An apparatus including a drive having motors and at least two coaxial drive shafts; an arm connected to the drive, where the arm is configured to support at least one substrate thereon; and a transmission connected between the drive and the arm, where the transmission includes an eccentric bearing and a linkage, where the linkage is connected between a first one of the coaxial drive shafts and the arm, where the eccentric bearing is connected to a second one of the coaxial drive shafts, where the arm comprises an aperture, where the eccentric bearing is located in the aperture, and where the eccentric bearing is configured to contact the arm in the aperture.

Exemplary substrate processing systems may include a factory interface and a load lock coupled with the factory interface. The systems may include a transfer chamber coupled with the load lock. The transfer chamber may include a robot configured to retrieve substrates from the load lock. The systems may include a chamber system positioned adjacent and coupled with the transfer chamber. The chamber system may include a transfer region laterally accessible to the robot. The transfer region may include a plurality of substrate supports disposed about the transfer region. Each substrate support of the plurality of substrate supports may be vertically translatable. The transfer region may also include a transfer apparatus rotatable about a central axis and configured to engage substrates and transfer substrates among the plurality of substrate supports. The chamber system may also include a plurality of processing regions vertically offset and axially aligned with an associated substrate support.

A robot for transferring a wafer is disclosed. A blade of the robot includes a first sensor on an upper surface of the blade and the second sensor on a back surface of the blade. The first sensor is operable to align the blade with a wafer. The second sensor is operable to align the blade with a holder that holds the wafer.

An aligner device includes a robot hand, a lifting mechanism, sensors, a misalignment calculating unit, an x-y misalignment correcting unit, and a θ misalignment correcting unit. The robot hand includes vertically aligned hand members each configured to hold a planar workpiece. The lifting mechanism moves planar workpieces transported by the robot hand up from and down to the hand members, respectively. Each of the sensors, vertically spaced apart from each other, has a downward sensor surface to capture the outline of a planar workpiece brought close to the sensor surface by the workpiece lifting mechanism. The misalignment calculating unit calculates, by using the images of the captured outline shapes of the planar workpieces, an amount of positional misalignment of each planar workpiece with a reference position in X, Y and θ directions. The X-Y misalignment correcting unit corrects the misalignment of each planar workpiece in the X and Y directions based on the amount of X-Y direction misalignment calculated by the misalignment calculating unit. The θ misalignment correcting unit corrects the misalignment of each planar workpiece in the θ direction based on the amount of θ misalignment of the planar workpiece.

The substrate treating apparatus includes a liquid supply unit for supplying a treating liquid to a substrate supported by a support unit, the liquid supply unit includes a nozzle member for discharging the treating liquid; and a driving member for moving the nozzle member to a standby position and a process position, the nozzle member includes a body having a buffer space and a discharge port configured to discharge the treating liquid; and a rotation member for changing the body between a first state and a second state by a rotation, the first state is a state at which a treating liquid filled in the buffer space is maintained so the treating liquid does not flow to the discharge port, and the second state is a state at which the treating liquid filled in the buffer space is discharged to an outside of the body through the discharge port.

A substrate processing method is provided, which includes: a sulfuric acid immersing step of immersing a plurality of substrates in a sulfuric acid-containing liquid within a sulfuric acid vessel; a transporting step of taking out the substrates from the sulfuric acid vessel and transporting the substrates to an ozone gas treatment unit; and an ozone exposing step of exposing the substrates transported to the ozone gas treatment unit to an ozone-containing gas. The ozone gas treatment unit may include a gas treatment chamber which accommodates the substrates. The ozone exposing step may include the step of placing the substrates taken out of the sulfuric acid vessel in a treatment space within the gas treatment chamber to expose the substrates to the ozone-containing gas.

A substrate transport arm including a first link; a second link rotatably connected to the first link; a third link rotatably connected to the second link at a wrist joint; and a mechanical transmission having a pulley. The third link includes an end effector configured to support a substrate thereon. The mechanical transmission is connected to the third link to control rotation of the third link on the second link. The mechanical transmission is configured to control rotation of the third link as a function of an angle between the first and second links such that, as the first and second links are rotated relative to each other, the wrist joint follows a wrist path which includes a curved portion, and where a center of the substrate supported on the end effector is moved along a substantially straight substrate path as the wrist joint follows the curved portion.

A loadlock apparatus includes a loadlock chamber including a first opening and a second opening separated in a vertical direction; a first slit valve including a first valve plate configured to move between a first open position where the first opening is open and a first closed position where the first opening is closed, the first open position being a position moved downward from the first closed position; and a second slit valve including a second valve plate configured to move between a second open position where the second opening is open and a second closed position where the second opening is closed, the second open position being a position moved upward from the second closed position.

A substrate processing system includes a load-lock module including load-lock module stages, a process module including process module stages, a vacuum transfer module that connects the load-lock module to the process module, a first transfer device that transfers substrates from the load-lock module stages to the process module stages, the first transfer device being provided in the vacuum transfer module, a second transfer device that transfers the substrates to the load-lock module stages, and a processor. The processor is configured to perform teaching a position at which the first transfer device receives the substrates from the load-lock module, teaching a position at which the first transfer device delivers the substrates to the process module, measuring shift amounts between the process module stages and the substrates mounted thereon, and correcting positions at which the second transfer device delivers the substrates to the load-lock module stages based on the measured shift amounts.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a treating bath having an accommodation space for accommodating a treating liquid; a support member configured to support at least one substrate in a vertical posture at the accommodation space; and a posture changing robot configured to change a posture of a substrate immersed in the treating liquid from the vertical posture to a horizontal posture, and wherein the posture changing robot comprises: a body configured to hold the substrate thereon; and a liquid supply member configured to supply a wetting liquid to the substrate placed on the body.