A measurement carrier includes a housing having an internal space, and a flow-rate measuring device located within the internal space. A bottom surface of the housing includes a first inflow hole, a second inflow hole, and an outflow hole, which provide fluid communication between the internal space and an outer space. The flow-rate measuring device may include a first flow-rate measuring sensor in fluid communication with the first inflow hole, and a second flow-rate measuring sensor in fluid communication with the second inflow hole.

A substrate storing container includes: a container main body; a lid body which is attachable to and detachable from a container main body opening portion, and which is able to block the container main body opening portion; and a component which is attached to the container main body or to the lid body. A connected part between the component and the container main body, the lid body or another component includes press-fit fixing portions, which are positioned by means of press fitting while being fixed to each other; and impulse welding portions which are formed by impulse welding, to maintain the positioning and fixing in the press-fit fixing portions.

A system includes a filter purge apparatus configured to supply a flushing gas to a portion of a factory interface chamber located upstream of a chamber filter to minimize moisture contamination of the chamber filter by ambient air. The filter purge apparatus is configured to supply the flushing gas in association with breach of the factory interface chamber which compromises controlled environment of the factory interface chamber.

The present disclosure provides a gas purge device and a gas purge method for purging a wafer container to clean wafers. The gas purge device includes a first nozzle and a gas gate. The first nozzle is coupled to a front-opening unified pod (FOUP) through a first port of the FOUP. The gas gate is coupled to the first nozzle via a first pipe. The gas gate includes a first mass flow controller (MFC), a second MFC, and a first switch unit. The first MFC is configured to control a first flow of a first gas. The second MFC is configured to control a second flow of a second gas. The first switch unit is coupled to the first MFC and the second MFC, and is configured to provide the first gas to the first nozzle through the first pipe or receive the second gas from the first nozzle through the first pipe according to a process configuration.

The present disclosure describes a storage device including a top panel, a bottom panel, a back panel, a front panel, and two side panels configured to form an enclosed volume. The storage device further includes multiple slots disposed at inner surfaces of the two side panels and configured to hold a substrate, a gas diffuser disposed at an inner surface of the back panel and configured to provide a purge gas to the enclosed volume, an isolation gas device disposed on an inner surface of the top panel and adjacent to a top portion of the front panel, and an isolation gas line configured to connect the isolation gas device to the gas diffuser. The isolation gas device is configured to inject the purge gas into a front portion of the storage device and in a direction from the top panel toward the bottom panel.

A wafer container includes at least one shelf and a frame. The shelf is capable of holding at least one wafer, and has at least one opening therein. The opening is at least partially exposed by the wafer when the wafer is hold by the shelf. The frame carries the shelf and allows access to the shelf.

A system is provided. The system includes a substrate container having at least two purge modules. Each purge module of the at least two purge modules includes a flow control device. The flow control device of each purge module is configured to be actuated for egress of a purge fluid. A method of actuating flow control devices of purge modules of a substrate container is provided. The method includes starting a purge process of the substrate container; streaming a purge fluid into an interior of the substrate container, the substrate container having at least two purge modules, each purge module of the at least two purge modules including a flow control device, the flow control device of each purge module being configured to be actuated for egress of the purge fluid; and actuating the flow control device for egress of the purge fluid.

The present disclosure describes a method for substrate storage. The method can include respectively placing a plurality of substrates into a plurality of slots formed by a plurality of fin structures on a panel of a storage device. The method can further include binding each of the plurality of substrates to an corresponding one of the plurality of fin structures. The method can further include moving the storage device from a first location to a second location. The method can further include un-binding the plurality of substrates from the plurality of fin structures.

Electronic device processing systems including an equipment front end module with at least one side storage pod are described. The side storage pod has a side storage container and a container plenum. A fan draws purge gas from the equipment front end module chamber into the container plenum where the purge gas is directed into the side storage container to pass over substrates stored therein and is then exhausted back into the equipment front end module chamber. Methods and systems are also disclosed.

A pod opener includes an elevating mechanism elevating the cassette in a vertical direction, a first hook member engaging with an engagement means of the cassette and supporting the cassette, a second hook member supported by the first hook member, a forward and backward movement mechanism moving the first hook member and the second hook member forward and backward with respect to the cassette, an urging member urging the second hook member upward, and an atmosphere maintaining device maintaining an internal space having the cassette disposed therein in a predetermined atmosphere and the second hook member is displaceable with respect to the first hook member.