The present invention discloses a laminar flow device which includes a housing defining a cavity, at least one air inlet, a diffusion device and at least one uniform flow structure. The at least one air inlet is positioned within the housing. The diffusion device is positioned within the housing, and the at least one uniform flow structure is positioned within the bottom of the cavity.

An apparatus and a method for repairing defects of a semiconductor are provided in the present invention. A reaction gas is introduced into a first chamber with a specific temperature and a specific pressure, thereby performing a defect repairing process to a semiconductor element in the first chamber at a lower temperature. Moreover, the disposition of the second chamber is used to avoid the reaction gas leaking out to the environment.

A method includes disposing, by using a transport module of a workpiece storage system, a first workpiece on a first workpiece carrier; disposing, by using the transport module, the first workpiece carrier with the first workpiece in a workpiece container; disposing, by using the transport module, a second workpiece in the workpiece container, wherein the first workpiece and the second workpiece have different sizes; and transferring, by using the transport module, the workpiece container containing the second workpiece and the first workpiece carrier with the first workpiece to a stocker to store the workpiece container.

A purge configurable wafer shipper. The container includes an enclosure portion with an open side or bottom, a door to sealing close the open side or bottom. One of the door and the container portion includes an opening formed in the enclosure to provide a fluid passageway from an interior of the wafer shipper to an exterior region. The opening may include a module receiving structure that defines the fluid passageway. A sealing member is included for insertion into the module receiving structure. The sealing member has a body portion including a support flange positioned proximate a lower portion of the body portion, a circumferential groove in the exterior surface of the body portion, and an O-ring positioned at least partially within the circumferential groove.

The present invention relates to an apparatus for removing fume which includes, a wafer cassette for stacking wafers; and an exhaust for exhausting the fume of the wafers stacked in the wafer cassette, wherein the wafer cassette includes stacking shelves provided at both sides for stacking wafers; and a front opening for incoming and outgoing of the wafers which are being stacked in the stacking shelf, wherein the stacking shelves include multiple inclined ramp portions which are slanted towards the wafers stacked in the stacking shelves as they travel towards the front opening, wherein a purge gas outlet is provided in the inclined ramp portion for supplying purge gas for the wafers stacked in the stacking shelves. According to the present invention, the residual process gases on wafers can be removed efficiently.

A device for handling substrates within a semiconductor manufacturing plant having substrate processing equipments, substrate storage means, substrate transport means, and a manufacturing execution system (MES) functionally related with the substrate processing equipments, the substrate storage means and the substrate transport means, including at least one substrate storage and transport box that is transported by the transport means and stored in the storage means; at least one gas analysis device of the gases forming the internal atmosphere of the substrate storage and transport box, which produces analysis signals representative of the quantity of the critical gas that is likely to generate molecular contamination, which is present in the storage and transport box; and an execution device which pilots the transport means and the storage means, with the execution device comprising instructions for detecting a molecular decontamination need as a function of analysis signals emitted by the gas analysis device.

The safety of a worker is ensured, and the area in which purging is halted is limited to the minimum. The inner space of a device is divided into a working area and a non-working area, and purging of articles in the working area is halted and the purging of the articles in the non-working area is continued. The oxygen concentration in the working area is measured, and if the oxygen concentration of the working area decreases to a predetermined value or less, the purging of the articles in the non-working area is halted.

Containers are purged between overhead transfer vehicles and a container transfer location to or from which the containers are transferred. A travelling rail for a local vehicle is provided below a travelling rail for the overhead transfer vehicles and above the container transfer location, and a local vehicle travels along the travelling rail and includes a hoist that raises and lowers the containers. A purging table that supports the containers is provided below the travelling rail for the local vehicle so as not to block a portion over the container transfer location and a purging gas feeding device feeds a purging gas into the containers supported on the purging table.

A container is placed at a predetermined position on a purge device to prevent the container from getting caught on a nozzle. When the container is lowered and placed on the purge device, the two facing sides of the front end of the container's bottom surface and the front end of a recessed part, and the two facing sides of both left and right side ends of the container's bottom surface are guided by a front guide, side guides and a center guide. Following that, the nozzle is brought into contact with the bottom surface of the container.

In some embodiments, a side storage pod apparatus of an equipment front end module (EFEM) includes a side storage enclosure having a surface configured to couple to a side wall of a body of the equipment front end module, and an opening configured to receive substrates from the equipment front end module. The EFEM further includes a side storage chamber within the side storage enclosure having a plurality of support members configured to support substrates thereon. The EFEM further includes a plenum chamber provided proximate the side storage chamber, the plenum chamber being a separate chamber from the side storage chamber and an exhaust port coupled to the plenum chamber.