A substrate processing method includes: carrying out a substrate from a substrate transfer container by a substrate transfer device; placing the substrate in a first position of a substrate holder; moving the substrate holder into a reaction container and processing the substrate in the reaction chamber; obtaining a film thickness measurement result of the substrate processed in the reaction container; creating a model from the film thickness measurement result; determining a second position where the substrate is placed in the substrate holder and a transfer position setting value obtained from the model; adjusting the first position of the substrate to the second position; calculating an eccentricity state of the substrate from a newly obtained film thickness measurement result; calculating an optimization such that the eccentricity state is minimized; and determining a third position to which a new substrate is placed from the transfer position setting value.

A substrate conveying system includes a substrate supply unit including a movable rack and an up-down unit which moves the movable rack down, a lift unit which has one or more ejection holes which eject a gas upward and is configured to lift-up the substrate supported on the movable rack by the pressure of the gas ejected through ejection holes when the up-down unit moves the movable rack down, and a conveying unit which includes a conveyor, and hook elements extending upward from the conveyor, and is configured to push in a conveying direction the substrate W being lifted-up by the pressure of the gas ejected through the ejection holes.

A substrate processing apparatus includes: a load port into and out of which the transport container is carried; and an apparatus controller that controls operations in the load port. The apparatus controller includes a storage unit that stores transition data of parameter values sent from outside based on a transport container identification code. The transition data of the parameter values each comprises a usage count of the transport container and a corresponding parameter value that quantifies a result of at least one of an operation performed to remove the lid after the transport container is carried into the load port and an operation performed to carry the container out of the load port. The apparatus controller further includes a determination unit that determines, after a transport container is carried into the load port, presence or absence of an abnormality in that transport container based on a parameter value associated with at least one of carrying-in or carrying-out of that transport container, and past transition data of parameter values associated with that transport container.

A transporter for transporting an article used in semiconductor fabrication is provided. The transporter includes a robotic arm. The transporter further includes two platens connected to the robotic arm. Each of the two platens an inner surface facing the other, and a number of gas holes are formed on each of the inner surfaces of the two platens. The transporter also includes a gas supplier placed in communication with the gas holes. The gas supplier is used to control the flow of gas through the gas holes.

A substrate loading station including a frame forming a chamber configured to hold a controlled environment, a transfer robot connected to the frame and one or more substrate cassette holding locations each capable of having a substrate cassette holder disposed within the frame. Each of the one or more substrate cassette holding locations being configured to removably support a respective substrate cassette in a predetermined position for communication with the transfer robot to effect substrate transfer between a respective cassette and the transfer robot where the one or more substrate cassette holding locations are configured to effect the interchangeability of one or more substrate cassette holders with other substrate cassette holders for changing a substrate cassette holding capacity of the substrate loading station.

A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

In one general aspect, an apparatus can include a wide bandgap wafer having a backside and a frontside. The apparatus can include a detection facilitating layer capped on the backside of the wide bandgap wafer, the detection facilitating layer having a thickness less than a thickness of the wide bandgap wafer.

A semiconductor wafer mapping apparatus comprising a frame forming a wafer load opening communicating with a load station for a substrate carrier disposed to hold more than one wafers vertically distributed in the substrate carrier for loading through the wafer load opening, a movable arm movably mounted to the frame so as to move relative to the wafer load opening and having at least one end effector movably mounted to the movable arm to load wafers from the substrate carrier through the wafer load opening, an image acquisition system including an array of cameras arranged on a common support and each camera fixed with respect to the common support that is static with respect to each camera of the array of cameras, wherein each respective camera is positioned with a field of view disposed to view through the wafer load opening with the common support positioned by the movable arm.

A method of operating a robot includes detecting the occurrence of an abnormal operating condition of the robot during operation from hardware state data relating to the operation of the robot system. In response, current hardware state data of the robot at the time of the detection is captured, including robot positional information. A counter corresponding to the abnormal operating condition may then be incremented and, if the counter exceeds a threshold value or exceeds a threshold value in a certain time, a report may be generated including the captured hardware state data. The abnormal condition may for example be a fluctuation in vacuum level or a data transmission error.

A method of operating a robot including a vacuum port for engaging an item, e.g. a wafer, is disclosed. The method includes operating, by a computer system, the robot in a first state, detecting using a vacuum sensor, a transition of a vacuum parameter from a first vacuum parameter zone to a second parameter zone in a plurality of vacuum parameter zones. Based on detecting the transition of the vacuum parameter from the first vacuum parameter zone to the second vacuum parameter zone, the operating state of the robot is altered from the first state to a second state. Also disclosed is an item transfer robot as part of an item transfer system.