A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

In an embodiment, the present invention discloses cleaned storage processes and systems for high level cleanliness articles, such as extreme ultraviolet (EUV) reticle carriers. A decontamination chamber can be used to clean the stored workpieces. A purge gas system can be used to prevent contamination of the articles stored within the workpieces. A robot can be used to detect the condition of the storage compartment before delivering the workpiece. A monitor device can be used to monitor the conditions of the stocker.

A transfer robot assembly arranged within an ATV transfer module includes a transfer robot that includes an end effector and one or more arm segments connected between the end effector and a transfer robot platform. A first robot alignment arm is connected to the transfer robot platform. A second robot alignment arm is connected to the first robot alignment arm and to a mounting chassis of the ATV transfer module. The transfer robot assembly is configured to actuate the first robot alignment arm and the second robot alignment arm to raise and lower the transfer robot to adjust a position of the transfer robot in a vertical direction and in a horizontal direction. The transfer robot is configured to fold into a folded configuration having a narrow profile occupying less than 50% of an overall depth of the ATV transfer module.

An object of the invention is to realize a high transfer throughput in a wafer transfer apparatus in which a wafer transfer robot transfers a wafer via an aligner. A wafer transfer apparatus includes a wafer transfer robot, and a separation dimension between a pair of wafer holding rods forming a finger of the wafer transfer robot is set to be larger than a dimension of a body portion of an aligner in a width direction provided in the wafer transfer apparatus. In addition, an elevating mechanism provided in the wafer transfer apparatus is configured to be able to move the finger to below the body portion of the aligner, thereby achieving the object of the invention.

Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

A correction device for wafers and rotational drive mechanism of the wafers and a correction method thereof. The correction device includes a first robotic arm, an image capturing assembly and a wafer locating member installation/uninstallation mechanism disposed on the first robotic arm. The correction device further includes a second robotic arm and a wafer taking/placing mechanism disposed on the second robotic arm. The first robotic arm drives the image capturing assembly and the wafer locating member installation/uninstallation mechanism to move to a main correction mechanism to correct the image capturing range and the operation position thereof. The second robotic arm drives the wafer taking/placing mechanism to move to the main correction mechanism to correct the operation position thereof. The wafer taking/placing mechanism moves the wafer to a wafer correction mechanism to read the data of the wafer and adjust the wafer to a true angular position.

A workpiece handling system includes a carrier, a lower imaging device, and a transfer mechanism. The carrier is configured to carry at least one workpiece. The lower imaging device is disposed beside the carrier. The transfer mechanism is movably disposed over the lower imaging device and the carrier, wherein the transfer mechanism includes an end effector configured to pick and place the at least one workpiece and an upper imaging device disposed beside the end effector. A method of calibrating a workpiece handling system and a method of manufacturing a semiconductor package are also provided.

A wafer transport carrier includes various components to provide improved air sealing to reduce air leakage into the wafer transport carrier. The wafer transport carrier may include a housing having a hollow shell that contains a vacuum or an inert gas to minimize and/or prevent humidity and oxygen ingress into the wafer transport carrier, a wafer rack that is integrated into the shell of the housing to minimize and/or prevent air leakage around the wafer rack, and/or an enhanced magnet-based door latch to provide air sealing around the full perimeter of the opening of the housing. These components and/or additional components described herein may reduce and/or prevent debris, moisture, and/or other types of contamination from the semiconductor fabrication facility from entering the wafer transport carrier and causing wafer defects and/or device failures.

An EFEM includes a housing having a substantially closed substrate transfer space in the housing and a control part configured to perform a control of supplying an inert gas into at least the housing. The control part includes an inert gas total supply amount setting part configured to set a total supply amount of the inert gas to be supplied into the housing; a door open/purge determination part configured to determine whether a container door of a substrate storage container is in an open state and whether a purge device is performing a purge process; and an in-housing inert gas supply amount calculation part configured to calculate a supply amount of the inert gas to be supplied into the housing. The supply amount of the inert gas to be supplied into the housing is determined according to an inert gas supply amount command value determined based on a calculation result.

A gripper arrangement adapted for gripping a cleanroom container, such as a FOUP, FOSB or reticle container and a method therefore, includes: a gripper adapted to grip the cleanroom container; a lifting unit comprising a first motor for lifting the gripper; at least one cord connecting the gripper with the lifting unit, wherein the at least one cord is driven by the first motor; a second motor for rotating at least a portion of the gripper with respect to the lifting unit around the vertical axis; wherein the gripper comprises engagement elements and the lifting unit comprises complementary engagement elements adapted to engage with the engagement elements for preventing a rotation around the vertical axis of the gripper with respect to the lifting unit; wherein the gripper comprises an upper gripper element and a lower gripper element; wherein the lower gripper element is adapted for supporting the top flange of the cleanroom container; and the lower gripper element comprises an opening that can be passed over the upper flange of the cleanroom container and at least one recess formed at least partially around the opening for accommodating the upper flange of the cleanroom container.