An apparatus that directly transfers a semiconductor device die from a first substrate to a second substrate. The semiconductor device die is disposed on the first side of the first substrate. The apparatus includes a first frame to hold the first substrate, and a second frame to hold the second substrate adjacent to the first side of the first substrate. A needle is disposed adjacent to the first frame and extends in a direction toward the second side of the first substrate. A needle actuator is connected to the needle to move the needle, during a direct transfer process, to a die transfer position at which the needle contacts the second side of the first substrate to press the semiconductor device die into contact with the second substrate such that the semiconductor device die is released from the first substrate and is attached to the second substrate.

A transport system includes a track, overhead transport vehicles, and a controller. The controller provides a traveling command to travel to a destination point, to a first overhead transport vehicle that is able to receive a transport command to acquire a FOUP from a station and that is less than a first distance from the station. When a second of the overhead transport vehicles that is able to receive the transport command and is less than the first distance from the station, is detected before providing the transport command to the overhead first transport vehicle, the controller provides the traveling command to the second overhead transport vehicle. Then, the controller provides the transport command to the one of the first and second overhead transport vehicles that first passes through the destination point.

A semiconductor device die transfer apparatus includes a first frame to hold a wafer tape having a plurality of semiconductor device die disposed on a side of the wafer tape and a second frame to secure a product substrate having a circuit trace thereon. The second frame is configured to secure the product substrate such that the circuit trace is disposed facing the plurality of semiconductor device die on the wafer tape. Additionally, a rotary transfer collet is disposed between the wafer tape and the product substrate. The rotary transfer collet has a rotational axis allowing rotation from a first position facing the wafer tape to pick a die of the plurality of semiconductor device die to a second position facing the circuit trace on the product substrate to release the die, thereby applying the die directly on the product substrate during a transfer operation.

An apparatus for transferring a semiconductor die (die) from the first substrate to the second substrate. The apparatus includes a stage configured to hold a product substrate. A first bridge holds a transfer mechanism assembly. A second bridge holds a die substrate holder configured to hold the first substrate. A controller is configured to cause the first bridge and the second bridge to move to align the transfer mechanism assembly with the die on the first substrate with a transfer position on the second substrate where the die is to be transferred.

A transport system includes transport vehicles to travel along a track and transport a load, and a controller. The track includes a first main track and branch tracks connecting to the first main track via different confluence points. The controller is configured or programmed to execute departure control that causes the transport vehicles stopped at respective stop positions of the branch tracks to depart toward the first main track for each of the branch tracks. The departure control prohibits, in accordance with whether the transport vehicle is present in a certain section on the track, departure of at least one of the transport vehicles stopped at the respective stop positions of the branch tracks.

An apparatus for manufacturing a semiconductor device includes a substrate transfer unit configured to transfer a substrate, a rail unit including a driving rail extending in a first direction that the substrate transfer unit moves and a stopper on a side of the driving rail in a second direction crossing the first direction, and a lifting unit configured to move in the first direction and a third direction perpendicular to the first and second directions to remove the substrate transfer unit from the rail unit, wherein the lifting unit is configured to contact the stopper to move the stopper from a closed state to an open state.

A magnetic transfer apparatus includes: a magnetomotive force source providing magnetic flux, a first magnetic flux distribution circuit connected to one end of the magnetomotive force source, having a single input terminal and a plurality of output terminals, and distributing the magnetic flux, and a second magnetic flux distribution circuit connected to the other end of the magnetomotive force source, having a single output terminal and a plurality of input terminals, and collecting the distributed magnetic flux. The output terminals of the first magnetic flux distribution circuit are disposed to be adjacent to each other to form a pair with the input terminals of the second magnetic flux distribution circuit.

A conveyance apparatus configured to convey a substrate (100) in order to irradiate the substrate (100) with laser light for forming a line-shaped irradiation area (15a) according to an embodiment includes a levitation unit (10) configured to levitate the substrate (100) over its top surface, a holding mechanism (12) configured to hold the substrate (100), and a moving mechanism (13) configured to move the holding mechanism (12) in a direction inclined from a direction perpendicular to a longitudinal direction of the line-shaped laser light in a plan view so as to change an irradiation place of the laser light in the substrate (100).

A travelling vehicle system includes travelling vehicles and a controller. The controller includes a storage that stores a last permitted travelling vehicle, to which a passage permission is transmitted lastly and the passage permission for which is not canceled, for each direction in a branching section or a merging section included in a blocking area, stores a last canceled travelling vehicle, the passage permission for which is canceled lastly, for each direction in the blocking area, and stores the travelling vehicle, to which the passage permission in a same direction in the blocking area is transmitted lastly, as a forward travelling vehicle of a travelling vehicle waiting for the permission to pass through the blocking area at the time of transmission of the passage permission to the passage-permission waiting travelling vehicle, and a determiner that determines whether to give passage permission to the travelling vehicle waiting for the permission to pass through the blocking area based on whether the forward travelling vehicle of the passage-permission waiting travelling vehicle coincides with the last permitted travelling vehicle or the last canceled travelling vehicle for the blocking area.

A conveyance system includes a conveyance chamber including a second side wall opposite to a first side wall in a depth direction of the conveyance chamber. A robot is disposed in the conveyance chamber. The robot includes a body, a first arm, a second aim, and a hand. The body is disposed between the second side wall and a reference position in the depth direction. A second leading end of the second arm is positioned between a restricted position and the reference position in the depth direction when a first inter-axis direction and a second inter-axis direction are substantially perpendicular to the first side wall. A controller is connected to the robot to control the robot to limit entrance into an area between the first side wall and the restricted position in the depth direction.