H01L21/67727

WAFER TRANSPORT ASSEMBLY WITH INTEGRATED BUFFERS

A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.

METHOD AND SYSTEM TO ROUTE SEMICONDUCTOR PARTS TO MACHINES DISTRIBUTED IN A MULTI-BUILDING PLANT
20200401118 · 2020-12-24 ·

A system and method relating to determining, by a processing device, a first number of parts waiting to be processed in a subsequent step by a plurality of machines housed in a plurality of buildings interconnected by rails, determining a second number of parts that the plurality of machines housed in the plurality of buildings is capable of processing in the subsequent step of the manufacture process over a determined period of time, calculating a capability occupancy ratio based on the first number and the second number for each one of the plurality of buildings, determining a target building of the plurality of buildings based on the capability occupancy ratio, and causing to dispatch the part to the target building via the rails.

CONVEYING SYSTEM AND METHOD FOR OPERATING THE SAME
20200381277 · 2020-12-03 ·

A method includes providing a rail, a first conveying unit movably mounted on the rail, and a central controller configured to control the first conveying unit; displacing the first conveying unit along the rail at a first speed; obtaining a first vibration measurement upon the displacement of the first conveying unit along the rail at the first speed; analyzing the first vibration measurement; transmitting a first signal based on the analysis of the first vibration measurement to the central controller; providing a second conveying unit movably mounted on the rail; transmitting a first feedback signal based on the first signal from the central controller to the second conveying unit; and displacing the second conveying unit along the rail at a second speed based on the first feedback signal.

Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

There is provided a technique that includes: at least one process chamber configured to be capable of processing a substrate; one or more supports configured to be capable of supporting the substrate; a transporter configured to be capable of transporting the one or more supports; a transfer chamber configured to be capable of transferring the substrate; a transport chamber that is adjacent to the transfer chamber and the at least one process chamber and is configured to be capable of moving the transporter; and a delivery chamber that is disposed in the transport chamber and is configured to be capable of delivering the one or more supports.

INLINE VACUUM PROCESSING SYSTEM WITH SUBSTRATE AND CARRIER COOLING
20200350188 · 2020-11-05 ·

A substrate processing system, including a processing module having at least one sputtering source; a first buffer module positioned on a first side of the processing module; a second buffer module positioned on a second side of the processing module directly opposite the first side; a first cooling module attached to the first buffer module; a second cooling module attached to the second buffer module; a transport system transporting substrate carriers in a straight line through the first cooling module, the first buffer module, the processing module, the second buffer module and the second cooling module; wherein the system is arranged linearly in the order: first cooling module, the first buffer module, the processing module, the second buffer module and the second cooling module.

CONVEYANCE SYSTEM
20200343118 · 2020-10-29 ·

A conveyance system includes a traveling area and a suspension traveling vehicle. The traveling area includes a grid area and a linear area. In the grid area, since first tracks are disposed side by side and second tracks are disposed side by side so that the first tracks and the second tracks intersect, the grid area includes unit blocks of the same shape or substantially the same shape surrounded by the first tracks and the second tracks. Both the first tracks and the second tracks surrounding the unit blocks are provided with an interstice that allows a supporting body to pass, and the interstice is perpendicular or substantially perpendicular to a longitudinal direction of each track. A traveling direction is the same or substantially the same as the first direction or the second direction in the linear area, and the interstice perpendicular or substantially perpendicular to the traveling direction is not provided in the linear area.

CONVEYANCE SYSTEM
20200343111 · 2020-10-29 ·

A conveyance system for conveying a workpiece to each of a plurality of processing apparatuses includes a conveyance passage disposed in a space directly above the processing apparatus over the plurality of processing apparatuses, an automated conveying vehicle for traveling on the conveyance passage, the automated conveying vehicle including a workpiece storage member having a housing space for housing a workpiece therein, a traveling member having a storage space for storing the workpiece storage member therein, a traveling mechanism mounted on the traveling member, a lifting and lowering mechanism disposed in the traveling member for lifting and lowering the workpiece storage member while suspending the workpiece storage member from above, and a receiver for receiving control signals.

Wafer transport assembly with integrated buffers

A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.

In-line system for mass production of organic optoelectronic device and manufacturing method using the same system
10790466 · 2020-09-29 ·

An in-line system for mass production of an organic optoelectronic device is disclosed. The in-line system includes a patterned holder, a first chamber, and a second chamber. The patterned holder is for holding a substrate covered with a first electrode layer and a contact electrode layer, in which the first electrode layer and the contact electrode layer are partially shielded by the patterned holder. The first chamber is for forming an organic layer on portions of the first electrode layer and the contact electrode layer that are not shielded by the patterned holder. The second chamber is aligned with the first chamber and is for forming a second electrode layer on the organic layer.

TRANSPORTATION FACILITY
20240010251 · 2024-01-11 ·

A controller outputs, to a transport vehicle, a forward movement command for moving in the forward direction along a transport path toward a destination, and a reverse movement command for moving in a reverse direction along the transport path toward the destination. When a target task occurs, the controller determines a transport vehicle to execute the target task among a plurality of transport vehicles, while also including, as a candidate, a transport vehicle located on a downstream side of the transport path relative to the destination at a timing when the target task occurs.