A transportation head for a microchip transfer device capable of minimizing mechanical and chemical damage to a microchip, a microchip transfer device having same, and a transfer method thereby, and the transportation head includes a head body having a pickup area and a dummy area; a first protruding pin disposed in the pickup area of the head body; and a liquid droplet attached to the first protruding pin.

The present invention refers to a transport device with at least one transport system for jointly transporting at least one tool and at least one workpiece, wherein the transport system has a ceiling wall, a floor wall spaced apart from the ceiling wall, at least one side wall and at least one intermediate space between the ceiling wall and the floor wall, and wherein the intermediate space has at least one opening. In order to enable simultaneous and safe transport of one or more workpieces together with the tools required for machining and thus in particular to reduce downtimes of machining machines as well as costs, the ceiling wall or a cover plate connected therewith as well as the at least one intermediate space each have at least one holder, wherein the at least two holders are set up to receive the at least one workpiece and/or the at least one tool.

An apparatus for transferring chips from a first position to at least a second position includes: a rotatable transfer assembly including at least two transfer heads, each head for picking up a chip in the first position, and positioning the chip in the at least second position through rotation of the transfer assembly about an axis of rotation; a transfer assembly actuator for driving the transfer assembly together with the at least two transfer heads about the axis; and at least a first transfer head actuator structured for actuating at least one transfer head in a radial direction relative to the axis, the at least first transfer head actuator being mounted to the rotatable transfer assembly actuator and including an actuator element coupled to the at least one transfer head, the actuator element structured to be actuated in the direction of the axis relative to the rotatable transfer assembly actuator.

A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring a photoelectric characteristic value of each of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic value of each of the plurality of chips; providing a second load-bearing structure; weakening a first adhesion between the first portion chips and the first load-bearing structure or between the second portion chips and the first load-bearing structure; and transferring the first portion chips or the second portion chips to the second load-bearing structure.

A system includes a separation tool that separates a carrier wafer to form a plurality of chiplet carriers. The carrier wafer having sheets of thin film material attached. A sensor and processor of the system determine an orientation of the portions of the sheets of thin film material relative to the chiplets to determine a mapping therebetween. A fluid carrier of the system places the chiplet carriers on an assembly surface in a disordered pattern. The system includes a micro assembler that arranges the chiplet carriers from the disordered pattern to a predetermined pattern based on the mapping. A carrier of the system transfers the portions of the thin film material from the chiplet carriers to a target substrate.

A system includes a separation tool that separates a carrier wafer to form a plurality of chiplet carriers. The carrier wafer having sheets of thin film material attached. A sensor and processor of the system determine an orientation of the portions of the sheets of thin film material relative to the chiplets to determine a mapping therebetween. A fluid carrier of the system places the chiplet carriers on an assembly surface in a disordered pattern. The system includes a micro assembler that arranges the chiplet carriers from the disordered pattern to a predetermined pattern based on the mapping. A carrier of the system transfers the portions of the thin film material from the chiplet carriers to a target substrate.

Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

Embodiments of the present invention generally relate to the field of semiconductor, in particular to a system and method for conveying and inspecting semiconductor package. More particularly, the present invention relates to the post-seal inspection system and method that performs automatic conveyance of semiconductor package for inspection process.

A system for a semiconductor fabrication facility includes a maintenance tool, a control unit, a first track, a second track, a maintenance crane movably mounted on the first track, a plurality of first sensors disposed on the first track, an OHT vehicle movably mounted on the second track, and a second sensor on the OHT vehicle. The first sensors detect a location of the maintenance crane and generate a first location data to the control unit. The second sensor generates a second location data to the control unit.

Sheets of a thin film material are attached to a carrier wafer. The carrier wafer and the attached sheets of thin film material are separated to form chiplet carriers. Each chiplet carrier includes a portion of the sheets of thin film material attached to a portion of the carrier wafer. The chiplet carriers are placed on an assembly surface in a random pattern. The chiplet carriers are arranged from the random pattern to a predetermined pattern, and the portions of the thin film material are transferred from the chiplet carriers to a target substrate.