A method and apparatus for aligning components within a processing module are described herein. The components include a substrate transfer device, a plurality of support chuck assemblies, and adjustable bushings disposed in the processing module. The substrate transfer device includes support arms with heads configured to passively correct the location of a substrate therein. The orientation of each of the support arms of the substrate transfer device is adjusted to align with each of the support chuck assemblies. The location of a process station is then adjusted to align with one of the support chuck assemblies by calibrating the adjustable bushings which correspond to each process station.

A load port includes a first pin projecting on a dock plate and provided on the dock plate so as to be pushed down, and a first detection unit provided on the base portion and configured to detect that the dock plate is located at a first position. The first detection unit includes a movable member capable of displacing in a moving direction of the dock plate, and a first sensor configured to detect the displacement of the movable member. The movable member is arranged at a position to abut against the first pin that is in a pushed down state in a process in which the dock plate moves from a second position to the first position.

Disclosed are techniques and systems for automatically determining and correcting the levelness of a wafer handling robot end effector. The systems may use a tilt sensor or a gravitational field sensor which may be calibrated to the wafer handling robot. The output from the tilt sensor may be used to determine or estimate the tilt of an end effector of the wafer handling robot and to perform correctional positioning to reduce or eliminate the tilt, to automatically teach certain positions that have reduced tilt, to perform health checks on the robot, provide feedback to a user, etc.

A method of a handling semiconductor wafers in a space of a semiconductor wafer processing facility includes: loading a cassette containing at least one semiconductor wafer into a storage buffer of a load port; measuring, from within the storage buffer, a position of a selected at least one semiconductor wafer being retrieve from the cassette residing in the storage buffer; and determining, at least in part based on said measuring, a variation of the position of the selected semiconductor wafer from a nominal position.

A transport system includes a robot, sensors (an aligner sensor, a protrusion detecting sensor) and a controller. The robot having a hand which supports a wafer and transports the wafer to an aligner apparatus. The sensor detects the position of the wafer before the robot delivers the wafer to the aligner apparatus while supporting the wafer on the hand. The controller determines the positional deviation of the wafer based on a detection value of the sensor.

The inventive concept provides a transfer assembly. The transfer assembly includes a transfer robot configured to take out the transfer object stored at the cassette and to transfer in a first direction to the target position; and a guide unit providing a transfer passage for transferring the transfer object, and wherein the guide unit comprises: a first guide member provided with its lengthwise direction in the first direction; and a second guide member provided with its lengthwise direction in the first direction, and space apart from the first guide member in a second direction perpendicular to the first direction the first guide member and the second member defining the transfer passage therebetween, and wherein at least a portion of the first guide member is movable such that a width of the transfer passage is changeable by the movement of the at least a portion of the first guide member.

A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.

A transportation system of a cassette comprises a port and a system controller. The port accommodates a cassette carrying a glass substrate, and the port includes displacement sensors for sensing a position of a cassette. The system controller calculates a distortion amount of the cassette using sensed values of the cassette and determines if the cassette is in a normal settlement status by comparing the distortion amount with a tolerance value. Therefore, the position of the cassette can be automatically taught without clamping operation of a clamping device clamping the cassette disposed in the port, thereby preventing defects of the glass substrate by removing various defect-causing factors such as particles and static electricity that may occur during a conventional clamping operation. In particular, quality defects of OLED can be eliminated by preventing particles and static electricity that affect product quality defects in the OLED manufacturing process.

The present invention provides a substrate treating apparatus including: a support unit for supporting and rotating a substrate on which a first pattern and a second pattern different from the first pattern are formed; a liquid supply unit for supplying a treatment liquid to the substrate supported on the support unit; and a heating unit for heating any one of the first pattern and the second pattern.

A substrate conveying robot has a robot arm including an end effector having a substrate holding unit holding a substrate, arm drive unit for driving the robot arm, an elevating drive unit for elevatingly driving the end effector, a robot control unit controlling the arm drive unit, the elevating drive unit, and the substrate holding unit, and a substrate detection unit having a substrate detection unit which detects a vertical position of the substrate and elevates coordinately with an elevating operation of the end effector. By this configuration, a vertical position of a substrate to be conveyed is detected with high accuracy so that a robot operation can be controlled based on the detection result.