A room temperature curable composition is disclosed. The composition can be used as an encapsulation/potting material. The composition comprises: (i) at least one condensation curable silyl terminated polymer having at least one silicon bonded hydroxyl functional group per molecule; (ii) a cross-linker having at least two hydrolysable groups and selected from certain silanes and/or silyl functional molecules; and (iii) a condensation catalyst selected from the group of titanates and/or zirconates. The molar ratio of the sum of moisture present in the composition and total silicon bonded hydroxyl groups: the catalyst (the molar ratio) is >7:1. When the molar ratio is from >7:1 to 10:1, the molar ratio of total silicon bonded hydroxyl groups:total hydrolysable groups is between 0.1:1 to 0.3:1. When the molar ratio is >10:1, the molar ratio of total silicon bonded hydroxyl groups:total hydrolysable groups is between 0.1:1 to 0.5:1.

A packaging material is provided. The packaging material includes (a) epoxy silsesquioxane, (b) epoxy resin, and (c) siloxane-imide-containing benzoxazine compound. (a) Epoxy silsesquioxane and (b) epoxy resin have a weight ratio of 0.3:1 to 10:1. The total weight of (a) epoxy silsesquioxane and (b) epoxy resin and the weight of (c) siloxane-imide-containing benzoxazine compound have a ratio of 100:20 to 100:150.

A room temperature curable composition is disclosed. The composition can be used as an encapsulation/potting material. The composition comprises: (i) at least one condensation curable silyl terminated polymer having at least one silicon bonded hydroxyl functional group per molecule; (ii) a cross-linker having at least two hydrolysable groups and selected from certain silanes and/or silyl functional molecules; and (iii) a condensation catalyst selected from the group of titanates and/or zirconates. The molar ratio of the sum of moisture present in the composition and total silicon bonded hydroxyl groups:the catalyst (the molar ratio) is >7:1. When the molar ratio is from >7:1 to 10:1, the molar ratio of total silicon bonded hydroxyl groups:total hydrolysable groups is between 0.1:1 to 0.3:1. When the molar ratio is >10:1, the molar ratio of total silicon bonded hydroxyl groups:total hydrolysable groups is between 0.1:1 to 0.5:1.

A method of forming a layer structure is provided. The method may include plasma-treating a metal surface with a hydrogen-containing plasma, thereby forming nucleophilic groups over the metal surface, and forming an organic layer over the metal surface, wherein the organic layer comprises silane and is covalently bonded to the nucleophilic groups.

A dually curable resin composition is provided. The composition comprises: (A) a first polyorganosiloxane comprising at least one alkenyl group and at least one alkoxy group in one molecule; (B) a second polyorganosiloxane comprising at least two photoreactive functional groups in one molecule on its side chain of siloxane backbone; (C) at least one silane compound represented by a particular chemical formula herein or its partially hydrolyzed compound; (D) at least one photoinitiator; and (E) at least one condensation reaction catalyst. A cured body prepared by curing the dually curable resin composition, and an electronic device comprising the cured body, are also provided.

Unique compositions containing organopolysiloxanes having both silicon-bonded hydrogen and aliphatically unsaturated groups exhibit robust processing characteristics and provide coatings or encapsulations of high transparency which can withstand numerous temperature cycles without failure.

A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.

The invention provides a silicone-modified epoxy resin composition comprising a silicone-modified epoxy resin having at least two epoxy groups, obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane, a silicone-modified phenolic resin having at least two phenolic hydroxyl groups, obtained from hydrosilylation reaction of an alkenyl-containing phenol compound with an organopolysiloxane, black pigment, and an inorganic filler. Because of excellent tracking resistance, the epoxy resin composition is suited for encapsulating semiconductor devices.

A stack package includes a first sub-package, a second sub-package stacked on the first sub-package. The first sub-package is configured to include first and second semiconductor dies, a first flexible bridge die disposed between the first and second semiconductor dies.

One of the purposes of the present invention is to provide a condensation-curable silicone resin composition which show a less increase of the viscosity during handling and cures quickly to provide a cured product which has a very small amount of a remaining catalyst and which has high heat resistance and high light resistance. Thus, the present invention is to provide a condensation-curable silicone composition comprising the following components (A) to (C): (A) 100 parts by mass of an organopolysiloxane which has a branched or network structure and has two or more hydrolyzable groups each bonded to a silicon atom and at least one of (R.sup.1SiO.sub.3/2) and (SiO.sub.4/2) units, wherein R.sup.1 is, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms, (B) 5 to 500 parts by mass of a linear organopolysiloxane having at least one hydrolyzable group bonded to a silicon atom at each of both terminals, and (C) at least one silazane compound represented by the following general formula (3) or (5) or comprising the following units (6) in an amount of 0.02 to 30 parts by mass, relative to total 100 parts by mass of components (A) and (B): ##STR00001##