A reticle pod with antistatic capability includes a base and plural of support members. The base has a carrying surface having a recess formed thereon and defined by a bottom surface. The support members encircle the carrying surface of the base and are adapted to support a reticle. The recess is defined by a depth extending between the carrying surface and the bottom surface. The depth ranges from 300 μm to 3400 μm to thereby weaken the electrostatic force exerted upon particles on the carrying surface.

The invention discloses a reticle pod for receiving a reticle. The reticle pod includes a base and plural support device provided on the base for supporting the reticle. A first distance is defined between a peripheral area of a bottom surface of the reticle and an upward facing top surface of the base. A second distance is defined between a central area of the bottom surface of the base and the upward facing top surface of the base, wherein the central area is encircled by the peripheral area. The second distance is larger than the first distance.

The invention discloses a substrate storage apparatus having a detecting device detachably connecting to an outer pod. The detecting device includes a sensing member having a sensing terminal, a cavity and a sensor. The sensing terminal detachably connects to the outer pod such that the sensing terminal exposes in an accommodating space inside of the outer pod. The cavity receiving the sensor extends to an outside of the outer pod and the accommodating space. The cavity communicates with the accommodating space through the sensing terminal, allowing the sensor to read information regarding the accommodating space.

Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an index unit including a load pot, in which a container is seated, and an index chamber connected to the load pot, and a process executing unit having a load lock chamber connected to the index chamber and a process chamber that treats a substrate transferred to the load lock chamber, the index unit further includes an alignment unit provided in the index chamber and that aligns a substrate type sensor transferred to the process chamber.

A container (100) having: a housing member (10) having a bottom surface member (12) and a side surface member (14); and a protective member (220a) having a receiving surface in contact with an item to be housed. The bottom surface member defines the xy plane and the side surface member defines the xz plane and the yz plane that are orthogonal to the xy plane. The side surface member has a cut-out section (15a) that faces a housing space. The protective member (220a) has: an inside member (122a) comprising a receiving section having first receiving surface (123) parallel to the yz plane and a second receiving surface (124) parallel to the xz plane; and an outside member (232a) arranged at least between the inside member and a side surface parallel to the yz plane of the side surface member, said outside member being fitted to the inside member (122a) so as to be slidable in a direction intersecting the floor surface. The inside member (122a) and the outside member (232a) are arranged in the cut-out section so as to each be independently attachable and detachable. A section including the first receiving surface (123) is more flexible than a section including the second receiving surface (124).

Disclosed is a container. The container includes a housing having an interior space, and a support part that supports an expendable component in the interior space, and the support part includes an alignment pin that aligns the expendable component.

A semiconductor wafer container includes two outer shells in a substantially flat and identical form. Each outer shell vertically overlaps so as to accommodate a single semiconductor wafer therein. Each outer shell has a main body, a wafer retaining device and an external wall forming device. The wafer retaining device accommodates and fixedly holds the wafer in such a manner that upper and bottom surfaces of the wafer are not substantially in contact with the outer shells. The wafer retaining device includes: an inclined surface; a wafer contact surface; and a shallow gap portion. The external wall forming device has a hanging portion formed on an outer peripheral edge of the bottom surface of the outer shell so as to externally constitute a closed external wall relative to the wafer when each outer shell vertically overlaps to store the wafer.

A lid body side substrate receiving portion includes a lower side substrate guiding inclined face and an upper side substrate guiding inclined face. In a direction in which a groove extends while a container main body opening portion is closed by a lid body, a length of the lower side substrate guiding inclined face in the upper-lower direction becomes longer as approaching a center of the container main body opening portion.

A reticle pressing unit and an EUV reticle pod using the same are provided. An inner assembly includes an upper cover and a lower cover. The lower cover includes a supporting element for supporting the reticle. A pressing unit for pressing the reticle is disposed on the upper cover and includes a pressing element and a limiting cap. The pressing element has oppositely arranged pressing part and pressure receiving part. The pressing part extends through the upper cover to press against the reticle. The pressing element is covered by the limiting cap and is protruded outwardly from a top surface of the limiting cap. An outer cover has a pushing surface for forming a surface-to-surface contact with the pressure receiving part and for simultaneously pressing against the pressure receiving part and the top surface to solve the problems relating to the reticle which is applied with uneven forces.

A wafer transport box according to an embodiment of the present disclosure includes a lower housing including a bottom plate and at least one lower rib which is formed vertically on an upper surface of the bottom plate and which forms a wall formed in an arc shape so that wafers are stacked in an inner space, an upper housing including an upper plate and an upper rib which is formed vertically on a lower surface of the upper plate and which forms a wall formed in an arc shape, and a sidewall member coupled inside the lower rib. Further, when the upper housing and the lower housing are coupled to each other, the sidewall member fixes the wafers stacked in the inner space.