The disclosure relates to a conveyor device which is designed to simultaneously convey a plurality of payloads, in particular wafers. Each payload is paired with a transport body (mover) which can be moved and positioned in a floating manner over a surface of a stator, and the transport body is moved and positioned preferably with respect to all six degrees of freedom. The transport body and the paired payloads are received in a sealed transport chamber, the stator is arranged below the sealed transport chamber, the floor of the transport chamber is arranged above the surface of the stator and parallel thereto, and the housing of each transport body is likewise preferably sealed.

A miniaturized semiconductor manufacturing system including: a housing, a lifting mechanism, a processing chamber and a transportation mechanism. The housing includes an inner space and an opening communicated with the inner space. The lifting mechanism is disposed in the inner space and includes a holder configured for a substrate to be placed thereon. The holder is movable in a first direction relative to the opening between a first position and a second position. The processing chamber is disposed in the inner space and includes a holding portion configured for the substrate to be placed thereon. The transportation mechanism is disposed between the lifting mechanism and the processing chamber and is movable in a second direction. Wherein an aspect ratio value of the housing is between 1 to 6.

A system for maintaining a device in a semiconductor manufacturing environment that includes a controller configured to determine a distance travelled by the device within the semiconductor manufacturing environment, where the device has a feature that selectively engages a carrier configured to carry a semiconductor wafer such that the device moves the semiconductor wafer to different processing stations within the semiconductor manufacturing environment. The system also includes an inspection component configured to inspect the device responsive to the distance traveled by the device exceeding a distance threshold, a repair component configured to repair the device responsive to a repair indication from at least one of the controller or the inspection component, and a cleaning component configured to clean the device responsive to a clean indication from at least one of the controller or the inspection component.

Provided is a transport vehicle system SYS1 in which: an overhead transport vehicle includes a main body, a holder, a lift driver, and a lateral extender; a port pitch P is less than the overall length VL of the overhead transport vehicle in an extending direction D; and a first portion, which is raised or lowered by the lift driver moved in a lateral direction by a lateral extender, of an overhead transport vehicle stopped at a first position P1 on a first track for transferring an article W to a first transfer location S1 is offset in the extending direction D from a second portion, which is moved in a lateral direction by means of the drive of a lateral extender, of an overhead transport vehicle stopped at a second position P2 on the second track for transferring an article W to a second transfer location S2.

A system for a semiconductor fabrication facility includes a maintenance tool, a control unit, a first track, a second track, a maintenance crane movably mounted on the first track, a plurality of first sensors disposed on the first track, an OHT vehicle movably mounted on the second track, and a second sensor on the OHT vehicle. The first sensors detect a location of the maintenance crane and generate a first location data to the control unit. The second sensor generates a second location data to the control unit.

A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.

A semiconductor fabrication facility (FAB) is provided. The FAB includes a group of processing tools. The FAB also includes a number of sampling tubes connecting the group of processing tools. In addition, the FAB includes a sampling station which includes a connection port, a valve manifold box and a controller. The valve manifold box is used for switching a gas sample from one of the processing tools to the connection port. The controller is sued for controlling the connection of the valve manifold box and the sampling tubes. The FAB further includes a metrology module. The metrology module is connected to the connection port of the sampling station and is used to perform a measurement of a parameter related to the gas sample.

In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.

An installation useful for economically polishing wafers has at least two polishing machines for simultaneous double-sided polishing of semiconductor wafers; one or more carriers lying on a polishing pad of a polishing machine for receiving semiconductor wafers; an overhead-mounted transport system for delivering a cassette containing semiconductor wafers; a vertical transport system for taking cassettes from the transport system, containing comprising an integrated wafer lifter; an autonomous robot having a manipulator for taking a semiconductor wafer from the wafer lifter and for inserting the semiconductor wafer into one of the recesses, and after polishing, for lifting the semiconductor wafer from the recess;
an x/y linear unit assigned to each polishing machine, having a wafer gripper for taking a wafer from the manipulator and for depositing the wafer into a wet transport container with integrated wafer receiver; and
a driverless transport vehicle for transporting transport container to a cleaning unit.

A robotic manipulator for handling a cassette and an automated cassette transport device are disclosed, the device including a mechanical arm (1), an end actuator (2) at an end of the mechanical arm (1) and a vision-based locating assembly (3) on the end actuator (2). On the one hand, the vision-based locating assembly (3) can determine the position of a flange of the cassette, thereby identifying the cassette. In other words, the cassette can be identified based on a feature of the cassette itself. This dispense with a separate locating marker while improving cassette measuring and handling accuracy. On the other hand, transportation of the cassette is allowed by complementary retention of its flange on a recessed surface of the end actuator (2).