A reticle pod with antistatic capability includes a base and plural of support members. The base has a carrying surface having a recess formed thereon and defined by a bottom surface. The support members encircle the carrying surface of the base and are adapted to support a reticle. The recess is defined by a depth extending between the carrying surface and the bottom surface. The depth ranges from 300 ?m to 3400 ?m to thereby weaken the electrostatic force exerted upon particles on the carrying surface.

An EFEM includes a housing having a substantially closed substrate transfer space in the housing and a control part configured to perform a control of supplying an inert gas into at least the housing. The control part includes an inert gas total supply amount setting part configured to set a total supply amount of the inert gas to be supplied into the housing; a door open/purge determination part configured to determine whether a container door of a substrate storage container is in an open state and whether a purge device is performing a purge process; and an in-housing inert gas supply amount calculation part configured to calculate a supply amount of the inert gas to be supplied into the housing. The supply amount of the inert gas to be supplied into the housing is determined according to an inert gas supply amount command value determined based on a calculation result.

A wafer storage device is provided. The wafer storage device includes a floor, a ceiling, and one or more walls between the floor and the ceiling to define a wafer storage chamber for storage of one or more wafers. The apparatus includes a particle-attraction object, having a positive charge or a negative charge, in the wafer storage chamber and configured to attract particles in the wafer storage chamber.

According to various embodiments, a frame cassette may include: a housing; a mounting structure inserted in the housing, the mounting structure including a plurality of tape-frame slots, wherein each tape-frame slot is configured to receive a tape-frame, wherein the housing includes an opening to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots or to remove a tape-frame from a tape-frame slot of the plurality of tape-frame slots, and a door mounted at the housing, wherein the door is configured to close the opening of the housing to seal the interior of the housing from the exterior of the housing.

A reticle enclosure includes a base including a first surface, a cover including a second surface and disposed on the base, wherein the base and the cover form an internal space therebetween that includes a reticle, and a layer of electrostatic discharge material disposed on the first surface, wherein the electrostatic discharge material reduces electrostatic charges on the reticle.

A protection device for a substrate container includes a container door and a limiter for pushing against and securing a substrate, a support member and an elastic connecting component for engaging and securing the container body, and an antistatic member having elasticity interference to provide an electrostatic dissipation path as electrostatic protection for the substrate. The protection device for a substrate container improves a protection effect of a substrate stored in the substrate container, and prevents hazards to a substrate caused by vibration, dust, and static electricity.

A vacuum semiconductor wafer laminator system. The system comprises a fan, a first outer air duct coupled to the fan and configured to direct air blown by the fan towards a first side of a semiconductor wafer box, a second outer air duct coupled to the fan and configured to direct air blown by the fan towards a second opposing side of the wafer box, a first inner air duct coupled to the fan and configured to direct air blown by the fan towards the first side of the wafer box, a second inner air duct coupled to the fan an configured to direct air blown by the fan towards the second side of the wafer box, and a robot arm configured to pick up a semiconductor wafer from the wafer box and place the semiconductor wafer on a dicing tape.

Rechargeable wafer carrier systems and methods are provided. A rechargeable wafer carrier system includes, for instance, a housing for holding at least one wafer and at least one electronics system therein, a rechargeable power source operably connected to the housing for powering the at least one electronics system, and a charging interface for receiving a supply of power for charging the rechargeable power source. The housing may be configured for transport within an automated material handling system. Also provided are methods of charging a rechargeable wafer carrier system, which includes, for instance, providing a rechargeable wafer carrier system having at least one electronics system and a rechargeable power source, operably connecting the rechargeable wafer carrier system to a charging base, and supplying power from the charging base to the rechargeable power source.

An EFEM includes a housing having a substantially closed substrate transfer space in the housing and a control part configured to perform a control of supplying an inert gas into at least the housing. The control part includes an inert gas total supply amount setting part configured to set a total supply amount of the inert gas to be supplied into the housing; a door open/purge determination part configured to determine whether a container door of a substrate storage container is in an open state and whether a purge device is performing a purge process; and an in-housing inert gas supply amount calculation part configured to calculate a supply amount of the inert gas to be supplied into the housing. The supply amount of the inert gas to be supplied into the housing is determined according to an inert gas supply amount command value determined based on a calculation result.

The invention discloses a substrate storage apparatus having a detecting device detachably connecting to an outer pod. The detecting device includes a sensing member having a sensing terminal, a cavity and a sensor. The sensing terminal detachably connects to the outer pod such that the sensing terminal exposes in an accommodating space inside of the outer pod. The cavity receiving the sensor extends to an outside of the outer pod and the accommodating space. The cavity communicates with the accommodating space through the sensing terminal, allowing the sensor to read information regarding the accommodating space.