An end effector for transferring a tray is described. The end effector includes an end effector base attached to a vertical drive column of a tray engine. The end effector further includes a slide having multiple arms that are attached to the end effector base to support the tray, when present. The arms of the slide enable the tray to slide along a length of the end effector base. The arms face each other and extend along the length of the end effector base.

A method of transferring a micro device using a micro device transfer head is provided. The micro device transfer head includes a base arm, a first side arm and a second side arm, and the micro device is fabricated on a substrate. The method includes moving the first side arm within a sensing range of the micro device, charging the first side arm for drawing the micro device away from the substrate to move towards a space between the first side arm and the second side arm, and shortening a distance between the first side arm and the second side arm for clamping the micro device.

A transportation container is provided with a container body constructed of a top wall, a bottom wall, a rear wall, and two sidewalls forming a front opening for loading or unloading a reticle pod into or out of the container body; a lid for opening and closing the front opening; and a lift plate above the container body configured to connect to a carrier of an overhead hoist transfer (OHT) system.

Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.

A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.

The invention relates to a method and a device for transporting an arrangement of flexible circuit substrates produced on a transport substrate during the production of a laminate from the arranged circuit substrates, as well as—building thereon—a method and a device for producing a laminate of flexible circuit substrates. In the method, a film is applied to the arranged circuit substrates on the side thereof opposite the transport substrate, with the result that the film comes to lie over the transport substrate in at least two sections that are separate from each other and are not covered by a circuit substrate, and runs between them continuously over at least one of the circuit substrates. Then, the arranged circuit substrates are fixed on the transport substrate by means of the generation of a negative pressure acting on the arrangement of the circuit substrates, and which, at least in sections, directly impinges on the arrangement of the circuit substrates itself as well as, at least in sections, additionally on the film (6) and thereby in turn indirectly on at least one of the circuit substrates in the direction of the transport substrate with a pressing force with respect to the transport substrate. Then, the arrangement of circuit substrates fixed on the transport substrate by means of the pressing force is transported by moving the transport substrate. In the production method, the transport method is used for transporting the arrangement between individual manufacturing steps. The devices according to the invention are correspondingly arranged to carry out the above-mentioned method.

In accordance with some embodiments, a method for processing a semiconductor wafer is provided. The method includes transporting a carrier along with a reticle supported by the carrier in a lithography exposure apparatus. The method also includes regulating particles in the carrier through a magnetic field. In addition, the method includes removing the reticle from the carrier. The method further includes performing, using the reticle, a lithography exposure process to the semiconductor wafer in the lithography exposure apparatus.

A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.

In accordance with some embodiments, a method for processing a semiconductor wafer is provided. The method includes transporting a carrier along with a reticle supported by the carrier in a lithography exposure apparatus. The method also includes regulating particles in the carrier through a magnetic field. In addition, the method includes removing the reticle from the carrier. The method further includes performing, using the reticle, a lithography exposure process to the semiconductor wafer in the lithography exposure apparatus.

A method comprises transporting semiconductor devices between a global system and a local system, wherein an input terminal of the local system is connected to the global system, and wherein the global system comprises a plurality of stockers and a global transportation system connected to the stockers and the local system comprises a first service area, an internal buffer, a second service area and a plurality of lithography apparatuses and transporting a semiconductor device from the first service area to a lithography apparatus in the second service area.