A first robot arm places a calibration object into a load lock that separates a factory interface from a transfer chamber using a first taught position. A second robot arm retrieves the calibration object from the load lock using a second taught position. A controller determines, using a sensor, a first offset amount between a calibration object center of the calibration object and a pocket center of the second robot arm. The controller determines a characteristic error value that represents a misalignment between the first taught position of the first robot arm and the second taught position of the second robot arm based on the first offset amount. The first robot arm or the second robot arm uses the first characteristic error value to compensate for the misalignment for objects transferred between the first robot arm and the second robot arm via the load lock.

Disclosed is a transfer plate set. More particularly, the transfer plate set serves to guide a substrate transfer unit to move, the transfer plate set including a first plate part; and a second plate part inserted and fixed to the first plate part, wherein the first plate part includes a first base; a first guide member disposed on the first base; and a receiving part formed to be stepped on a side facing the second plate part, and wherein the second plate part includes a second base; a second guide member disposed on the second base; and an insertion part formed to protrude from a side facing the first plate part and provided to be inserted into the receiving part.

A miniaturized semiconductor manufacturing system including: a housing, a lifting mechanism, a processing chamber and a transportation mechanism. The housing includes an inner space and an opening communicated with the inner space. The lifting mechanism is disposed in the inner space and includes a holder configured for a substrate to be placed thereon. The holder is movable in a first direction relative to the opening between a first position and a second position. The processing chamber is disposed in the inner space and includes a holding portion configured for the substrate to be placed thereon. The transportation mechanism is disposed between the lifting mechanism and the processing chamber and is movable in a second direction. Wherein an aspect ratio value of the housing is between 1 to 6.

A solar cell string production equipment includes first and second conveying devices, first and second carrying devices, and a transfer device. The first conveying device has a first continuous conveyor belt, the second conveying device has a second continuous conveyor belt, and the first and second continuous conveyor belts can turn and convey in the vertical direction. Back and front films are laid on the first conveying device. The first conveying device can transport the back film on the first continuous conveyor belt to the second continuous conveyor belt. The transfer device can transport the pressing tool from the terminal of the second continuous conveyor belt to the front film on the first continuous conveyor belt. The second carrying device can transport the pressing tool and front film stacked together to the second continuous conveyor belt. A solar cell string production method is further provided.

Embodiments of the present invention generally relate to the field of semiconductor, in particular to a system and method for conveying and inspecting semiconductor package. More particularly, the present invention relates to the post-seal inspection system and method that performs automatic conveyance of semiconductor package for inspection process.

The present invention provides a wafer transfer device. The wafer transfer device comprises a first supporting mechanism and a second supporting which are each provided with a picking-conveying guide structure at an outer side wall; the wafer transfer device further comprises a first picking-conveying mechanism and a second picking-conveying mechanism which are respectively movably arranged at the picking-conveying guide structure of the first picking-conveying mechanism and the picking-conveying guide structure of the second supporting mechanism; the first picking-conveying mechanism and the second picking-conveying mechanism comprise tail end execution parts facing opposite directions; the wafer transfer device further comprises a rotating mechanism and a rotating driving part, the first supporting mechanism and the second supporting mechanism are fixedly arranged at the rotating mechanism, the rotating driving part drives the rotating mechanism to rotate, and then drives at least one of the first supporting mechanism and the second supporting mechanism to rotate synchronously. The wafer transfer device can extend the picking and conveying range of a wafer, thus facilitating the improvement of the productivity. The present invention further provides a wafer transfer method.

In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

A method for detaching a liquid lamella from a substrate edge is provided. A tear-off front is configured at at least one point of the liquid lamella. A width of the liquid lamella is then reduced by guiding the tear-off front along the substrate edge. Thus, the width of the liquid lamella prior to being torn off the substrate edge can be reduced by at least 50%, as compared to an original width of the liquid lamella.

A substrate processing system includes manufacturing process equipment including a plurality of process chambers and a control server configured to control the manufacturing process equipment. When a transporting order of semiconductor substrates is transmitted from the control server to the manufacturing process equipment, the control server provides, to the manufacturing process equipment performing an Nth process cycle (where N is a natural number) in a first transporting order, a command to switch to a second transporting order from an N+1th process cycle immediately when a restriction on at least one process chamber, into which insertion of the semiconductor substrate is restricted, is lifted.

Provided is a transport vehicle system SYS1 in which: an overhead transport vehicle includes a main body, a holder, a lift driver, and a lateral extender; a port pitch P is less than the overall length VL of the overhead transport vehicle in an extending direction D; and a first portion, which is raised or lowered by the lift driver moved in a lateral direction by a lateral extender, of an overhead transport vehicle stopped at a first position P1 on a first track for transferring an article W to a first transfer location S1 is offset in the extending direction D from a second portion, which is moved in a lateral direction by means of the drive of a lateral extender, of an overhead transport vehicle stopped at a second position P2 on the second track for transferring an article W to a second transfer location S2.