A substrate housing container (1) includes (i) a container body (10) having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which substrates (W) are stacked, the mount element 12 facing the opening (11), and (ii) a cover (20) to cover the opening (11), wherein the cover (20) includes a lid portion (21) to cover the opening (11) and at least two holding members (22) disposed on the lid portion (21), the holding members (22) being configured to swing in a central direction of the lid portion (21) and to press outer sides of the substrates (W) accommodated in the container body (10) with the substrates (W) stacked, the container body (10) has guide grooves (13) to make tips (22a) of the holding members (22) move from an outer side of the mount element (12) to an inner sides of the mount element (12) to guide the tips (22a) of the holding members (22) to positions at which the holding members (22) press the outer sides of the substrates (W), and the guide grooves (13) are formed as a dent on surfaces of the mount element (12).

A semiconductor manufacturing equipment has an outer case housing including a lower case extension to support a semiconductor panel. The lower case extension is fixed in position within the outer case housing. An inner case housing having an upper case extension is disposed within the outer case housing in proximity to the lower case extension. A mechanism draws the upper case extension toward the lower case extension and locks the semiconductor panel in place between the upper case extension and lower case extension. The mechanism has a cam assembly disposed above the inner case housing and operatable with a handle to rotate the cam assembly and apply pressure to the inner case housing and upper case extension to lock the semiconductor panel in place between the upper case extension and lower case extension. A spring or other elastic mechanism is disposed under the inner case housing to load the pressure.

According to various embodiments, a frame cassette includes a housing and a mounting structure within the housing. The mounting structure includes a plurality of tape-frame slots, each tape-frame slot configured to receive a tape-frame. The housing includes an opening configured to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots, or to remove the tape frame from the tape-frame slot of the plurality of tape-frame slots. The housing also includes an electrostatic discharge protection. A corresponding automatic transportation system and method of automatic transportation of semiconductor wafers is also provided.

A substrate container system comprises a container body having a bottom face, a front opening that enables passage of a substrate, and a back opening opposing the front opening, the back opening having a width smaller than that of the front opening; and a back cover that covers the back opening and establishes sealing engagement with the container body, wherein the back cover comprises a first gas inlet structure that bendingly extends under the bottom face of the container body upon assembly; wherein the first gas inlet structure comprises a downward facing gas intake port opposing the bottom face of the container body.

A semiconductor manufacturing equipment has an outer case housing including a lower case extension to support a semiconductor panel. The lower case extension is fixed in position within the outer case housing. An inner case housing having an upper case extension is disposed within the outer case housing in proximity to the lower case extension. A mechanism draws the upper case extension toward the lower case extension and locks the semiconductor panel in place between the upper case extension and lower case extension. The mechanism has a cam assembly disposed above the inner case housing and operatable with a handle to rotate the cam assembly and apply pressure to the inner case housing and upper case extension to lock the semiconductor panel in place between the upper case extension and lower case extension. A spring or other elastic mechanism is disposed under the inner case housing to load the pressure.

Provided is a substrate storing container in which a latching mechanism includes an engagement latch 32, an engagement latch lifting/lowering cam 35 that causes the engagement latch 32 to advance to and retreat from an engagement concave portion and causes the engagement latch 32 in the engagement concave portion to move toward/away from the other end portion of a container main body by advancing and retreating in a direction in which the engagement latch 32 advances and retreats, and a rotating cam 31, and the engagement latch lifting/lowering cam 35 includes an engagement latch connection portion 357 that causes the engagement latch 32 to be engaged with the engagement concave portion and thereafter causes the engagement latch 32 to approach the other end portion of the container main body by moving in a direction in which the engagement latch 32 approaches the engagement concave portion.

A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

This technical disclosure describes a device that includes a recital pod and the method of making and maintaining the pod. The device includes a pod that includes a cover including a cover body; a baseplate including a baseplate body; and one or more mating surfaces formed on one or both of the baseplate body and the cover body to assemble between the cover and the baseplate to each other. The one or more mating surfaces each includes an outermost coating configured to be wear-resistant and lubricating, the outermost coating includes a composite metal plating, and the composite metal plating includes a metal plating with a lubricant embedded therein and/or layered over the metal plating.

A storage system includes shelves each with a nozzle to supply clean gas into containers, flow amount controllers to control a supply amount of clean gas to a nozzle, a transport apparatus to transfer the containers to and from the shelves, and a controller to control the transport apparatus and the flow amount controllers. The controller makes an assignment of at least one shelf in preparation to store an incoming container and before the occurrence of the incoming container, and controls a flow amount controlling device to supply clean gas to the nozzle in the at least one shelf, based upon the assignment.

A wafer transport box according to an embodiment of the present disclosure includes a lower housing including a bottom plate and at least one lower rib which is formed vertically on an upper surface of the bottom plate and which forms a wall formed in an arc shape so that wafers are stacked in an inner space, and includes an upper housing including an upper plate and an upper rib which is formed vertically on a lower surface of the upper plate and which forms a wall formed in an arc shape. Further, the lower rib includes at least one of protrusion members which are provided at an inner surface of the lower rib and which are spaced apart from each other at a predetermined distance, and the protrusion members fix the wafers stacked in the inner space when the upper housing is coupled to the lower housing.