In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.

A method for transferring a container configured to hold at least one article used in semiconductor fabrication is provided. The method includes moving a transferring mechanism to a first position that is adjacent to the original space; producing an image of an edge of the container that is adjacent to the original space using an optical receiver before the container is moved to a destination space; and performing an image analysis of the image to determine whether to move the container to the destination space.

A transfer system has a storage device including a plurality of shelves, each of the shelves including a placement portion in which an opening region is formed and on which the article is placed and an attaching portion provided according to a position of the placement portion; and a transfer device used for transferring the article, from the one side with respect to the transfer target shelf. The transfer device has a main unit portion attached to the attaching portion of the transfer target shelf from the one side, a moving portion including a grip portion and being capable of supporting the article and configured to move along the one direction, and an elevating portion configured to elevate the moving portion through the opening region of the transfer target shelf.

An interface device for a purging unit for purging a wafer container with a purging gas, which comprises a contact piece for contacting a purging interface of a wafer container, wherein the contact piece is movably arranged in the purging unit and has a gas passage in its interior. A corresponding interface device is provided. The object is to specify an interface device which, when the wafer container is coupled to the purging unit, makes it possible to seal a gas inlet or a gas outlet, to introduce or to discharge a purging gas into the wafer container, thereby compensating for and adapting to vertical and horizontal movements, preventing wear, and fulfilling a passive coupling and sealing function as well as offering maximum durability and reliability. This is achieved by a contact piece which is suspended directly or indirectly in the purging unit by means of a spring device.

A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to a back surface of the wafer, a frame unit carrying-out unit, and a beveled part removing unit that cuts and removes, in a ring manner, a beveled part formed in an outer circumferential surplus region from the wafer of a frame unit.

A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the annular frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to the back surface of the wafer, a frame unit carrying-out unit, and a reinforcing part removing unit that cuts and removes a ring-shaped reinforcing part from the wafer of a frame unit.

A robotic manipulator for handling a cassette and an automated cassette transport device are disclosed, the device including a mechanical arm (1), an end actuator (2) at an end of the mechanical arm (1) and a vision-based locating assembly (3) on the end actuator (2). On the one hand, the vision-based locating assembly (3) can determine the position of a flange of the cassette, thereby identifying the cassette. In other words, the cassette can be identified based on a feature of the cassette itself. This dispense with a separate locating marker while improving cassette measuring and handling accuracy. On the other hand, transportation of the cassette is allowed by complementary retention of its flange on a recessed surface of the end actuator (2).

A load port system includes an isolation compartment coupled to an equipment front end module (EFEM). Reactive gas is to be removed from the isolation compartment. The load port system further includes an elevator disposed in the isolation compartment. The elevator is coupled to an elevator arm that extends from the isolation compartment into the EFEM through an opening to raise and lower a carrier opener within the EFEM.

Disclosed herein are a wafer purging-type shelf assembly and a buffer module having the same. The wafer purging-type shelf assembly includes: a shelf formed to support a wafer receiving container; a supply nozzle configured to be connected to an injection port of the wafer receiving container; and a gas supply line configured to supply an inert gas discharged from a factory gas facility to the wafer receiving container through the supply nozzle, wherein the gas supply line includes a proportional pressure control valve unit that adjusts a supply flow rate of the inert gas to the wafer receiving container by an area control method.

A multiple transport carrier docking device may be capable of storing and/or staging a plurality of transport carriers in a chamber of the multiple transport carrier docking device, and may be capable of forming an air-tight seal around a transport carrier in the chamber. Semiconductor wafers in the transport carrier may be accessed by a wafer transport tool while the air-tight seal around the transport carrier prevents and/or reduces the likelihood that contaminants in the semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.