A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

There is provided an EFEM, including: at least one load port; a housing closed by connecting the at least one load port to an opening provided on a side wall of the housing and configured to define, in the housing, a transfer chamber for transferring a substrate; a substrate transfer device disposed in the transfer chamber and configured to transfer the substrate; an inert gas supply unit configured to supply an inert gas to the transfer chamber; and a gas discharge unit configured to discharge a gas in the transfer chamber, wherein the at least one load port includes: an opening/closing mechanism capable of opening and closing a lid of a mounted FOUP; and an accommodation chamber kept in communication with the transfer chamber and configured to accommodate a part of the opening/closing mechanism.

The disclosure describes devices and systems for a two-sided seal for a load port, and methods for using said seal. A factory interface for an electronic device manufacturing system can include a load port for receiving a substrate carrier. The load port can include a frame adapted for connecting the load port to a factory interface, the frame comprising a transport opening. The load port can also include a seal coupled to the frame. The seal can include a first contact point configured to engage with a load port door when the load port door is in a first position, and configured to disengage with the load port door when the load port door is in a second position and a second contact point configured to engage with a front of a substrate carrier when the substrate carrier is docked on the load port.

A wafer carrier dry cleaner includes a receiver, a tool and a movable nozzle. The receiver includes a clean room. The clean room includes a port used to load a wafer carrier. The wafer carrier comprises a box and a door closing an opening of the box. The tool is located in the clean room and configured to separate the door from the box. The movable nozzle is located in the clean room. The movable nozzle is configured to purge clean gas towards the box and the door at a first position between the box and the door when the box and the door are separated.

Semiconductor processing tools are provided that include a support framework, semiconductor processing chambers arranged along an axis, an attachment point connected to the support framework, and a detachable hoist system. Each chamber includes a base portion fixedly mounted relative to the support framework and a removable top cover including one or more hoisting features. The detachable hoist system includes a vertical member including a top end including a complementary attachment point and a bottom end including a movement mechanism supported by a floor. The complementary attachment point is detachably connected to the attachment point. The detachable hoist system further includes a hoist arm connected to the vertical member. The hoist arm is configured to pivot about a vertical axis substantially perpendicular to the axis, and includes one or more links and a hoist feature engagement interface configured to engage with the hoisting features of any of the removable top covers.

The inventive concept provides a sensor station. The sensor station includes a body providing an inner space for storing a substrate-type sensor; a power source unit installed at the body and configured to transmit a power to the substrate-type sensor; a processing unit installed at the body and configured to process a data measured by the substrate-type sensor; and a communication unit installed at the body and configured to exchange a data with the substrate-type sensor and a server of a substrate treating system.

Some implementations described herein provide a gas curtain system. The gas curtain system includes various components to prevent a gas flowing within a chamber of an interface tool from flowing through an opening into a transport carrier adjacent to the interface tool. The gas curtain system may include a gas distribution component along an edge of the opening that generates a flow of another gas across the opening towards an opposite edge of the opening. In this way, the gas from the chamber is prevented from entering the transport carrier. By preventing the gas from the chamber from entering the transport carrier, a relative humidity within an environment of the transport carrier is maintained such that condensation of moisture on one or more semiconductor wafers within the transport carrier is mitigated.

The application discloses a placement system for a door of a wafer pod, including a loadport. A docking interface is formed in the loadport, a placement mechanism is arranged on one side surface of the loadport, and includes a swing component, a follower component, and a docking plate. The swing component and the follower component are respectively connected to the docking plate, and the swing component can drive the docking plate to place the docking plate obliquely above the docking interface. By utilizing the space at the top of the loadport, the structural layout of the loadport is more reasonable; and the docking plate is placed nearly horizontally after the door is placed at a designated position, and provides a supporting force to the door, so that dependence on the vacuum suction is decreased, thereby avoiding the influences due to fluctuations of air pressure.

An EFEM includes a circulation path including a transfer chamber configured to form a transfer space where a substrate is transferred and a return path configured to return a gas flowing from one side to the other side of the transfer chamber, the EFEM including: a capture part provided in the return path and configured to electrically capture particles contained in the gas flowing through the return path, wherein the return path and the transfer chamber are provided such that a partition wall is interposed therebetween, and a differential pressure is generated on both sides of the partition wall such that a pressure on the side of the return path becomes higher than a pressure on the side of the transfer chamber in a state in which the gas circulates through the circulation path.

Substrate loading device including a frame adapted to connect the substrate loading device to a substrate processing apparatus, the frame having a transport opening through which substrates are transported between the substrate loading device and the substrate processing apparatus, a cassette support connected to the frame for holding at least one substrate cassette container for transfer of substrates to and from the at least one substrate cassette container through the transport opening, and selectably variable cassette support purge ports with a variable purge port nozzle outlet, variable between more than one selectable predetermined purge port nozzle characteristics, disposed on the cassette support, each of the more than one purge port nozzle characteristics being configured so that the purge port nozzle outlet with each selected predetermined purge port nozzle characteristic complements and couples to at least one purge port of the at least one substrate cassette container.