A method for transferring a plurality of micro devices e is provided. The method includes picking up the micro devices from a carrier substrate by a transfer head, and iteratively performing a placing process. The placing process includes moving the transfer head to a position, at which an array of the micro devices is positioned over an array of receiving locations of a receiving substrate, and placing said array of the micro devices onto the array of the receiving locations of the receiving substrate.

The glue dispensing apparatus of the present invention includes a conveying device; at least one substrate moved along a predetermined direction by the conveying device; a dispensing stage located under the conveying device; and an anti-stain device coupled to the dispensing stage for providing isolation paper between the substrate and the dispensing stage. The substrate is a leadframe-type substrate. The glue dispensing apparatus further includes a glue dispensing nozzle positioned above the conveying device for applying a fluid glue material onto the substrate.

A tray supplier which performs supplying and collecting of trays includes a supply-side tray storage unit, a collection-side tray storage unit, a first tray placer and a second tray placer on which the trays are placed, and a first placer mover and a second placer mover which respectively move the tray placers between the supply-side tray storage unit and the collection-side tray storage unit, in which a first movement shaft of the first placer mover and a second movement shaft of the second placer mover are disposed parallel to each other, lifting and lowering units which lift or lower the first tray placer and the second tray placer are provided, and interference between the placer movers does not occur.

According to one embodiment, a chip transfer member includes a light-transmitting portion and a metal portion. The light-transmitting portion has a light incident surface, a light-emitting surface, and a side surface. The metal portion is provided at the side surface of the light-transmitting portion.

A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

An electronic component handler includes: an electronic component transporter transporting an electronic component in an arrangement state where a shuttle plate is arranged, the shuttle plate having a recess receiving the electronic component; a light source casting light; a light receiver receiving the light; a detector detecting presence/absence of the electronic component in the recess; and a negative pressure generator putting the recess under a negative pressure. The shuttle plate has a first flow path. The electronic component transporter has: a shuttle plate fastener having a second flow path communicated with the first flow path in the arrangement state and having the shuttle plate fixed thereto in the arrangement state; a transmission member sealing the second flow path and transmitting the light; and a driver driving the shuttle plate fastener. The negative pressure generator is coupled to the second flow path and sucks the electronic component in the recess.

An overhead transport vehicle system includes an overhead transport vehicle to convey an object, and a teaching unit to teach transfer of the object by the overhead transport vehicle to a load port on which the object is to be placed. The teaching unit includes a body including a detector to be brought into contact with a positioning pin on the load port to detect a position of the positioning pin, and a flange movable up and down with respect to the body and to be held by a holder to be raised and lowered by an elevator of the overhead transport vehicle.

A reception device for moving components along a first axis, a second axis and a third axis and that is designed to rotate in a controlled manner relative to a deposit point, at least partly about the third axis containing the deposit point, by means of a rotary drive and/or to be propelled in a controlled manner by means of at least one linear drive at least partly along one of the first, second or third axes, and/or to propel, in a controlled manner, a carrier guided by the reception device, along one of the first and/or second axes.

Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

An apparatus for routing a carrier in a processing system is described. The apparatus includes a first holding assembly attached to a vacuum chamber for transportation of the carrier along a first direction, a second holding assembly attached to the vacuum chamber for transportation of the carrier along a second direction different from the first direction, and a rotatable support for rotating the carrier from the first direction to the second direction.