A container is placed at a predetermined position on a purge device to prevent the container from getting caught on a nozzle. When the container is lowered and placed on the purge device, the two facing sides of the front end of the container's bottom surface and the front end of a recessed part, and the two facing sides of both left and right side ends of the container's bottom surface are guided by a front guide, side guides and a center guide. Following that, the nozzle is brought into contact with the bottom surface of the container.

An overhead transport vehicle includes a vibration-proof portion disposed between a belt and a lift device. The vibration-proof portion includes a first connection mechanism disposed on a side where a first load acts in a width direction perpendicular or substantially perpendicular to both a travelling direction and a lifting direction of the lift device, and a second connection mechanism disposed on a side where a second load larger than the first load acts in the width direction, and which has a larger repulsive force than that of the first connection mechanism.

A handling member includes: a substantially plate-like handling member main body that is arranged along a pair of the side walls, respectively; a circular position-restriction through hole that is formed to extend through the handling member main body in a thickness direction of the handling member and with which the semicircular convex portion can be engaged; a handling member side guided portion that is engaged with the guide members and of which a movement is guided between the mounting position and the detachment position by the guide members; and a back-side guided portion that can be engaged with the back-side engaging portion by a movement of the handling member from the detachment position to the mounting position.

There is provided a device and method for controlling a tightness of at least one transport enclosure for conveyance and atmospheric storage of semiconductor substrates, the transport enclosure including at least two ventilation ports, the device including at least one interface configured to be coupled to the transport enclosure, the interface including at least two connecting heads, at least one connecting head of the heads being formed by a measurement head configured to engage in a ventilation port of the ventilation ports of the transport enclosure, the measurement head including a projecting end piece, opening through at least one aperture, and a peripheral sealing element surrounding the end piece, all of the ventilation ports of the transport enclosure being coupled to the connecting head of the interface. There is also provided a method for controlling the tightness of the transport enclosure.

A wafer stocker capable of further improving an environment around wafers is provided. The wafer stocker includes a housing, a loading device provided on a front surface of the housing, a wafer cassette shelf arranged in the housing, a wafer transfer robot configured to move the wafers from a transfer container mounted on the loading device to a wafer cassette in the wafer cassette shelf, a wafer cassette delivery device configured to move the wafer cassette in the wafer cassette shelf to a stage having a different height, and a fan filter unit configured to generate a laminar flow in a wafer transfer space and in a wafer cassette transfer space.

A semiconductor manufacturing apparatus including at least one load module including a load port on which a substrate container is located, a plurality of substrates being mountable on the substrate container; at least one loadlock module including a loadlock chamber directly connected to the substrate container, the loadlock chamber interchangeably having atmospheric pressure and vacuum pressure, a first transfer robot within the loadlock chamber, and a substrate stage within the loadlock chamber, the plurality of substrates being mountable on the substrate stage; a transfer module including a transfer chamber connected to the loadlock chamber, a second transfer robot within the transfer chamber, and a substrate aligner within the transfer chamber; and at least one process module including at least one process chamber connected to the transfer module.

A load port includes a dock plate on which a container storing a substrate is placed, a port plate, a moving mechanism configured to move the dock plate between a dock position and an undock position, a gas supply nozzle unit provided in the dock plate and configured to contact a bottom surface of the container placed on the dock plate and supply a gas into the container, and a pressing unit provided above the dock plate and configured to press the container placed on the dock plate downward. The pressing unit includes a contact member brought into contact with the container placed on the dock plate, and a driving mechanism configured to move the contact member between a first position apart from the container and a second position in contact with the container.

An apparatus, system and method for storing die carriers and transferring a semiconductor die between the die carriers. A die stocker includes a rack enclosure with an integrated sorting system. The rack enclosure includes storage cells configured to receive and store die carriers having different physical configurations. A transport system transports first and second die carriers between a first plurality of storage cells and a first sorter load port, where the transport system introduces the first and second die carriers to a first sorter. The transport system transports third and fourth die carriers between a second plurality of storage cells and a second sorter load port, where the transport system introduces the third and fourth die carriers to a second sorter. The first and second die carriers have a first physical configuration, and the third and fourth die carriers have a second physical configuration, different than the first physical configuration.

A connecting mechanism includes a mounting unit, a substrate transfer port, a door closing or opening the substrate transfer port, a coupling mechanism coupling a cover of the substrate container mounted on the mounting unit with the door, and a gas exhaust/purge unit. First, second and third seal members respectively seal a first space between a peripheral portion of the substrate transfer port and the door, a second space between the door and the cover of the substrate container, and a space between the peripheral portion of the substrate transfer port and the main body. The gas exhaust unit exhausts the first space and a second space. The purge gas, which has been supplied into the substrate container by the gas exhaust/purge unit, is supplied into the first and the second space by allowing the gas exhaust unit to exhaust the first and the second space.

A substrate container includes a container portion having an open side or bottom, and a door to sealingly close the open side or bottom, one of the door and the container portion defining access structure. The substrate container additionally includes a check-valve assembly, the check-valve assembly being retained with respect to the access structure to provide fluid communication with an interior of the substrate container. The check-valve assembly includes a grommet, the grommet being formed of an elastomeric material. A valve seat is disposed within the grommet, the valve seat being integrally formed with the grommet according to one aspect, and being formed of a separate piece according to another aspect. An elastomeric valve member, specifically an elastomeric umbrella valve member according to one aspect, is disposed within the grommet and held to engage the valve seat, thereby restricting fluid flow through the check-valve assembly with respect to the interior of the substrate container.