A housing accommodates: a valve body capable of moving between a closing position and an opening position in an outer opening portion, the closing position closing the outer opening portion and the opening position opening the outer opening portion; a biased member having a tubular shape and connected to the valve body, the biased member supported by the housing so as to be movable in the housing and guiding the movement of the valve body so as to move integrally with the valve body; and a biasing member biasing the biased member so that the valve body moves to the closing position.

A process chamber system adapted for both vacuum process steps and steps at pressures higher than atmospheric pressure. The chamber door may utilize a double door seal which allows for high vacuum in the gap between the seals such that the sealing force provided by the high vacuum in the seal gap is higher than the opposing forces due to the pressure inside the chamber and the weight of the components.

A method is provided for producing a hermetically sealed housing having a semiconductor component. The method comprises introducing a housing having a housing body and a housing cover into a process chamber. The housing cover closes off a cavity of the housing body and is attached in a gas-tight manner to the housing body. At least one opening is formed in the housing. At least one semiconductor component is arranged in the cavity. The method furthermore comprises generating a vacuum in the cavity by evacuating the process chamber, and also generating a predetermined gas atmosphere in the cavity and the process chamber. The method moreover comprises applying sealing material to the at least one opening while the predetermined gas atmosphere prevails in the process chamber.

A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned in a groove formed in the cooling base and configured to form a seal between the cooling base and one or both of the porous plug and the body of the electrostatic chuck.

A substrate storage container includes a container body configured to store substrates, a lid that closes an opening of the container body, and a valve unit that controls the flow of gas to the container body. The valve unit includes an elastic valve having a valve opening that connects a first passage communicating with the outside of the container body to a second passage communicating with the inside of the container body, a holding member that holds the elastic valve, and a clamping cap that is inserted in the elastic valve and secures the elastic valve to the holding member. The valve opening is tightly closed by the elastic force of the elastic valve.

A substrate storing container includes: a container main body; a lid body which is attachable to and detachable from a container main body opening portion, and which is able to block the container main body opening portion; and a component which is attached to the container main body or to the lid body. A connected part between the component and the container main body, the lid body or another component includes press-fit fixing portions, which are positioned by means of press fitting while being fixed to each other; and impulse welding portions which are formed by impulse welding, to maintain the positioning and fixing in the press-fit fixing portions.

Disclosed is a wafer processing system, a dual gate system, and methods for operating these systems. The dual gate system may have a first gate, a second gate, a gate connector coupled to the first gate and to the second gate, and actuator coupled to the gate connector. The actuator is configured to seal the first gate against a first slot or open the first slot via vertical motion. The actuator is also configured to seal the second gate against a second slot or open the second slot via a combination of vertical motion and horizontal motion.

Proposed is an EFEM configured to perform wafer transfer between a wafer storage device and process equipment. More particularly, proposed is an EFEM that prevents harmful gases inside a transfer chamber in which wafer transfer is performed from escaping out of the EFEM.

A purge port assembly for a wafer container includes a purge module configured to allow inlet flow of purge gas and a transition portion disposed over an intermediate outlet of the purge module. The transition portion includes a receiver configured to receive the purge gas discharged from the purge module, an outlet connector configured to attach with a diffuser, and an intermediate conduit. The intermediate conduit connects the receiver to the outlet connector and extends from the receiver at an acute angle relative to an axis of the inlet opening of the receiver. The intermediate conduit has a length that spaces apart the outlet connector from the receiver. A wafer container includes a shell and a purge port assembly. The shell includes an interior space. The purge port assembly extends through an opening in the shell into the interior space.

A magnet holder insert comprising a magnet and magnet holder housing designed with internal wall features capable of keeping the magnet properly positioned in the holder device, and external wall features capable of keeping the magnet holder device securely mounted in the finished part. The internal and external fastening elements of the magnet holder housing are designed in such a way as to promote rapid and secure assembly of both the magnet device and the finished part. The exposed surface of the magnet holder device can be configured with flat or dome shaped exposed contact surfaces, depending on how secure or flexible the magnetic joining feature is intended, capable of attaching to another magnet device or a material susceptible to magnetic attraction.