A substrate storage container comprises a container body capable of containing a plurality of substrates, and an air supply member capable of supplying gas from outside of the container body to an internal space, wherein for the substrate storage container the container body is formed in a front open box and the air supply member is attached to the bottom surface, and wherein a functional unit that changes the environment of the internal space to different states are connected with the air supply member so as to be able to be exchanged.

An apparatus for controlling the temperature of a substrate is equipped with a plate-type main body having a substrate placement area, a first temperature-control device for controlling the temperature of the main body using a first temperature-control fluid, having a first plurality of separate annular channels inside the main body, a second temperature-control device for controlling the temperature of the main body using a second temperature-control fluid, having a second plurality of separate annular channels inside the main body, wherein the first temperature-control fluid is supplied to the first plurality of annular channels through a first tube and removed therefrom through a second tube, wherein the second temperature-control fluid is supplied to the second plurality of annular channels through a third tube and removed therefrom through a fourth tube, wherein the main body has a first to fourth hole that communicate with the first plurality of separate annular channels and the second plurality of separate annular channels, wherein the first to fourth tubes are placed in the first to fourth holes of the main body.

The system, method and apparatus described relates generally to a device related to substrate storage and processing. In one example embodiment to methods, apparatus, and systems of a substrate storage and processing module improving upon existing devices used in one or more instances for substrate transportation, sorting, and cleaning. The single piece design system may contain and support substrates in a method, reducing strain on its contents by utilizing an innovative support system without the use of standard clamping techniques and, in this or other iterations, such stacking methods may minimize chaffing of surfaces. Thus the device is vastly improved in its ability to preserve pristine conditions of contained substrates.

A front opening wafer container has a container portion and a door sized to close an open front of the container portion. The container portion has shelves for holding wafers defining a seating position and has forward and rearward wafer supports to suspend wafers therebetween in a transport position above the seating position. Shock condition cushion portions are arranged adjacent the transport position for protecting the wafers during a shock condition. The wafers may be bonded wafers having a thinned wafer side and a carrier substrate side. Wafer engagement pads and finger members extend in opposing directions from a central strip on the door providing a balance wafer engagement. When closing the door, a primary wafer support portion engages the wafers first and a secondary elastomeric wafer support engages the wafer secondly. A V-groove for receiving the wafers in the wafer supports has a greater angle defined between the V-groove and the thinned wafer side than the angle defined between the V-groove and carrier substrate side providing enhanced protection for the bonded wafers.

This substrate storage container comprises: a lid body-side substrate support part which is capable of supporting an edge part of a substrate when the substrate storage container is closed; a depth-side substrate support part which is disposed so as to form a pair with the lid body-side substrate support part and is capable of supporting the edge part of the substrate; and a substrate edge part auxiliary part which is disposed at a portion opposing a substrate storage space when the substrate storage container is closed, and in which are formed a plurality of auxiliary grooves having an opening that is wider than the thickness of the edge part of the substrate so that the edge part of the substrate can be inserted therein. The auxiliary grooves each have opposing groove forming surfaces, and an edge part of one of a plurality of the substrates is inserted into each auxiliary groove when the container is closed. The edge part of the substrate is inserted into the auxiliary groove in a non-contact state in which a space is formed between the edge part of the substrate and the groove forming surfaces and the edge part of the substrate is not contacting the groove forming surfaces when the container is closed.

A ring spacer interposed between plate-shaped objects above and below in a container for storing and transporting the plate-shaped objects when a plurality of plate-shaped objects is stored in an up-and-down direction includes a ring-shaped abutment portion and a control portion. An upper face and a lower face in the abutment portion have an approximately flat shape and the upper face in the abutment portion abuts against a lower face of a peripheral edge portion of the plate-shaped object. The lower face in the abutment portion abuts against an upper face of the peripheral edge portion of the plate-shaped object. The control portion includes a control portion upper face positioned to protrude further upward than the support face of the abutment portion and a control portion lower face positioned at an appropriate location in a thickness direction of the abutment portion.

A transportable process box for processing substrates coated on one side is described. The box has a base for the placement of a first substrate in a manner such that the latter is supported over the full area, a frame, a cover which is placed onto the frame, and an intermediate element which is arranged between the base and the cover and is intended for the placement of a second substrate in a manner such that the latter is supported over the full area. Arrangements and methods for processing substrates are also described.

A substrate treating apparatus including an unloading order changing unit. The unloading order changing unit reverses an order, in regard to unloading of substrates in a carrier from the top, between a poor inclined substrate and a substrate at least immediately above the poor inclined substrate when the poor inclined substrate is present whose inclination is determined larger than a pre-set threshold by a poor inclination determining unit. That is, the order is reversed such that the poor inclined substrate whose surface may be possibly be scratched with a hand is unloaded prior to the substrate immediately above the poor inclined substrate. Accordingly, this inhibits damages on the substrate caused by scratching a substrate surface with the hand of a substrate transport mechanism.

A wafer cassette and a method for placing a wafer are provided. The wafer cassette includes a box body including a plurality of groups of card slots formed on sidewalls of the box body. Each group of the card slots is configured to hold a wafer and includes a wafer input terminal. The wafer cassette also includes a guide device including a plurality of groups of guide slots configured to be docked to the wafer input terminals. Each group of the guide slots and a docking group of the card slots are formed at a same floor.

Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.