A loadlock apparatus includes a loadlock chamber including a first opening and a second opening separated in a vertical direction; a first slit valve including a first valve plate configured to move between a first open position where the first opening is open and a first closed position where the first opening is closed, the first open position being a position moved downward from the first closed position; and a second slit valve including a second valve plate configured to move between a second open position where the second opening is open and a second closed position where the second opening is closed, the second open position being a position moved upward from the second closed position.

Provided is a tray including a plate including a first region and a second region, a first groove on the first region of the plate and to which a stub is fixed, and a second groove on the second region of the plate and to which a grid holder is fixed, wherein the stub is configured to store test wafer pieces, and wherein the grid holder is configured to store a test sample.

There is provided a technique for easily adjusting the inner atmosphere of the transfer chamber as desired when forming the air flow in the transfer chamber by using different gases. According to one aspect thereof, there is provided a technique including: a transfer chamber including a transfer space; a first purge gas supplier; a second purge gas supplier; an exhauster; a circulation path connecting two ends of the transfer space; a fan provided on the circulation path or at an end portion of the circulation path to circulate the inner atmosphere of the transfer chamber; and a controller for controlling the fan such that a rotational speed of the fan varies between a first purge mode where the first purge gas is supplied through the first purge gas supplier and a second purge mode where the second purge gas is supplied through the second purge gas supplier.

An article transfer system includes a plurality of stage modules respectively provided at a plurality of layers, an interlayer transfer apparatus configured to transfer an article to each of the plurality of stage modules, and a plurality of loading and unloading apparatus respectively provided on each stage module of the plurality of stage modules, the plurality of loading and unloading apparatus configured to load an article onto respective stage modules of the plurality of stage modules. The interlayer transfer apparatus includes a mast frame extending so as to intersect each stage module of the plurality of stage modules, and a plurality of carriage units configured to move along a length direction of the mast frame, transfer articles, and move in a parallel manner with each other.

A conveyance system discriminates the front and back of a frame wafer without human intervention. A frame is partially formed asymmetrically with respect to a predetermined center line when viewed in a direction orthogonal to a surface of a wafer. The conveyance system includes a hand configured to hold the frame so that the frame extends in a predetermined virtual plane, a first sensor configured to detect a portion of the frame held on the hand and located in a predetermined first region in the virtual plane, a second sensor configured to detect a portion of the frame held on the hand and located in a second region opposite to the first region across the center line, and a controller configured to determine the front and back of the frame wafer based on a detection result obtained by the first sensor and a detection result obtained by the second sensor.

Systems and methods for processing workpieces, such as semiconductor workpieces are provided. One example embodiment is directed to a processing system for processing a plurality of workpieces. The processing system can include a loadlock chamber, a transfer chamber, and at least two processing chamber having two or more processing stations. The processing system further includes a storage chamber for storing replaceable parts. The transfer chamber includes a workpiece handling robot. The workpiece handling robot can be configured to transfer a plurality of replaceable parts from the processing stations to the storage chamber.

A substrate treating apparatus includes a carrier platform, a transport mechanism, and a controller. The carrier platform places a carrier thereon. The carrier includes a plurality of shelves arranged in an up-down direction. The shelves are each configured to place one substrate thereon in a horizontal posture. The transport mechanism is configured to transport a substrate to a carrier placed on the carrier platform. The controller controls the transport mechanism. The transport mechanism includes a hand and a hand driving unit. The hand supports a substrate. The hand driving unit moves the hand. The controller changes a height position of the hand when the hand is inserted between two of the shelves adjacent to each other in the up-down direction, depending on a shape of a substrate taken from or placed on one of the shelves by the transport mechanism.

There is provided a technique that includes abnormality detecting by picking up a sound generated from a transfer configured to be capable of transporting the substrate and comparing a waveform of sound data with a preset threshold value to detect an abnormality of the transfer; and failure detecting by picking up vibration of the transfer and comparing a waveform of vibration data with a preset threshold value to detect a failure of the transfer.

An EFEM includes a circulation path including a transfer chamber configured to form a transfer space where a substrate is transferred and a return path configured to return a gas flowing from one side to the other side of the transfer chamber, the EFEM including: a capture part provided in the return path and configured to electrically capture particles contained in the gas flowing through the return path, wherein the return path and the transfer chamber are provided such that a partition wall is interposed therebetween, and a differential pressure is generated on both sides of the partition wall such that a pressure on the side of the return path becomes higher than a pressure on the side of the transfer chamber in a state in which the gas circulates through the circulation path.

Provided is a hybrid bonding apparatus including a plurality of chambers, and a transferer configured to transfer a plurality of wafers between the plurality of chambers and transfer a plurality of bonded wafers to an annealing chamber, the plurality of wafers including a plurality of substrate wafers and a plurality of die supply wafers, wherein the plurality of chambers respectively includes a wafer supplier configured to store the plurality of wafers, a bonding device configured to bond the plurality of wafers, the bonding device including a bonder configured to bond dies on the plurality of substrate wafers from the plurality of die supply wafers, and a pre-annealing oven configured to primarily anneal the plurality of substrate wafers, and a processor.