Patent classifications
H01L21/67727
Reticle Transfer System and Method
A method comprises transporting semiconductor devices between a global system and a local system, wherein an input terminal of the local system is connected to the global system, and wherein the global system comprises a plurality of stockers and a global transportation system connected to the stockers and the local system comprises a first service area, an internal buffer, a second service area and a plurality of lithography apparatuses and transporting a semiconductor device from the first service area to a lithography apparatus in the second service area.
Substrate processing apparatus
A substrate processing apparatus including a frame and at least one substrate transport arm having at least one end effector, each end effector having a base portion, a first and second substrate support tines mounted to and dependent from the base portion where at least one of the first and second substrate support tines is movable relative to the base portion, each of the first and second substrate support tines having respective substrate contacts configured to contact and support a substrate held by the end effector between the respective contacts of the first and second substrate support tines at a substrate support seat dimension span between the substrate contacts of the first and second substrate support tines, and an end effector drive section configured to vary a distance between the first and second substrate support tines relative to each other on the fly.
Article transport facility
A travelling path includes a first path and a second path that branches off from or merges with the first path at a connection position of the first path. A management area and a check area are provided for the first path. The management area includes a section from the connection position to a position that is at a first preset distance upstream of the connection position, and a section from the connection position to a position that is at a second preset distance downstream of the connection position. The check area includes a section from a preset position to a position that is at a fourth preset distance upstream of the preset position. In a state where an article transport vehicle that includes a control unit is located in the check area, the control unit determines whether or not the article transport vehicle is in a leading state where no other article transport vehicle is present forward of the article transport vehicle in the check area.
Article transport facility
An article transport facility includes a transport device which has a connecting portion connected to the storage device, and which is configured to transport an article. The connecting portion is located on the first side with respect to the first path whereas a subject path is located on the second side with respect to the first path. The transporting path of an article by the transport device is so located to cross the first path in plan view and to extend at least from the connecting portion and to the second side with respect to the first path. A first transfer portion to or from which an article is transferred by a transport vehicle traveling along the subject path is set in a portion of the transporting path that is located on the second side with respect to the first path.
PICK-AND-PLACE APPARATUS AND METHOD
Aspects of the present disclosure relate to a pick-and-place apparatus that is configured to cause components to be placed on a substrate in a number of passes, and during each pass, components among a plurality of components are placed on the substrate in a respective placement pattern among a collection of interleaved placement patterns.
SYSTEM FOR A SEMICONDUCTOR FABRICATION FACILITY AND METHOD FOR OPERATING THE SAME
An automatic cleaning unit for AMHS includes a plurality of sensors disposed on OHT rails. The sensors are configured to define a cleaning zone and to detect a location of an OHT vehicle. The automatic cleaning unit further includes a vacuum generator and a top cleaning part installed over the OHT rails in the cleaning zone. The top cleaning part is coupled to the vacuum generator. The vacuum generator is turned on to perform a vacuum cleaning operation when the sensors detect the OHT vehicle entering the cleaning zone.
Transport system and transport method
A track in a transport system includes a standby section associated with a certain processing apparatus to allow a transport vehicle to wait. When determining a transport request to transport a FOUP to a load port of the certain processing apparatus exists, the controller allocates, to the transport vehicle, a first transport command to transport the FOUP to the standby section. When reaching the standby section, the transport vehicle waits while holding the FOUP. Subsequently, when determining that the FOUP is transportable to the load port of the certain processing apparatus, the controller allocates, to the transport vehicle, a second transport command to transport the FOUP to the load port of the certain processing apparatus.
Systems and methods for sensory automated material handing
In an embodiment an automated material handling system (AMHS) for a semiconductor fabrication facility (FAB) includes: a sensor supported by a rail, wherein the sensor is configured to collect sensor data characterizing a vehicle that moves along the rail, wherein the vehicle is configured to carry at least one wafer; and a monitoring module configured to: detect a trigger event based on the sensor data, and initiate a remediation action in response to the trigger event.
Electronic Component Handler And Electronic Component Tester
An electronic component handler includes: an electronic component transporter transporting an electronic component in an arrangement state where a shuttle plate is arranged, the shuttle plate having a recess receiving the electronic component; a light source casting light; a light receiver receiving the light; a detector detecting presence/absence of the electronic component in the recess; and a negative pressure generator putting the recess under a negative pressure. The shuttle plate has a first flow path. The electronic component transporter has: a shuttle plate fastener having a second flow path communicated with the first flow path in the arrangement state and having the shuttle plate fixed thereto in the arrangement state; a transmission member sealing the second flow path and transmitting the light; and a driver driving the shuttle plate fastener. The negative pressure generator is coupled to the second flow path and sucks the electronic component in the recess.
Article Transport Device
The article transport device includes a transport vehicle configured to move back and forth between a receiving location and a delivery location, and a load receiving base that is provided at at least the receiving location. The transport vehicle includes a transport placing base on which an article is to be placed, and a lift device configured to raise and lower the transport placing base to a first height and to a second height that is lower than the first height. The load receiving base is a base on which an article is to be placed, and is fixed at a third height that is between the first height and the second height. When the transport vehicle performs restoration movement to move from the delivery location to the receiving location, the lift device performs a restoration operation that differs in accordance with whether or not an article is present on the load receiving base at the receiving location.