A transfer system has a storage device including a plurality of shelves, each of the shelves including a placement portion in which an opening region is formed and on which the article is placed and an attaching portion provided according to a position of the placement portion; and a transfer device used for transferring the article, from the one side with respect to the transfer target shelf. The transfer device has a main unit portion attached to the attaching portion of the transfer target shelf from the one side, a moving portion including a grip portion and being capable of supporting the article and configured to move along the one direction, and an elevating portion configured to elevate the moving portion through the opening region of the transfer target shelf.

There is provided an exhaust nozzle unit capable of discharging a gas atmosphere in a substrate storage container having a loading/unloading opening from the container to an outside of the container through a port formed on a bottom surface of the container. The exhausted nozzle includes a nozzle capable of switching the port from a closed state to an open state by pressing a valve of the port; and a housing configured to hold the nozzle so as to be movable up and down between a use posture in which the port is in the open state and a standby posture in which the port is in the closed state.

One illustrative device disclosed herein includes a FOUP (Front Opening Unified Pod) storage bin, a plurality of pins positioned on a first surface of the FOUP storage bin, wherein the plurality of pins are adapted to engage and register with the FOUP, and a conversion plate. In one illustrative embodiment, the conversion plate includes a plate with a front surface and a back surface, a reticle pod receiving structure on the front surface that at least partially bounds a reticle pod receiving area on the front surface, and a pin engagement structure on the back side that is adapted to engage the plurality of pins on the first surface of the FOUP storage bin.

Methods and systems for improving the efficiency of an automated material handling system (AMHS) include providing an apparatus operatively coupled to a load port of a processing apparatus, where the apparatus is configured to remove a first work-in-process from the load port and to move the first work-in-process along a first direction to displace the first work-in-progress from the load port while a second work-in-progress is transferred to the load port from an AMHS vehicle along a second direction that is perpendicular to the first direction, and transferring the first work-in-progress to an AMHS vehicle along the second direction. The methods and systems may be used for loading and unloading wafer storage containers, such as front opening unified pods (FOUPs), in a semiconductor fabrication facility.

Disclosed are implementations for efficient purging of substrate carriers (and content held therein) and preventing external contaminants from entering a gas purge apparatus by coupling the gas purge apparatus to a substrate carrier, performing a first gas purging session of an environment of the substrate carrier, receiving a first signal of a first signal type, responsive to receiving the first signal, keeping the gas purge apparatus coupled to the substrate carrier, performing a second gas purging session of the environment of the substrate carrier, receiving a second signal of a second signal type, and, responsive to receiving the second signal, decoupling the purge apparatus from the substrate carrier.

Methods and systems for improving the efficiency of an automated material handling system (AMHS) include providing an apparatus operatively coupled to a load port of a processing apparatus, where the apparatus is configured to remove a first work-in-process from the load port and to move the first work-in-process along a first direction to displace the first work-in-progress from the load port while a second work-in-progress is transferred to the load port from an AMHS vehicle along a second direction that is perpendicular to the first direction, and transferring the first work-in-progress to an AMHS vehicle along the second direction. The methods and systems may be used for loading and unloading wafer storage containers, such as front opening unified pods (FOUPs), in a semiconductor fabrication facility.

A side storage pod includes an outer enclosure having a sealing surface configured to couple to an EFEM and a side storage pod chamber having a body coupled to vertically-spaced storage members. Each of the vertically-spaced storage members is configured to support a corresponding substrate within the body. The side storage pod further includes a removable door. The removable door and the body are to seal relative to each other responsive to the removable door being in a closed position. A load-unload robot of the EFEM is to access the vertically-spaced storage members responsive to the removable door being in an open position. An environment within the side storage pod chamber is to be controlled to be one or more of: at first environmental conditions responsive to the removable door being in the closed position; or at second environmental conditions responsive to the removable door being in the open position.

A substrate transport system includes a carrier having a housing forming an interior environment having an opening for holding at least one substrate and a door for sealing the opening from an outside atmosphere where when sealed the interior environment is configured to maintain an interior atmosphere therein, the housing including a fluid reservoir exterior to the interior environment and configured to contain a fluid, forming a different atmosphere in the fluid reservoir than the interior atmosphere, to form a fluidic barrier seal that seals the interior environment from an environment exterior to the carrier.

A semiconductor fabrication facility (FAB) is provided. The FAB includes a group of processing tools. The FAB also includes a number of sampling tubes connecting the group of processing tools. In addition, the FAB includes a sampling station which includes a connection port, a valve manifold box and a controller. The valve manifold box is used for switching a gas sample from one of the processing tools to the connection port. The controller is sued for controlling the connection of the valve manifold box and the sampling tubes. The FAB further includes a metrology module. The metrology module is connected to the connection port of the sampling station and is used to perform a measurement of a parameter related to the gas sample.

Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.