Provided is an equipment front end module (EFEM) including a base configured to communicate with a processor, a tray port on the base, the tray port being configured to load a tray including a stub and a grid holder, a working robot configured to move in a direction on the base, and grasp and convey the stub in the tray and the grid holder in the tray, and a shuttle port on the base, the shuttle port including a first groove configured to fix the stub, and a second groove configured to fix the grid holder, wherein the working robot is further configured to convey the stub to the first groove and convey the grid holder to the second groove.

An equipment front end module (EFEM) includes sidewalls forming an EFEM chamber configured to receive inert gas from an inert gas supply. The sidewalls include a first sidewall configured to attach to a panel first side of a panel. The panel forms a panel opening extending between the panel first side and a panel second side. The panel second side is configured to attach to a side storage pod. The EFEM further includes a robot disposed in the EFEM chamber. The robot is configured to transfer substrates from the EFEM chamber into the side storage pod via the panel opening. An exhaust conduit is coupled to the side storage pod to exhaust gas from the side storage pod to an exterior of the side storage pod.

A transfer device for a micro light-emitting diode (micro LED) of the present application includes a collecting tube and a driving device. The collecting tube has a first end and a second end disposed oppositely, and the collecting tube includes a collecting opening and a storage tube, and the collecting opening is connected to the storage tube, and the collecting opening is disposed at the first end. The driving device is disposed at the second end, and the driving device is configured to provide a driving force, wherein the driving device is configured to provide the driving force to pick up the micro LED from the collecting opening into the storage tube so that the storage tube is able to store and stack at least two micro LEDs.

A substrate processing apparatus includes: a group of modules including a plurality of processing modules that process a substrate and a plurality of relay modules on which the substrates are disposed to be transferred among the plurality of processing modules; a plurality of transfer mechanisms that transfer the substrates in an assigned section of a transfer path; a shared transfer mechanism shared for transfer in a first section and a second section separated from each other in the transfer path of the substrate; and a determination unit that determines a transfer destination of the substrates by the shared transfer mechanism between the first relay module and the second relay module based on a transfer status of the substrate in each section.

Electronic device processing systems including an equipment front end module (EFEM) with a side storage pod are described. The EFEM includes an EFEM chamber and a recirculation duct. The side storage pod is fluidly coupled to the recirculation duct. The side storage pod includes an interior chamber and a side storage container disposed within the interior chamber. The side storage container is configured to receive one or more substrates from the EFEM chamber. The electronic device processing system further includes an environmental control system. The environmental control system is configured to circulate a purge gas between the EFEM chamber and the side storage pod via the recirculation duct.

A cassette for a workpiece processing system is provided. The cassette is configured to hold one or more replaceable parts, one or more workpieces and one or more pedestal protectors. The cassette includes a divider configured to separate the one or more replacement parts from the one or more workpieces and/or one or more pedestal protectors. The cassette is configured to be disposed in a storage chamber of a workpiece processing apparatus to facilitate automated replacement of replacement parts in one or more processing chambers. Workpiece processing systems and methods of replacing replacement parts in a workpiece processing system are also provided.

A container storage facility includes a container storage rack including a plurality of container placement sections that are next to each other in a first direction, and further includes a first sensor group of oxygen concentration sensors next to each other in the first direction on a first side of the containers in a second direction; a second sensor group of oxygen concentration sensors next to each other in the first direction on a second side of the containers in the second direction; a third sensor group of oxygen concentration sensors next to each other in the first direction at positions further toward the first side in the second direction than the first sensor group; and a fourth sensor group of oxygen concentration sensors next to each other in the first direction at positions further toward the second side in the second direction than the second sensor group.

A method of processing a semiconductor wafer is provided. The method includes introducing the wafer to a main chamber via a loading port, using a transfer mechanism to transfer the wafer to a first wafer processing module in a stack so that the wafer is disposed substantially horizontally in the first wafer processing module with a front face facing upwards, and performing a processing step on the front face of the wafer in the first wafer processing module.

A drying block structure is provided, including a main body and a protective layer. The main body has a honeycomb and substantially circular shape. The protective layer covers the main body and has a porous structure. The main body and the protective layer are integrally formed as one piece.

A substrate storage container comprises a container body capable of containing a plurality of substrates, and an air supply member capable of supplying gas from outside of the container body to an internal space, wherein for the substrate storage container the container body is formed in a front open box and the air supply member is attached to the bottom surface, and wherein a functional unit that changes the environment of the internal space to different states are connected with the air supply member so as to be able to be exchanged.