According to various embodiments, a frame cassette includes a housing and a mounting structure within the housing. The mounting structure includes a plurality of tape-frame slots, each tape-frame slot configured to receive a tape-frame. The housing includes an opening configured to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots, or to remove the tape frame from the tape-frame slot of the plurality of tape-frame slots. The housing also includes an electrostatic discharge protection. A corresponding automatic transportation system and method of automatic transportation of semiconductor wafers is also provided.

A semiconductor manufacturing equipment has an outer case housing including a lower case extension to support a semiconductor panel. The lower case extension is fixed in position within the outer case housing. An inner case housing having an upper case extension is disposed within the outer case housing in proximity to the lower case extension. A mechanism draws the upper case extension toward the lower case extension and locks the semiconductor panel in place between the upper case extension and lower case extension. The mechanism has a cam assembly disposed above the inner case housing and operatable with a handle to rotate the cam assembly and apply pressure to the inner case housing and upper case extension to lock the semiconductor panel in place between the upper case extension and lower case extension. A spring or other elastic mechanism is disposed under the inner case housing to load the pressure.

The present disclosure relates to the technical field of semiconductors, and proposes a semiconductor chip container and a fixture. The container is placed in a containing device with a chemical reagent, and the container includes a main body and partition plates, where the main body has an accommodating space; the partition plates are arranged in the accommodating space and divide the accommodating space into a plurality of independent accommodating chambers; the plurality of accommodating chambers are respectively used for placing a plurality of independent semiconductor chips; the main body is provided with first through holes; the first through holes are used for allowing the chemical reagent to enter the accommodating space; the main body and the partition plates are used for preventing the semiconductor chip from being separated from the corresponding accommodating chamber under the action of the chemical reagent.

Provided is a substrate storing container in which a latching mechanism includes an engagement latch 32, an engagement latch lifting/lowering cam 35 that causes the engagement latch 32 to advance to and retreat from an engagement concave portion and causes the engagement latch 32 in the engagement concave portion to move toward/away from the other end portion of a container main body by advancing and retreating in a direction in which the engagement latch 32 advances and retreats, and a rotating cam 31, and the engagement latch lifting/lowering cam 35 includes an engagement latch connection portion 357 that causes the engagement latch 32 to be engaged with the engagement concave portion and thereafter causes the engagement latch 32 to approach the other end portion of the container main body by moving in a direction in which the engagement latch 32 approaches the engagement concave portion.

In a substrate processing apparatus for supplying a processing liquid onto a lower surface of a substrate being rotated, to thereby process the substrate, provided are an upper support body which is separably placed on a lower support body, a plurality of upper holding members protruding downward from the upper support body, for holding the substrate, and an upper hold-driving part for moving the upper holding members separably from and contactably with an outer edge portion of the substrate. Preferably, the upper hold-driving part moves the upper holding members by using a magnetic action between holding-side magnetic members and an annular driving-side magnetic member.

A substrate storage container and a gas replacement unit capable of reducing variations in humidity or concentration of gas in a space above a substrate are provided. The substrate storage container comprises a container body having an opening and is capable of containing substrates, a lid, at least one intake valve for supplying gas to the inside of the container body, and at least one gas replacement unit which blows out the supplied gas wherein the at least one intake valve is attached to the back, bottom surface of the container body. The gas replacement unit includes a housing member and a cover member. The housing member has a plurality of first group blowout holes in the vertical direction, and the opening area of the top first group blowout hole is larger than the opening area of the second of the first group blowout holes.

According to one embodiment, a substrate storage container includes a transport component configured to be mountable to a container body by being relatively displaced with respect to the container body from the rear side to the front side. The container body has a container body-side protrusion protruding upward. The transport component has a transport component-side protrusion protruding downward. In a mounted state, the transport component-side protrusion is engaged with the front side of the container body-side protrusion to be restricted from being displaced backwards. When a predetermined load is applied to the transport component-side protrusion upwardly, the transport component-side protrusion is displaced by a smaller amount than the container body-side protrusion displaced when the predetermined load is applied to the container body-side protrusion downwardly.

A calibration pod for calibrating a robotic wafer pod handling apparatus includes a pod body configured for handling by the robotic pod handling apparatus, at least one laser disposed on a bottom of the pod body, and a power module disposed on or in the pod body and operatively connected to power the at least one laser. In a manufacturing method, the pod body comprises a wafer carrier for carrying a cassette of semiconductor wafers, which has a bottom with a plurality of holes for aligning placement of the wafer carrier in a load port of a semiconductor device fabrication facility. The at least one laser here includes a plurality of lasers corresponding to the plurality of holes in the bottom of the wafer carrier, and each laser is mounted in a respective hole of the bottom of the wafer carrier.

Substrate loading device including a frame adapted to connect the substrate loading device to a substrate processing apparatus, the frame having a transport opening through which substrates are transported between the substrate loading device and the substrate processing apparatus, a cassette support connected to the frame for holding at least one substrate cassette container for transfer of substrates to and from the at least one substrate cassette container through the transport opening, and selectably variable cassette support purge ports with a variable purge port nozzle outlet, variable between more than one selectable predetermined purge port nozzle characteristics, disposed on the cassette support, each of the more than one purge port nozzle characteristics being configured so that the purge port nozzle outlet with each selected predetermined purge port nozzle characteristic complements and couples to at least one purge port of the at least one substrate cassette container.

A wafer stocker is capable of further improving an environment around wafers. The wafer stocker includes a housing, a loading device provided on a front surface of the housing, a wafer cassette shelf arranged in the housing, a wafer transfer robot configured to move the wafers from a transfer container mounted on the loading device to a wafer cassette in the wafer cassette shelf, a wafer cassette delivery device configured to move the wafer cassette in the wafer cassette shelf to a stage having a different height, and a fan filter unit configured to generate a laminar flow in a wafer transfer space and in a wafer cassette transfer space.