A composition is disclosed, which comprises (I) an aryl component; (II) a methyl component; and (III) a hydrosilylation catalyst. The (I) aryl component comprises (A) an organopolysiloxane and (B) an organohydrogenpolysiloxane. Similarly, the (II) methyl component comprises (A) an organopolysiloxane and (B) an organohydrogenpolysiloxane. A method of preparing the composition is also disclosed. Further, a method of preparing an article, e.g. a light diffuser, and a lighting device comprising the light diffuser are disclosed. Finally, a method of diffusely transmitting light with the light diffuser is disclosed.

The storage container according to the embodiment of the present invention includes a storage portion storing a liquid composition containing an organic solvent having a moisture concentration of 400 ppm by mass or less and a surface treatment agent. At least a portion, which is in contact with the liquid composition, of an inner wall of the storage portion has a contact angle θ with respect to water of 10 degrees or more and 150 degrees or less.

The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [R.sup.aSiO.sub.3/2] (I) and constituent units represented by formula (II) [R.sup.aSiO.sub.2/2(OR.sup.b)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.

This silicone gel composition contains (A) an organopolysiloxane having one or more silicon atom-bonded alkenyl groups per molecule, (B) an organohydrogen polysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule, (C) a platinum group metal-based curing catalyst, (D) an isocyanuric acid derivative having two trialkoxysilyl groups and one crosslinkable vinyl group and/or an isocyanuric acid derivative having three trialkoxysilyl groups, and (E) a ketenesilylacetal-type compound, and provides a cured product having a specific penetration.

The silicone gel composition can provide a silicone gel cured product that is a silicone gel having excellent heat resistance and adhesiveness to metals at high temperature and having a high penetration, that is capable of maintaining a low elastic modulus and a low stress even in use at high temperature for long periods of time, and that enables reduction of the occurrence of bubbles and reduction of deterioration in releasability from a substrate and in electrical insulating properties.

Provided is a curable particulate silicone composition that is hot-meltable, has excellent handling workability, curing properties, and gap fill properties when melted, and gives a cured product having excellent flexibility and resilience from room temperature to high temperatures of about 150° C. Also provided are pellets or the like formed by molding the curable particulate silicone composition. The curable particulate silicone composition comprises: (A) hot-meltable silicone particles that have a softening point of 30° C. or higher and have a hydrosilylatable group and/or a radical reactive group; (B) an inorganic filler (particulates) that is substantially free of coarse particles having an average particle diameter of 10.0 μm or larger; and (C) a curing agent. When cured, the composition gives a cured product having a storage modulus of 2000 Mpa or lower at 25° C. and of 100 Mpa or lower at 150° C.

This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.

The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility.

The present invention provides a curable resin composition comprising the following components: (A): a polyorganosiloxane represented by the average unit formula: (SiO.sub.4/2).sub.a1(R.sup.1SiO.sub.3/2).sub.a2(R.sup.1.sub.2SiO.sub.2/2).sub.a3(R.sup.1.sub.3SiO.sub.1/2).sub.a4 wherein each R.sup.1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R.sup.1, and a1>0, a2>0, a3≥0, a4>0, 0.01≤a1/a2≤10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the average composition formula:

R.sup.2.sub.mH.sub.nSiO.sub.[(4-m-n)/2]

wherein R.sup.2 is alkyl or aryl, and 0.7≤m≤2.1, 0.001≤n≤1.5, and 0.8≤m+n≤3; (C): a zirconium compound; and (D): a hydrosilylation catalyst.

The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility. The present invention provides a curable resin composition comprising the following components: (A): a polyorganosiloxane represented by the average unit formula: (SiO.sub.4/2).sub.a1(R.sup.1SiO.sub.3/2).sub.a2(R.sup.1.sub.2SiO.sub.2/2).sub.a3(R.sup.1.sub.3SiO.sub.1/2).sub.a4 wherein each R.sup.1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R.sup.1, and a1>0, a2>0, a3≥0, a4>0, 0.01≤a1/a2≤10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the average composition formula:
R.sup.2.sub.mH.sub.nSiO.sub.[(4-m-n)/2]
wherein R.sup.2 is alkyl or aryl, and 0.7≤m≤2.1, 0.001≤n≤1.5, and 0.8≤m+n≤3; (C): a zirconium compound; and (D): a hydrosilylation catalyst.

An adhesive or encapsulant composition, having a siloxane polymer having a molecular weight of from 300 to 150,000 g/mol and having a viscosity of from 1000 to 100,000 mPa-sec at 5 rpm viscometer and at 25° C., and a curing agent that aids in curing the siloxane polymer upon the application of ultraviolet light. The composition is transmissive to visible light with an optical transmissivity of 95% or more in the visible spectrum at a thickness of 1 mm or less, and wherein the siloxane polymer is a material formed without hydrosilylation and has less than 5 mol % of Si—OH groups compared to all groups bound to Si therein, and substantially no Si—H bonds.

A curable organopolysiloxane composition, a Light Emitting Diode (LED) encapsulant and a semiconductor device, wherein the curable organopolysiloxane composition contains units of the formula 1

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