The present disclosure provides a carrying apparatus and a carrying method, the carrying apparatus includes: a carrying part configured to carry an object to be carried; an adhesive assembly disposed on the carrying part, a viscosity of the adhesive assembly is variable, and the carrying apparatus is configured to selectively adhere to or separate from the object to be carried according to a change of the viscosity; and a supporting part disposed on the carrying part and configured to support the object to be carried so that the object to be carried separates from the carrying part.

An apparatus for transferring a wafer includes a main body, a first support installed in the main body, a sensor support fixed to the first support, a finger member slidably installed along the first support to transfer the wafer and positioned at a lower level than the sensor support, three sensors each including a light emitter installed on the first support and a light receiver installed on the sensor support, the three sensors respectively configured to detect three points of an edge of the wafer seated on the finger member, and a controller connected to the three sensors, wherein the controller is configured to determine whether any of the three points of the edge of the wafer is detected from a notch of the wafer based on signals received from the sensors.

A wafer transfer device, a wafer transfer method and a cleaning module of a chemical mechanical planarization machine are provided. The wafer transfer device comprises: at least one claw clamping arm module for picking up and placing a wafer; at least one Z-axis moving module, connected to the claw clamping arm module, for performing a movement of the claw clamping arm module in a Z-axis direction; and at least one X-axis moving module, connected to a lower end of the Z-axis moving module, for performing a movement of the claw clamping arm module in a X-axis direction.

A theta robot with integrated preload system in one embodiment includes a cable-operated drive mechanism including a rotatable pulley drum, motor drive operably coupled to the drum by drive cable, and follower piston cylinder operably coupled to the drum by a follower cable. The piston cylinder may be under vacuum and operably applies a tensile load and resistance on the pulley drum via the follower cable which eliminates clearance between meshed driving and driven components of the drive mechanism. When the motor drive feeds out drive cable, the pulley drum rotates in a first rotational direction, and when the motor drive retracts drive cable, the pulley drum rotates in an opposite second rotational direction. The vacuum piston cylinder operates to keep the drive cable in a taut condition when the motor drive feeds out the drive cable. The theta robot has broad applicability to numerous workpiece fabrication processes including semiconductors.

A wafer inspection system is provided. The wafer inspection system includes: a transfer region in which a transfer device is arranged; an inspection region in which test heads for inspecting a substrate are arranged; and a maintenance region in which the test heads are maintained. The inspection region is located between the transfer region and the maintenance region, a plurality of inspection rooms accommodating the test heads are adjacent to each other in the inspection region, and the test heads are configured to be unloaded from the inspection region to the maintenance region.

A semiconductor wafer cassette warehouse transportation structure system includes a wafer cassette lift transportation structure body, a wafer cassette frame structure body, an arm structure body, an arm gripping wafer cassette structure body, and a wafer cassette warehouse structure body. The suspension support rods are suspended on a ceiling. The wafer cassette lift transportation structure body lifts the wafer cassettes to the inlet and outlet. The arm structure body grips the wafer cassettes and puts same on the tracks so that the wafer cassettes can be transported to the wafer cassette warehouse structure body to be precisely accessed. The system saves space and facilitates the access of the wafer cassettes because the wafer cassettes are stored on the wafer cassette warehouse structure body suspended on the ceiling.

A calibration object is placed at a target orientation in a station of an electronics processing device by a first robot arm, and then retrieved from the station by the first robot arm. The calibration object is transferred to an aligner station using the first robot arm, a second robot arm and/or a load lock, wherein the calibration object has a first orientation at the aligner station. The first orientation at the aligner station is determined. A characteristic error value is determined based on the first orientation. The aligner station is to use the characteristic error value for alignment of objects to be placed in the first station.

Systems and techniques for determining and correcting inter-wafer misalignments in a stack of wafers transported by a wafer handling robot are discussed. An enhanced automatic wafer centering system is provided that may be used to determine a smallest circle associated with the stack of wafers, which may then be used to determine whether or not the stack of wafer meets various process requirements and/or if a centering correction can be made to better align the wafers with a receiving station coordinate frame.

A process chamber guide, designed for linearly guiding a substrate carrier that can be displaced in the process chamber guide in a direction of guidance such that by displacement of the substrate carrier in a process position, an at least regional demarcation of a process chamber guide can be formed by the process chamber guide and substrate carrier. The invention is characterized in that the process chamber guide has a roller bearing for the substrate support and at least one sealing surface, which extends parallel to the direction of guidance and is designed and arranged in such a way that, whenever the substrate carrier arranged in the process chamber guide is in a process position, the sealing surface is spaced apart less than 1 mm from the substrate carrier. The invention further relates to a process chamber and to a method for guiding a substrate carrier in a processing position.

A pod opener includes an elevating mechanism elevating the cassette in a vertical direction, a first hook member engaging with an engagement means of the cassette and supporting the cassette, a second hook member supported by the first hook member, a forward and backward movement mechanism moving the first hook member and the second hook member forward and backward with respect to the cassette, an urging member urging the second hook member upward, and an atmosphere maintaining device maintaining an internal space having the cassette disposed therein in a predetermined atmosphere and the second hook member is displaceable with respect to the first hook member.