A load port control unit performs an opening operation of a sealable container according to a first operation procedure when a sensor has detected a normal placement of the sealable container, and retries the opening operation according to a second operation procedure for being able to more reliably perform the opening operation of the sealable container, to prevent a transfer device from stopping, when the sensor has detected a placement abnormality of the sealable container.

The present disclosure relates to burn-in apparatus, transfer method, burn-in chamber, and interchangeable frame thereof for semiconductor devices burn-in process. The burn-in apparatus comprises of a burn-in chamber with an incomplete base which is adapted to be completed and thermally insulated in cooperation with a thermal insulation base of at least one interchangeable frame which is adapted to be removably moved into and docked in the burn-in chamber to complete the burn-in apparatus. The burn-in apparatus comprises the burn-in chamber and at least one frame. The apparatus is complete and thermally insulated when the frame is moved into the burn-in chamber and docked therein. The apparatus is incomplete and thermally uninsulated when the frame is moved out of the burn-in chamber and undocked therefrom.

A method includes transferring a tool monitoring device to a load port of a tool. An environmental parameter of the load port is monitored by the tool monitoring device. The tool monitoring device is removed from the load port after the environmental parameter of the load port is monitored. A door of the tool in front of the load port is closed. The door of the tool is kept closed during a period from a time of transferring the tool monitoring device to the load port to a time of removing the tool monitoring device from the load port.

A substrate loading device including a frame adapted to connect to a substrate processing apparatus, the frame having a transport opening through which substrates are transported to the processing apparatus, a cassette support connected to the frame for holding at least one substrate cassette container proximate the transport opening, the support configured so that a sealed internal atmosphere of the container is accessed from the support at predetermined access locations of the container, and the cassette support has a predetermined continuous steady state differential pressure plenum region, determined at least in part by boundaries of fluid flow generating differential pressure, so that the predetermined continuous steady state differential pressure plenum region defines a continuously steady state fluidic flow isolation barrier disposed on the support between the predetermined access locations of the container and another predetermined section of the support isolating the other predetermined section from the predetermined access locations.

A substrate processing apparatus is provided. The substrate processing apparatus comprise: a first chamber including a sidewall providing an opening, the first chamber further including a movable part movable upward and downward within the first chamber; a substrate support disposed within the first chamber; a second chamber disposed within the first chamber and defining, together with the substrate support, a processing space in which a substrate mounted on the substrate support is processed, the second chamber being separable from the first chamber and transportable between an inner space of the first chamber and the outside of the first chamber via the opening; a clamp releasably fixing the second chamber to the movable part extending above the second chamber; a release mechanism configured to release the fixing of the second chamber by the clamp; and a lift mechanism configured to move the movable part upward and downward.

A storage apparatus to store cassettes for substrates comprising a moveable base plate constructed and arranged to hold cassettes, an outer wall provided with an opening to receive and remove the cassettes from the base plate, and a moving device constructed and arranged to move the base plate with respect to the opening. The storage apparatus is provided with a stationary sensor near the opening for detecting at least one of a presence and a correct orientation of a substrate cassette on the base plate at the opening.

Electronic device processing systems including an equipment front end module with at least one side storage pod are described. The side storage pod has a side storage container and a container plenum. A fan draws purge gas from the equipment front end module chamber into the container plenum where the purge gas is directed into the side storage container to pass over substrates stored therein and is then exhausted back into the equipment front end module chamber. Methods and systems are also disclosed.

An illustrative embodiment disclosed herein is an apparatus including a first loading tray configured to couple to a first wafer holding device holding a plurality of wafers. The first wafer holding device includes a first opening. The apparatus includes a second loading tray configured to couple to a second wafer holding device. The second wafer holding device includes a second opening. The apparatus includes a first motor coupled to the first loading tray and configured to rotate the first wafer holding device until the first opening faces the second opening to allow transfer of the plurality of wafers from the first wafer holding device to the second wafer holding device.

Provided is a holding device 45 capable of holding securely and transporting a thin plate-shaped substrate for which surface processing has been completed without causing a natural oxide film to form on the surface to be processed thereof. This holding device 45 comprises a holding member 47 for holding the thin plate-shaped substrate, a purge plate 46 having formed therein a flow path 52 for the purpose of flowing therethrough an inert gas, and a piping member for connecting an inert gas supply source to the flow path 52. The purge plate 46 is equipped with discharged ports 51, which communicate with the flow path 52 and are provided on a surface facing the surface to be processed of the thin plate-shaped substrate held by the holding member 47, for the purpose of discharging the inert gas onto the processing surface of the thin plate-shaped substrate. In addition, the holding device 45 is equipped with a raising and lowering mechanism 48 that cause the holding member 47 and the purge plate 46 to be raised and lowered relative to each other.

A reticle pod is provided. The reticle pod includes a container and a fluid regulating module mounted to the container. The fluid regulating module includes a first cap, a second cap and a sealing film. The first cap and the second cap are connected to each other. A flowing path is formed between the first cap and the second cap for allowing a fluid passing through the fluid regulating module. The sealing film is positioned between the first cap and the second cap and configured for regulating a flow of the fluid passing through the flowing path.