The invention discloses a semiconductor multi-station processing chamber. Each of the multiple station includes a downward concave accommodation defined by walls and receives a pedestal therein. The pedestal and the walls define a first gap. A showerhead plate mounted on an upper lid above the pedestal to define a processing region. A second gap for supply swiping gas is defined between the showerhead plate and the upper lid. An isolation member is liftable between the downward concave accommodation and the showerhead plate to optionally encircle a processing region defined by the pedestal and the showerhead plate or to retract back into the downward concave accommodation. Such that, when the isolation member surrounds and encircles the processing region, the station is able to be structurally isolated from its neighboring one station.

The present invention provides a vertical feeding and wafer inserting integrated machine, comprising a rack and a silicon wafer transfer device provided on the rack; a carrying-transporting water tank for carrying and transporting silicon wafers is provided on one end of the rack; the rack is further provided with a feeding unit for conveying the silicon wafers in the carrying-transporting water tank to a silicon wafer transfer belt a wafer inserting unit for inserting the silicon wafers into wafer baskets is provided on one end, away from the feeding unit, of the silicon wafer transfer device, and a wafer basket arraying mechanism is provided on the other end of the wafer inserting unit; and a washing manipulator for transferring grouped wafer baskets to a washing procedure is further correspondingly provided on the rack.

A stocker includes a transporter that travels through a traveling space within a stocker and transports an article, a pair of rails that flank the traveling space extend in parallel or substantially in parallel in a horizontal direction, platforms movable along the pair of rails, and a housing provided on a stocker outer side of a door that separates an inside and an outside of the stocker, and that houses the platforms. The pair of rails extend from the inside of the stocker to the housing through an opening directly under the door. At least one of the platforms includes a fence in an upright standing manner and an upper end of the fence is higher than an upper end of the opening. The platform that includes the fence extends across the inside of the stocker and the outside of the stocker via the opening while the fence is arranged on a stocker inner side.

A transport system includes a transport vehicle that transports an article, and a transport controller that controls the transport vehicle based on a host transport instruction received from a host controller. The transport controller includes a transport instructor which, in accordance with a host transport instruction, provides the transport vehicle with a transport instruction to transport an article at a pickup point to an unloading point, an overwriting processor which, in accordance with a host cancellation instruction to cancel the host transport instruction received from the host controller, overwrites the transport instruction provided to the transport vehicle with a move instruction which instructs to travel to a predetermined position and not to unload at the predetermined position, and provides the overwritten instruction to the transport vehicle, and a completion reporter which, upon the overwriting processor completing the overwriting, transmits to the host controller a cancellation completion report indicating the completion of the host cancellation instruction.

A cutting apparatus is provided. The cutting apparatus includes a processing chamber, a chuck table, a transferring mechanism, and a cleaning member. The chuck table is disposed in the processing chamber and configured to hold a workpiece on a chuck surface of the chuck table during a cutting process. The transferring mechanism is configured to transfer the workpiece to the chuck surface before the cutting process or transfer the workpiece away from the chuck surface after the cutting process. The cleaning member is disposed in the processing chamber, and is configured to move across and clean the chuck surface, driven by the transferring mechanism.

An ALD apparatus includes a first process chamber configured to supply a first source gas and induce adsorption of a first material film. A second process chamber is configured to supply a second source gas and induce adsorption of a second material film. A third process chamber is configured to supply a third source gas and induce absorption of a third material film. A surface treatment chamber is configured to perform a surface treatment process on each of the first to third material films and remove a reaction by-product. A heat treatment chamber is configured to perform a heat treatment process on the substrate on which the first to third material films are adsorbed in a predetermined order and transform the first to third material films into a single compound thin film.

A substrate transport apparatus including, a torsional motion driver member having an exterior perimeter circumscribing an axis of rotation of the torsional motion driver member, and a torsional motion follower member including a body portion and a bearing collar rotatably coupled to the body portion, the torsional motion follower member being coupled to the torsional motion driver member with a dimensionally substantially invariant interface, wherein the bearing collar is decoupled from the exterior perimeter of the torsional motion driver member so that the exterior perimeter, as a whole, is free of the bearing collar.

Some implementations described herein provide a method that includes loading, from a load port and into a first buffer of a multiple-buffer overhead hoist transport (OHT) vehicle, a first transport carrier storing one or more processed wafers. The method includes unloading to the load port, while the first buffer retains the first transport carrier, and from a second buffer of the multiple-buffer OHT vehicle, a second transport carrier storing one or more wafers for processing. In other implementations, the method includes loading, into a first buffer of the multiple-buffer OHT vehicle, a first transport carrier storing one or more wafers for processing, while a semiconductor processing tool, associated with a load port, is processing one or more wafers associated with a second transport carrier. The method includes positioning the multiple-buffer OHT vehicle above the load port while the multiple-buffer OHT vehicle retains the first transport carrier in the first buffer.

A transport system of the in-line coater moves the substrate holder from chamber to chamber in a direction perpendicular to the axis of its rotation and in each process chamber. The system moves the substrate holder to the working area along its axis of rotation. The process chamber has a cavity the size of which is determined by the dimensions of the substrate holder and is sufficient to place technology devices and monitoring instruments in it. In the first embodiment of the in-line coater, the supporting frame of the transport system on which the substrate holder is cantilevered, is configured to move from the chamber to the chamber both in horizontal and vertical positions. In the second embodiment of the in-line coater the supporting frame is configured to move only in a vertical position, and the in-line coater comprises additionally a substrate holder return chamber.

A device treats substrates with a liquid, which device has a conveying device by which the substrates can be conveyed in a conveying direction through a container containing a liquid. A weir has an edge over which the substrates can run and which, at least in sections, extends obliquely relative to the conveying direction of the substrates. The weir is used in the device for treating substrates with a liquid. The weir has at least one edge which extends obliquely at least in sections.