A semiconductor wafer cassette warehouse transportation structure system includes a wafer cassette lift transportation structure body, a wafer cassette frame structure body, an arm structure body, an arm gripping wafer cassette structure body, and a wafer cassette warehouse structure body. The suspension support rods are suspended on a ceiling. The wafer cassette lift transportation structure body lifts the wafer cassettes to the inlet and outlet. The arm structure body grips the wafer cassettes and puts same on the tracks so that the wafer cassettes can be transported to the wafer cassette warehouse structure body to be precisely accessed. The system saves space and facilitates the access of the wafer cassettes because the wafer cassettes are stored on the wafer cassette warehouse structure body suspended on the ceiling.

Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.

A first carriage is provided with a support rail that supports a main body, and is configured to travel together with a second carriage that includes the main body along the first path, in a supporting state that is a state of supporting the main body, using the support rail. In a state where the first carriage is located at a connection part of the first path, which is connected to the second path, the support rail is located on an extension line of the travel rail.

A travel path of an article transport facility provided with a plurality of article transport vehicles that travel along the travel path and transport articles, and a control device that controls operation of the article transport vehicles includes a path set in an inspection area for causing a target transport vehicle designated as an inspection target from among the plurality of article transport vehicles to travel along. The target transport vehicle includes a sensor that detects behavior of the target transport vehicle during travel. The control device controls the plurality of article transport vehicles such that only the one target transport vehicle is present in the inspection area, and causes the target transport vehicle to travel in the inspection area in an inspection travel pattern prescribed in advance.

A transport system includes a track, transport vehicles, an area controller, buffers, and a host controller. The area controller, when a number of the transport vehicles present within a control area is a predetermined number and when receiving a first transport command to convey an article from a transfer port to a transport destination outside the control area from the host controller, stores the first transport command and transmits a report that the first transport command is not able to be assigned to the transport vehicle to the host controller. The host controller, when receiving the report, when the buffer is present, transmits a command to delete the stored first transport command to the area controller, generates a second transport command to convey the article from the transfer port to the buffer, and transmits the second transport command to the area controller.

A transport vehicle system includes transport vehicles and a controller to allocate a transport instruction to the transport vehicles. The controller is configured or programmed to allocate a first transport instruction when the first transport instruction with a first priority occurs in a state in which a number of vacant transport vehicles is a first number, and to not allocate a second transport instruction to vacant transport vehicles when the second transport instruction with a second priority lower than the first priority occurs in a state in which the number of vacant transport vehicles is the first number.

Disclosed are semiconductor carrier storage systems, semiconductor fabrication systems including the same, and/or semiconductor fabrication methods using the same. The semiconductor carrier storage system comprises storage ports each of which accommodates a semiconductor carrier, a shuttle rail that extends in a horizontal direction on a side of the storage ports, an internal carrier shuttle that moves along the shuttle rail and transfers a semiconductor carrier to each of the storage ports, and an upper transport that receives the semiconductor carrier from an overhead hoist transport (OHT). The internal carrier shuttle includes a shuttle body coupled to the shuttle rail, a transfer wheel that connects the shuttle body to the shuttle rail, a gripper that holds the semiconductor carrier, and a hoist that vertically extends between the shuttle body and the gripper and drives the gripper to vertically move.

A substrate transfer system capable of performing efficient distribution exchange between fabricating facilities is provided. The substrate transfer system includes a lower rail, an upper rail which is located above the lower rail from a ground plane, and extends to be parallel to the lower rail, a conveyor which extends to intersect the lower rail and the upper rail, below the lower rail, a first lower transport unit which transports a first carrier along the lower rail and unloads the first carrier onto the conveyor, and a first upper transport unit which transports a second carrier along the upper rail and unloads the second carrier onto the conveyor, wherein the conveyor includes a linear module which moves the first carrier and the second carrier in a linear direction, and a turning module which turns the first carrier and the second carrier.

A substrate processing system configured to process substrates includes a substrate transport assembly that encloses a controlled environment defined within a continuous transport volume and at least two process modules coupled to the substrate transport assembly. The substrate transport assembly is configured to transport substrates to and from the at least two process modules through the continuous transport volume. At least two gas boxes are configured to deliver gas mixtures to the at least two process modules. An exhaust duct configured to selectively evacuate the at least two process modules through the at least two gas boxes. Surfaces of the at least two gas boxes include perforations configured to allow gases to flow from the at least two gas boxes into the exhaust duct.

A semiconductor fabrication facility (FAB) is provided. The FAB includes a group of processing tools. The FAB also includes a number of sampling tubes connecting the group of processing tools. In addition, the FAB includes a sampling station which includes a connection port, a valve manifold box and a controller. The valve manifold box is used for switching a gas sample from one of the processing tools to the connection port. The controller is sued for controlling the connection of the valve manifold box and the sampling tubes. The FAB further includes a metrology module. The metrology module is connected to the connection port of the sampling station and is used to perform a measurement of a parameter related to the gas sample.