An integrated circuit is formed by providing a heavily doped substrate of a first conductivity type, forming a lightly doped lower epitaxial layer of the first conductivity type over the substrate, implanting dopants of the first conductivity type into the lower epitaxial layer in an area for a shallow component and blocking the dopants from an area for a deep component, forming a lightly doped upper epitaxial layer over the lower epitaxial layer and activating the implanted dopants to form a heavily doped region. The shallow component is formed over the heavily doped region, and the deep component is formed outside the heavily doped region, extending through the upper epitaxial layer into the lower epitaxial layer.

An integrated circuit is formed by providing a heavily doped substrate of a first conductivity type, forming a lightly doped lower epitaxial layer of the first conductivity type over the substrate, implanting dopants of the first conductivity type into the lower epitaxial layer in an area for a shallow component and blocking the dopants from an area for a deep component, forming a lightly doped upper epitaxial layer over the lower epitaxial layer and activating the implanted dopants to form a heavily doped region. The shallow component is formed over the heavily doped region, and the deep component is formed outside the heavily doped region, extending through the upper epitaxial layer into the lower epitaxial layer.

The present disclosure provides a transistor device and fabrication method thereof. A dummy gate is formed on a substrate. An interlayer dielectric layer is formed on the substrate and sidewall surfaces of the dummy gate. The interlayer dielectric layer has a top surface coplanar with a top surface of the dummy gate. A mask layer is formed on the top surface of the interlayer dielectric layer. The mask layer is used as an etch mask to remove the dummy gate to form a trench in the interlayer dielectric layer to provide a trench footing on sidewall surfaces of the trench and near a trench bottom. The trench footing is then removed by applying a dry etching process. A gate electrode is then formed in the trench to form a transistor with improved electrical performance.

A device and method of forming the device that includes cavities formed in a substrate of a substrate device, the substrate device also including conductive vias formed in the substrate. Chip devices, wafers, and other substrate devices can be mounted to the substrate device. Encapsulation layers and materials may be formed over the substrate device in order to fill the cavities.

A device and method of forming the device that includes cavities formed in a substrate of a substrate device, the substrate device also including conductive vias formed in the substrate. Chip devices, wafers, and other substrate devices can be mounted to the substrate device. Encapsulation layers and materials may be formed over the substrate device in order to fill the cavities.

Aspects of the disclosure are directed to integrated circuit dies and their manufacture. In accordance with one or more embodiments, a plurality of integrated circuit dies are provided in a semiconductor wafer, with each integrated circuit die having: an integrated circuit within the die, a via extending from a first surface to a second surface that opposes the first surface, and first and second electrical contacts at the first surface respectively coupled to the via and to the integrated circuit. Lanes are created in a front side of the wafer between the dies, and a portion of the back side of the wafer is removed to expose the lanes. A further contact and/or via is also exposed at the backside, with the via providing an electrical signal path for coupling electrical signals through the integrated circuit die (e.g., bypassing circuitry therein).

Aspects of the disclosure are directed to integrated circuit dies and their manufacture. In accordance with one or more embodiments, a plurality of integrated circuit dies are provided in a semiconductor wafer, with each integrated circuit die having: an integrated circuit within the die, a via extending from a first surface to a second surface that opposes the first surface, and first and second electrical contacts at the first surface respectively coupled to the via and to the integrated circuit. Lanes are created in a front side of the wafer between the dies, and a portion of the back side of the wafer is removed to expose the lanes. A further contact and/or via is also exposed at the backside, with the via providing an electrical signal path for coupling electrical signals through the integrated circuit die (e.g., bypassing circuitry therein).

A semiconductor device includes a first fin structure disposed on a substrate. The first fin structure extends in a first direction. A first sacrificial layer pattern is disposed on the first fin structure. The first sacrificial layer pattern includes a left portion and a right portion arranged in the first direction. A dielectric layer pattern is disposed on the first fin structure and interposed between the left and right portions of the first sacrificial layer pattern. A first active layer pattern extending in the first direction is disposed on the first sacrificial layer pattern and the dielectric layer pattern. A first gate electrode structure is disposed on a portion of the first active layer pattern. The portion of the first active layer is disposed on the dielectric layer pattern. The first gate electrode structure extends in a second direction crossing the first direction.

A composite integrated circuit (IC) device structure comprising a host chip and a chiplet. The host chip comprises a first device layer and a first metallization layer. The chiplet comprises a second device layer and a second metallization layer that is interconnected to transistors of the second device layer. A top metallization layer comprising a plurality of first level interconnect (FLI) interfaces is over the chiplet and host chip. The chiplet is embedded between a first region of the first device layer and the top metallization layer. The first region of the first device layer is interconnected to the top metallization layer by one or more conductive vias extending through the second device layer or adjacent to an edge sidewall of the chiplet.

A composite integrated circuit (IC) device structure comprising a host chip and a chiplet. The host chip comprises a first device layer and a first metallization layer. The chiplet comprises a second device layer and a second metallization layer that is interconnected to transistors of the second device layer. A top metallization layer comprising a plurality of first level interconnect (FLI) interfaces is over the chiplet and host chip. The chiplet is embedded between a first region of the first device layer and the top metallization layer. The first region of the first device layer is interconnected to the top metallization layer by one or more conductive vias extending through the second device layer or adjacent to an edge sidewall of the chiplet.