The present disclosure relates to a tray assembly. The tray assembly may include a die transport tray. The die transport tray may include an inner bottom surface for accommodating a plurality of dies. The tray assembly may further include a lid. The lid may include an inner top surface, wherein the inner top surface of the lid may face the inner bottom surface of the die transport tray when the lid is assembled over the die transport tray. The lid may further include a shock absorbing material on the inner top surface for contacting the plurality of dies, if present.

A reticle carrier described herein is configured to quickly discharge the residual charge on a reticle so as to reduce, minimize, and/or prevent particles in the reticle carrier from being attracted to and/or transferred to the reticle. In particular, the reticle carrier may be configured to provide reduced capacitance between an inner baseplate of the reticle carrier and the reticle. The reduction in capacitance may reduce the resistance-capacitance (RC) time constant for discharging the residual charge on the reticle, which may increase the discharge speed for discharging the residual charge through support pins of the reticle carrier. The increase in discharge speed may reduce the likelihood that an electrostatic force in the reticle carrier may attract particles in the reticle carrier to the reticle. This may reduce pattern defects transferred to substrates that are patterned using the reticle, may increase semiconductor device manufacturing quality and yield, and may reduce scrap and rework of semiconductor devices and/or wafers.

A tray module capable of discharging static electricity to safely transfer display device members (e.g., components) includes: a tray configured to accommodate at least two members of a display device, at least two conductive protection films alternatingly stacked with the members of the display device, and a conductive pattern on the tray to provide a discharge path with the conductive protection films to ground.

An under boat support (UBS) includes an electrostatic discharge (ESD) safe ceramic body and a conductive body. The ESD safe ceramic body is coupled to a surface of the conductive body by an adhesive, which may be resistant to high temperatures. A plurality of springs are present within the adhesive and extend from the surface of the conductive body to a surface of the ESD safe ceramic body. For example, first ends of the plurality of springs are electrically coupled to the surface of the conductive body, and second ends of the plurality of springs, which are opposite to corresponding ones of the first ends of the plurality of springs, are electrically coupled to the surface of the ESD safe ceramic body. The plurality of springs form electrical pathways such that the ESD safe ceramic body is electrically coupled to the conductive body.

Containers for supporting one or more semiconductor devices therein may include walls positioned to at least partially surround a semiconductor device. At least one of the walls may include a radiation-shielding material. A support structure may be shaped, positioned, and configured to support the semiconductor device within the walls.

A reticle pod with antistatic capability includes a base and plural of support members. The base has a carrying surface having a recess formed thereon and defined by a bottom surface. The support members encircle the carrying surface of the base and are adapted to support a reticle. The recess is defined by a depth extending between the carrying surface and the bottom surface. The depth ranges from 300 μm to 3400 μm to thereby weaken the electrostatic force exerted upon particles on the carrying surface.

The invention discloses a reticle pod for receiving a reticle. The reticle pod includes a base and plural support device provided on the base for supporting the reticle. A first distance is defined between a peripheral area of a bottom surface of the reticle and an upward facing top surface of the base. A second distance is defined between a central area of the bottom surface of the base and the upward facing top surface of the base, wherein the central area is encircled by the peripheral area. The second distance is larger than the first distance.

The invention discloses a substrate storage apparatus having a detecting device detachably connecting to an outer pod. The detecting device includes a sensing member having a sensing terminal, a cavity and a sensor. The sensing terminal detachably connects to the outer pod such that the sensing terminal exposes in an accommodating space inside of the outer pod. The cavity receiving the sensor extends to an outside of the outer pod and the accommodating space. The cavity communicates with the accommodating space through the sensing terminal, allowing the sensor to read information regarding the accommodating space.

A manufacturing method of the ESD protection device includes the following steps. A surface treatment is performed on the substrate. A link layer is formed on the substrate after the surface treatment, wherein a material of the link layer includes a metal material. A progressive layer is formed on the link layer, wherein a material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. A composite layer is formed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×10.sup.7 to 1×10.sup.8 Ω/sq.

An ESD protection composite structure includes a link layer, a progressive layer, and a composite layer. The link layer is used for disposing the ESD protection composite structure on a substrate, wherein a material of the link layer includes a metal material. The progressive layer is disposed on the link layer, wherein the material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. The composite layer is disposed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×10.sup.7 Ω/sq to 1×10.sup.8 Ω/sq.