The present invention relates to a buffer chamber unit for wafer processing equipment.

An electronic device manufacturing system may include a factory interface having a controlled environment. The electronic device manufacturing system may also include a load port coupled to the factory interface. The load port may be configured to receive a substrate carrier thereon and may include purge apparatus and a controller. The controller may be configured to operate the load port such that any air located around and between a substrate carrier door and the load port is at least partially or entirely purged, thus reducing or preventing contamination of the controlled environment upon the opening of the substrate carrier door by the load port. Methods of operating a factory interface load port are also provided, as are other aspects.

Provided is a substrate storage container including a valve(s) capable of controlling flow of gas without using a metallic member. The valve(s) are attached to a substrate storage container and include: a cylindrical body having an open edge and an interior space; a stopcock portion partitioning the interior space into a first space and a second space and extending to the open edge; and an elastic body covering the open edge and the stopcock portion. The first space has a first communication hole communicating with an outside of the container body. The second space has a second communication hole communicating with an inside of the container body. The elastic body controls flow of gas relative to the container body by closely contacting the stopcock portion or separating from the stopcock portion.

The present disclosure describes a method for substrate storage. The method can include respectively placing a plurality of substrates into a plurality of slots formed by a plurality of fin structures on a panel of a storage device. The method can further include binding each of the plurality of substrates to an corresponding one of the plurality of fin structures. The method can further include moving the storage device from a first location to a second location. The method can further include un-binding the plurality of substrates from the plurality of fin structures.

An embodiment of the present subject matter including a FOUP body and a FOUP cover includes: a loading and unloading part configured to load or unload the FOUP; a standby part which is provided at one side of the loading and unloading part and on which the FOUP body and the FOUP cover are separated from or coupled to each other; a cleaning chamber configured to clean the FOUP body and the FOUP cover using steam; and a robot configured to transport the FOUP body and the FOUP cover between the standby part and the cleaning chamber.

The present disclosure describes a storage device including a top panel, a bottom panel, a back panel, a front panel, and two side panels configured to form an enclosed volume. The storage device further includes multiple slots disposed at inner surfaces of the two side panels and configured to hold a substrate, a gas diffuser disposed at an inner surface of the back panel and configured to provide a purge gas to the enclosed volume, an isolation gas device disposed on an inner surface of the top panel and adjacent to a top portion of the front panel, and an isolation gas line configured to connect the isolation gas device to the gas diffuser. The isolation gas device is configured to inject the purge gas into a front portion of the storage device and in a direction from the top panel toward the bottom panel.

A storage shelf includes second shelf modules each including a second shelf board, a supply nozzle, an MFC configured to adjust a flow rate of the fluid supplied from the supply nozzle, and a third pipe connecting between the MFC and a main pipe connected to a supply source of the fluid, and suspension frames each including additional shelf supporting portions supporting the second shelf modules from below and a pair of suspending portions and a pair of additional suspending portions suspending and supporting the additional shelf supporting portions. The suspension frames are disposed at regular intervals along one direction. Each second shelf module is laid over between additional shelf supporting portions of suspension frames adjacent to each other in the one direction, and a pipe connector being connectable to the main pipe is provided with an end of the third pipe.

A reticle storage device includes a top lid having a ceiling and a cover surrounding the ceiling, and a bottom lid having a carrier and a peripheral structure surrounding the carrier. When the top lid engages with the bottom lid, a passage is defined therebetween and therefore the reticle storage device is not sealed.

A substrate container includes a shell defining an interior space and a manifold with an inlet and a gas distributing surface. The shell includes a front opening, a bottom wall, and a rear wall. The manifold is attached to the bottom wall and is closer to the front opening than the rear wall. The gas distributing surface is configured to distribute purge gas into the interior space. A method of purging an open substrate container includes supplying a first stream of purge gas to a manifold and supplying a second stream of purge gas to an interior space of the substrate container. The method also including the manifold distributing the purge gas of the first stream within the interior space of the substrate container.

Processes and systems for cleaned storage of high level cleanliness articles, such as extreme ultraviolet (EUV) reticle carriers. A decontamination chamber cleans the stored workpieces. A purge gas system prevents contamination of the articles stored within the workpieces. A robot detects the condition of the storage compartment before delivering the workpiece. A monitor device monitors the conditions of the stocker.