The invention discloses a reticle pod having a lid and multiple pin assemblies. The pin assembly includes a movable member movable relatively to a ceiling of the lid and an elastic member configured to arrange the movable member in between the elastic member and the ceiling of the lid. In the case where the reticle pod is provided without receiving a reticle, the ceiling of the reticle pod determines the movable member stays at a first level. In the case where the reticle pod is provided with a reticle, the elastic member collaborates with the movable member such that the movable member holds the reticle at a second level that is higher than the first level.

A reticle pod is provided. The reticle pod includes a container and a fluid regulating module mounted to the container. The fluid regulating module includes a first cap, a second cap and a sealing film. The first cap and the second cap are connected to each other. A flowing path is formed between the first cap and the second cap for allowing a fluid passing through the fluid regulating module. The sealing film is positioned between the first cap and the second cap and configured for regulating a flow of the fluid passing through the flowing path.

A method for containing a reticle in a pod is provided. The method includes opening the pod such that a pressing element retained movably on the pod by a limiting cap moves to a first position, wherein a shoulder part of the pressing element between a pressure receiving part and a pressing part of the pressing element is spaced from the limiting cap. The method further includes placing the reticle in the pod such that the reticle is pressed by the pressing element.

A reticle compartment defining an enclosed interior adapted to store at least two reticles in a resticle storage portion, including an inlet port, through which a purge gas can enter the enclosed enterior, and an outlet port, through which the purge gas can exit the enclosed interior, wherein the reticle compartment further includes a first diffusor plate arranged in the enclosed interior between the inlet port and the reticle storage portion, wherein the first diffusor plate is provided with openings, through which the purge gas can flow, the openings in a central section of the first diffusor plate being provided with a larger individual opening area and/or providing a large total opening area per unit area than openings in a peripheral section of the first diffusor plate.

In some embodiments, a side storage pod of an equipment front end module is provided that includes (1) an outer enclosure having a sealing surface configured to couple to the equipment front end module; (2) a side storage pod chamber having a body with a plurality of vertically-spaced storage members each configured to support a substrate; and (3) an indexer operable to vertically move the side storage pod chamber so that different subgroups of storage members are accessible by a load-unload robot in the equipment front end module. In other embodiments, a heated side storage pod is provided enabling degassing of substrates stored therein. Methods for processing substrates are described, as are numerous other aspects.

A transportation system for semiconductor substrates includes a tray, lid and packaging bag. The tray includes a bottom and circumferential sidewalls. The tray has an opening on a top side and is configured to receive semiconductor substrates through the opening, the substrates being stacked onto each other in the tray in parallel to the tray bottom. The lid includes a cover plate and at least two arms extending from the plate. The arms are configured to be inserted into the tray between the tray sidewalls and the semiconductor substrates. The cover plate is configured to cover the tray opening when the lid is fully mounted to the tray. The packaging bag is configured to enclose the tray with the substrates stacked therein and lid arranged thereon, and to be evacuated of air and sealed such that the tray and lid arranged in the bag are vacuum sealed inside the bag.

Proposed is an EFEM configured to perform wafer transfer between a wafer storage device and process equipment. More particularly, proposed is an EFEM that prevents harmful gases inside a transfer chamber in which wafer transfer is performed from escaping out of the EFEM.

A container (1) for transporting a semiconductor wafer includes: a container body (10) having one end provided with an opening (11) and the other end provided with a mounter (12) that faces the opening (11) and on which stacked wafers are housed; and a cover (20) that closes the opening (11). The container body (10) includes: body side walls (14) having an arc shape, disposed upright on the mounter (12), sectioning a housing (13) that houses the wafers; and auxiliary walls (14a) that are disposed upright and folded toward a back surface on both edges of the body side walls (14).

A wafer storage container and a cap assembly according to an embodiment include a storage container having a space accommodating at least one wafer therein, a fastening portion having a fastening space capable of fastening a cap, and the cap having a locking portion which is formed linearly on a first side of the cap and which has an end portion provided with a first protrusion portion, the cap being configured in a structure in which the locking portion is fastened to the fastening portion. The fastening portion includes an inner wall, and a fastening hole which is formed in a first side of the fastening portion such that the locking portion is fastened thereto. The cap includes a fixing wall in close contact with the inner wall, thereby fixing the cap to the fastening portion.

The present disclosure relates to a tray assembly. The tray assembly may include a die transport tray. The die transport tray may include an inner bottom surface for accommodating a plurality of dies. The tray assembly may further include a lid. The lid may include an inner top surface, wherein the inner top surface of the lid may face the inner bottom surface of the die transport tray when the lid is assembled over the die transport tray. The lid may further include a shock absorbing material on the inner top surface for contacting the plurality of dies, if present.