator rings; each of the wafer separator rings configured to encircle a wafer of the plurality of wafers in a second direction that is substantially perpendicular to the first direction, each of the wafer separator rings including a top surface and a bottom surface, defining a thickness there between extending in the first direction, which is about 0.3 mm-1.4 mm; and each of the wafer separator rings including an inner side wall and an outer side wall defined by an inner diameter and an outer diameter, respectively, in the second direction, wherein the inner diameter of the wafer separator ring is greater than 300 mm and configured to be spaced apart from the wafer it is encircling.

The container main body includes a tubular wall portion having an opening circumferential portion provided at one end portion and the other end portion being closed, the opening circumferential portion having a container main body opening portion formed therein. The substrate storing space can store a substrate and communicates with the container main body opening portion. A central fixed member is provided to the wall portion of the container main body so as to be removably attached to the wall portion of the container main body. The central fixed member is configured to be locked and fixed to an alignment portion provided at a load port for conveying the substrate stored in the substrate storing space to a processing apparatus.

A substrate container including substrate supports, such as concentric rings, adapted to receive substrates in a substrate stack. The container includes a base and a top cover to enclose the substrate stack. A latching mechanism is adapted to latch the top cover to the base and secure the substrate stack within the container. The latching mechanism includes resilient corner flanges on an outside portion of the container, the flanges acting as springs to exert a biasing force on the cover and on the substrate stack. The flanges hold the stack within the container while accommodating stack-up uncertainty caused by the accumulation of uncertainties due to component machining tolerances. In some embodiments, a gap is created between a side wall of the top cover and the base of the container to assure compression of the substrate stack. Deflection limiters may be implemented to prevent over-deflection of the flanges.

The first cushioning portion includes: a cushioning support portion that directly abuts the substrate storing container to support the substrate storing container; and a cushioning-portion connecting portion that is connected to the cushioning support portion, and extends downwards from the cushioning support portion. The second cushioning portion includes: a cushioning plate-like portion in which a through-hole is formed; and cushioning leg portions which are configured by a cushioning material which is softer than the cushioning-portion connecting portion of the first cushioning portion, and extend downwards from the cushioning plate-like portion. The cushioning plate-like portion supports the first cushioning portion in a state in which the cushioning-portion connecting portion penetrates through the through-hole of the cushioning plate-like portion.

A front opening wafer container has a container portion and a door sized to close an open front of the container portion. The container portion has shelves for holding wafers defining a seating position and has forward and rearward wafer supports to suspend wafers therebetween in a transport position above the seating position. Shock condition cushion portions are arranged adjacent the transport position for protecting the wafers during a shock condition. The wafers may be bonded wafers having a thinned wafer side and a carrier substrate side. Wafer engagement pads and finger members extend in opposing directions from a central strip on the door providing a balance wafer engagement. When closing the door, a primary wafer support portion engages the wafers first and a secondary elastomeric wafer support engages the wafer secondly. A V-groove for receiving the wafers in the wafer supports has a greater angle defined between the V-groove and the thinned wafer side than the angle defined between the V-groove and carrier substrate side providing enhanced protection for the bonded wafers.

This substrate storage container comprises: a lid body-side substrate support part which is capable of supporting an edge part of a substrate when the substrate storage container is closed; a depth-side substrate support part which is disposed so as to form a pair with the lid body-side substrate support part and is capable of supporting the edge part of the substrate; and a substrate edge part auxiliary part which is disposed at a portion opposing a substrate storage space when the substrate storage container is closed, and in which are formed a plurality of auxiliary grooves having an opening that is wider than the thickness of the edge part of the substrate so that the edge part of the substrate can be inserted therein. The auxiliary grooves each have opposing groove forming surfaces, and an edge part of one of a plurality of the substrates is inserted into each auxiliary groove when the container is closed. The edge part of the substrate is inserted into the auxiliary groove in a non-contact state in which a space is formed between the edge part of the substrate and the groove forming surfaces and the edge part of the substrate is not contacting the groove forming surfaces when the container is closed.

A wafer container is provided. The wafer container includes a pod base having a top surface and a bottom surface, a cassette disposed on the top surface, and a damping device, disposed on the bottom surface. The damping device includes a housing disposed in the pod base, and a damping mechanism disposed in the housing and protruding over the bottom surface. The damping mechanism is configured to provide a damping force.

A reticle pod includes an outer pod, an inner pod cover and an inner base plate. A reticle is supported on the base and is contained within the environment created by the inner pod cover and the inner pod base. The inner pod cover can include a plurality of reticle retainers configured to contact a side wall of the reticle and limit movement of the reticle in a horizontal direction.