A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.

The present disclosure provides a method for manufacturing an electronic device. First, a plurality of light-emitting elements is provided on a first substrate. Then, at least one of the plurality of light-emitting elements is transferred from the first substrate to a second substrate by a transferring head. The transferring head includes an electrode and a cantilever supporting the electrode, and the cantilever includes a U-shaped portion.

The treating arrangement (900) for an epitaxial reactor (1000) comprises: a reaction chamber (100) for treating substrates, a transfer chamber (200) adjacent to the reaction chamber (100), for transferring substrates placed over substrates support devices, a loading/unloading group (300) at least in part adjacent to the transfer chamber (200), arranged to contain a substrates support device with one or more substrates, a storage chamber (400) containing at least in part the loading/unloading group (300), having a first storage zone (410) for treated and/or untreated substrates and a second storage zone (420) for substrates support devices without any substrate, at least one external robot (500) for transferring treated substrates, untreated substrates and substrates support devices without any substrate between said storage chamber (400) and said loading/unloading group (300), at least one internal robot (600) for transferring substrates support devices with one or more substrates between said loading/unloading group (300) and said reaction chamber (100) via said transfer chamber (200); said loading/unloading group comprises a load-lock chamber (300A) and a preparation station (300B) associated with each other.

A non-transitory computer-readable storage medium storing a n EMI calculation program that causes at least one computer to execute a process, the process includes inputting circuit information of a first circuit to a machine learning model; acquiring an EMI value at a certain frequency of the first circuit; selecting, based on an impedance characteristic of the first circuit and the EMI value at the certain frequency, first EMI information from a plurality of pieces of EMI information in each of which an impedance characteristic of each of a plurality of circuits is associated with EMI values at a plurality of frequencies of each of the plurality of circuits; and acquiring an EMI value at another frequency different from the certain frequency of the first circuit based on the EMI value at the certain frequency and the first EMI information.

A method includes mounting a first wafer on a first wafer chuck and mounting a second wafer on a second wafer chuck. The second wafer is brought into physical contact with the first wafer. A relative distance between the first wafer and the second wafer is monitored using a distance sensor. A pressure of a vacuum zone on the second wafer chuck is controlled using feedback from the distance sensor. The bonded first wafer and second wafer are removed from the first wafer chuck.

A substrate processing apparatus includes: a holder that holds a substrate; a liquid supply that sequentially supplies a first processing liquid and a second processing liquid to a main surface of the substrate held by the holder; a friction body that comes into contact with and rub the main surface of the substrate during the supply of the first processing liquid and the second processing liquid; a mover that moves a contact position of the friction body in a first axial direction and a second axial direction; and a controller that controls the liquid supply and the mover to move the contact position of the friction body in one-side direction of the first axial direction during the supply of the first processing liquid, and move the contact position of the friction body in the other-side direction of the first axial direction during the supply of the second processing liquid.

The present disclosure provides a load-bearing device telescopic relative to a reference object, a wafer transfer device, a chamber device which is configured to exchange wafers between different pressure environments, and a wafer processing apparatus, the load-bearing device including a base, a movable platform opposite to the base, an ejector rod which is configured to extend through a bearing secured to the base and is coupled to the movable platform, and a driving member which is fixed relative to the reference object and is configured to push against the ejector rod and in turn to drive the ejector rod to displace relative to the base. The bearing device further includes a corrugated tube assembly, surrounding the ejector rod and includes a first corrugated tube sleeved on the ejector rod, the ejector rod and the first corrugated tube cooperating with each other to define collectively a first space.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing for providing a treating space for treating a substrate within; a support unit for supporting the substrate in the treating space; a bottom supply port for supplying a process fluid to the treating space; and a filler member positioned below the substrate supported on the support unit in the treating space, and wherein the filler member forms a buffer space facing the bottom supply port, and a passage is formed between the filler member and an inner wall of the housing and flows the process fluid which is introduced to the buffer space in a direction of the substrate.

A bevel mask for use in plasma CVD apparatus for depositing a more uniform film while preventing film peeling at the edges of the wafer. The bevel mask includes a bulk portion and an edge portion. The bulk portion includes an inner beveled surface or face, and the edge portion extends outward from a bottom section of the inner beveled surface to provide a covering for a peripheral portion of the upper surface of a wafer received on the susceptor, which supports the annular-shaped mask such as upon a ring structure on an upper surface of the susceptor.

Replaceable contact pads of end effectors are provided. The contact pads support substrates in electronic device manufacturing. The contact pad includes a contact pad head having a contact surface configured to contact a substrate, a shaft coupled to the contact pad head, the shaft including a shaft indent formed between an underside of the contact pad head and a shaft end, and a circular securing member received around the shaft and seated in the shaft indent and configured to secure the contact pad to the end effector body. End effectors including replaceable contact pads and maintenance methods are described, as are additional aspects.