In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor workpieces, a container for holding at least one semiconductor workpiece therein for transport to and from the at least one processing tool and a first transport section elongated and defining a travel direction. The first transport section has parts, that interface the container, supporting and transporting the container along the travel direction to and from the at least one processing tool. The container is in substantially continuous transport at a substantially constant rate in the travel direction, when supported by the first transport section. A second transport section is connected to the at least one process tool for transporting the container to and from the at least one processing tool.

A system performs a direct transfer of a semiconductor device die from a first substrate to a second substrate. A semiconductor device die is disposed on a first side of the first substrate. The system includes a first conveyance mechanism to convey the first substrate, and a second conveyance mechanism to convey the second substrate with respect to the first substrate. The second conveyance mechanism includes a first portion and a second portion to clamp the second substrate adjacent to the first side of the first substrate. The first portion of the second conveyance mechanism has a concave shape and the second portion of the second conveyance mechanism has a convex counter shape corresponding to the concave shape of the first portion. The system also comprises a transfer mechanism disposed adjacent to the first conveyance mechanism to effectuate the direct transfer.

A modular workstation transport apparatus is operable as one modular workstation transport apparatus in a series of modular workstation transport apparatus and includes: a first axial transport mechanism for transporting a workpiece along a first axial direction; a second axial transport mechanism for transporting the workpiece along a second axial direction; a first working area transport mechanism for transporting the workpiece between the working area and the first axial transport mechanism; and a second working area transport mechanism for transporting the workpiece between the working area and the second axial transport mechanism.

An apparatus includes a first frame to hold a wafer tape, and a second frame to hold a substrate adjacent to the first side of the wafer tape. A needle is disposed adjacent to the second side of the wafer tape and extends in a direction toward the wafer tape. A needle actuator is connected to the needle to move the needle, during a direct transfer process, to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with a second semiconductor device die. An energy-emitting device is disposed adjacent to the substrate to induce a bond between the first semiconductor device die and the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.

An apparatus for transportation of a substrate carrier in a vacuum chamber is provided. The apparatus includes a first track providing a first transportation path for the substrate carrier, and a transfer device configured for contactlessly moving the substrate carrier from a first position on the first track to one or more second positions away from the first track. The one or more second positions include at least one of a position on a second track and a process position for processing of a substrate. The transfer device includes at least one first magnet device configured to provide a magnetic force acting on the substrate carrier to contactlessly move the substrate carrier from the first position to the one or more second positions.

A floor-to-floor transport system that transports an article between different floors by using an upward path and a downward path in a vertical transporter that revolves in one direction includes, on at least one floor: a loading transport line that transports to the vertical transporter an article to be transported to another floor; a first loading opening through which the article is loaded into the upward path in the vertical transporter; a second loading opening through which the article is loaded into the downward path in the vertical transporter; a transferor that selectively transfers to the first loading opening or the second loading opening an article transported by the loading transport line; and a controller that controls the transferor depending on a destination of the article.

A system to transfer an unpackaged die directly from a die holding substrate to a transfer location on a secondary substrate. The system includes a die separation device disposed adjacent to the die holding substrate to initiate separation of the unpackaged die from the die holding substrate. An energy source is disposed adjacent to the secondary substrate to apply energy to the transfer location and affix the unpackaged die directly to the secondary substrate. A sensor detects a position and orientation of the secondary substrate with respect to the unpackaged die on the die holding substrate. A processor is in communication with the die separation device, the energy source, and the sensor. The processor is configured to cause actuation of the die separation device and the energy source according, at least in part, to transfer instructions and data received from the sensor.

Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.

A lighting component including a plurality of die transferred to the glass substrate. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. A reciprocating transfer member thrusts against a second surface of the die carrier to actuate the transfer member thereby causing a localized deflection of the die carrier in a direction of the surface of the glass substrate to position an initial die proximate to the glass substrate. The initial die transfers directly to a circuit trace on the glass substrate. At least one of the die carrier or the transfer member is then shifted such that the transfer member aligns with a subsequent die on the first surface of the die carrier. The acts of actuating, transferring, and shifting are repeated to effectuate a transfer of the multiple die onto the glass substrate.

An apparatus for performing a direct transfer of a die. The apparatus includes a first frame to hold the first substrate and a second frame to hold the second substrate. The apparatus further includes a transfer mechanism disposed adjacent to the first frame. The transfer mechanism includes a needle configured to press against the first substrate at a location collinear with the die. A controller, including one or more processors communicatively coupled with the first frame, the second frame, and the transfer mechanism, has executable instructions, which when executed, cause the one or more processors to perform operations including: determining a transfer position of the die on the first substrate via one or more sensors, and aligning the transfer position of the die with the needle of the transfer mechanism via movement of at least two of the first frame, the second frame, and the transfer mechanism.