Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

A flexible semiconductor device includes a first tape having bonding pads and conductive traces formed. A semiconductor die having a bottom surface is attached to the first tape and electrically connected to the bond pads by way of electrical contacts. A second tape is attached to a top surface of the semiconductor die. The first and second tapes encapsulate the semiconductor die, the electrical contacts, and at least a part of the conductive traces.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

An electronic circuit module includes a circuit board, electronic components, an embedding layer, and a conductive film. The circuit board has a first principal surface, a second principal surface and a side surface, and includes a pattern conductor and a via conductor. The conductive film is connected to a conduction path to a ground electrode. The side surface includes a first region, a second region having a longer circumferential length than the first region, and a connection region connecting the first region and the second regions. The conductive film is formed on a region including at least part of each of an outer surface of the embedding layer, the first region, and the connection region. The conductive film formed on at least part of the connection region is connected to an exposed portion in the connection region of the via conductor included in the conduction path to the ground electrode.

A circuit carrier includes a first side, two layers arranged to define an intermediate space there between, with at least one of the two layers being electrically conductive and attached to the first side. The at least one of the two layers has a region deformed such as to exhibit an indentation and has a trace structure in the indentation. A first insulating material fills the intermediate space, and a second insulating material fills the indentation, A second side in opposition to the first side is shaped to have in the deformed region a cut-out for receiving a bare die such as to come into an electrical contact with the at least one of the two layers.

In a described example, a device includes an overcoat layer covering an interconnect; an opening in the overcoat layer exposing a portion of a surface of the interconnect; a stud on the exposed portion of the surface of the interconnect in the opening; a surface of the stud approximately coplanar with a surface of the overcoat layer; and a conductive pillar covering the stud and covering a portion of the overcoat layer surrounding the stud, the conductive pillar having a planar and un-dished surface facing away from the stud and the overcoat layer.

A microelectronic device has a die with a first electrically conductive pillar, and a second electrically conductive pillar, mechanically coupled to the die. The microelectronic device includes a first electrically conductive extended head electrically coupled to the first pillar, and a second electrically conductive extended head electrically coupled to the second pillar. The first pillar and the second pillar have equal compositions of electrically conductive material, as a result of being formed concurrently. Similarly, the first extended head and the second extended head have equal compositions of electrically conductive material, as a result of being formed concurrently. The first extended head provides a bump pad, and the second extended head provides at least a portion of a first plate of an integrated capacitor. A second plate may be located in the die, between the first plate and the die, or on an opposite of the first plate from the die.

Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

The present disclosure relates to a chip on film and a display device. The chip on film includes a body and an insulating protective film arranged on the body, in which the body includes a first area, a first binding area for binding and connecting to the back surface of the display panel, and a first bendable area located between the first area and the first binding area and capable of being bent in a first direction; and the insulating protection film includes a first connection area connected to the first area, a second connection area for connecting to the back surface of the display panel, and a second bendable area located between the first connection area and the second connection area and capable of being bent in a second direction opposite to the first direction.

A semiconductor device includes a first semiconductor chip including a first MOSFET of n-type and a first parasitic diode and a second semiconductor chip including a second MOSFET of n-type and a second parasitic diode. A first source electrode and a first gate wiring are formed on a first front surface of the first semiconductor chip, and a first drain electrode is formed on a first back surface of the first semiconductor chip. A second source electrode and a second gate wiring are formed on a second front surface of the second semiconductor chip, and a second drain electrode is formed on a second back surface of the second semiconductor chip. The first back surface and the second back surface are faced to each other such that the first drain electrode and the second drain electrode are in contact with each other via a conductive tape.